KR100535737B1 - 굽힘가공성이 우수한 고강도 동합금과 그 제조방법 및그것을 사용한 단자ㆍ커넥터 - Google Patents
굽힘가공성이 우수한 고강도 동합금과 그 제조방법 및그것을 사용한 단자ㆍ커넥터 Download PDFInfo
- Publication number
- KR100535737B1 KR100535737B1 KR10-2003-7007183A KR20037007183A KR100535737B1 KR 100535737 B1 KR100535737 B1 KR 100535737B1 KR 20037007183 A KR20037007183 A KR 20037007183A KR 100535737 B1 KR100535737 B1 KR 100535737B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper alloy
- grain size
- workability
- less
- mgs
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000137 annealing Methods 0.000 claims abstract description 81
- 238000005452 bending Methods 0.000 claims abstract description 67
- 238000005097 cold rolling Methods 0.000 claims abstract description 47
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 34
- 239000010974 bronze Substances 0.000 claims abstract description 33
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000013078 crystal Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000005096 rolling process Methods 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 239000002244 precipitate Substances 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- 229910052749 magnesium Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052790 beryllium Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- 229910052758 niobium Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229910052727 yttrium Inorganic materials 0.000 claims description 8
- 229910052726 zirconium Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 238000005275 alloying Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 24
- 238000005728 strengthening Methods 0.000 abstract description 19
- 239000002131 composite material Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 29
- 238000001953 recrystallisation Methods 0.000 description 14
- 238000005482 strain hardening Methods 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000956 alloy Substances 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000006104 solid solution Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000011651 chromium Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910009038 Sn—P Inorganic materials 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910001052 bronze copper alloy Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2000-00400837 | 2000-12-28 | ||
| JP2000400837 | 2000-12-28 | ||
| PCT/JP2001/011483 WO2002053790A1 (fr) | 2000-12-28 | 2001-12-26 | Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030057561A KR20030057561A (ko) | 2003-07-04 |
| KR100535737B1 true KR100535737B1 (ko) | 2005-12-09 |
Family
ID=18865354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7007183A KR100535737B1 (ko) | 2000-12-28 | 2001-12-26 | 굽힘가공성이 우수한 고강도 동합금과 그 제조방법 및그것을 사용한 단자ㆍ커넥터 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20030188814A1 (fr) |
| JP (1) | JP4177104B2 (fr) |
| KR (1) | KR100535737B1 (fr) |
| CN (1) | CN1250756C (fr) |
| TW (1) | TW526272B (fr) |
| WO (1) | WO2002053790A1 (fr) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1862560A4 (fr) * | 2005-03-02 | 2013-09-18 | Furukawa Electric Co Ltd | Alliage de cuivre et procede de production de celui-ci |
| JP5202812B2 (ja) * | 2005-03-02 | 2013-06-05 | 古河電気工業株式会社 | 銅合金とその製造方法 |
| US20070009788A1 (en) * | 2005-07-11 | 2007-01-11 | Indik Auraham A | Battery interface for mobile device |
| JP5170881B2 (ja) * | 2007-03-26 | 2013-03-27 | 古河電気工業株式会社 | 電気・電子機器用銅合金材およびその製造方法 |
| CN102257170A (zh) | 2008-12-19 | 2011-11-23 | 古河电气工业株式会社 | 用于电气电子部件的铜合金材料及其制造方法 |
| CN101580922B (zh) * | 2009-06-21 | 2010-11-24 | 宁波市鄞州锡青铜带制品有限公司 | 直接冷开坯生产锡磷青铜带的方法 |
| WO2013099242A1 (fr) * | 2011-12-28 | 2013-07-04 | Yazaki Corporation | Matériau conducteur ultrafin, conducteur ultrafin, procédé pour la préparation de conducteur ultrafin, et fil électrique ultrafin |
| JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
| CN102982975A (zh) * | 2012-12-04 | 2013-03-20 | 江苏亚威变压器有限公司 | 一种低损耗变压器 |
| CN103509966B (zh) * | 2013-10-18 | 2015-09-09 | 苏州天兼新材料科技有限公司 | 一种适用于航空航天领域的合金材料及其制造方法 |
| US20150115442A1 (en) * | 2013-10-31 | 2015-04-30 | Infineon Technologies Ag | Redistribution layer and method of forming a redistribution layer |
| CN104793718A (zh) * | 2015-05-11 | 2015-07-22 | 赵欣颖 | 便于散热的电脑散热片 |
| CN105845967A (zh) * | 2016-04-05 | 2016-08-10 | 洛阳月星新能源科技有限公司 | 一种散热型锂离子电池模块 |
| CN105936982A (zh) * | 2016-06-13 | 2016-09-14 | 芜湖卓越线束系统有限公司 | 高导电性的线束端子用合金材料及其制备方法 |
| CN106191725B (zh) * | 2016-06-24 | 2018-01-26 | 河南江河机械有限责任公司 | 高强度高导电铜合金纳米相析出工艺方法 |
| CN107604202B (zh) * | 2017-09-18 | 2020-01-21 | 宁波兴业盛泰集团有限公司 | 一种高性能磷青铜带及其制备方法 |
| JP6648088B2 (ja) * | 2017-10-19 | 2020-02-14 | Ｊｘ金属株式会社 | 二次電池負極集電体用圧延銅箔、それを用いた二次電池負極及び二次電池並びに二次電池負極集電体用圧延銅箔の製造方法 |
| CN107604203A (zh) * | 2017-11-16 | 2018-01-19 | 宁波兴业盛泰集团有限公司 | 一种高强度高弹性的锡青铜合金及其固溶工艺 |
| CN107699730A (zh) * | 2017-11-16 | 2018-02-16 | 宁波兴业盛泰集团有限公司 | 一种耐腐蚀的高强度锡铜磷合金及其成形工艺 |
| CN107904436A (zh) * | 2017-12-13 | 2018-04-13 | 浙江灿根智能科技有限公司 | 用于制造快速冲床导套的铜合金及制备方法 |
| CN113981266B (zh) * | 2021-10-25 | 2022-11-25 | 鑫谷和金属(无锡)有限公司 | 一种高性能磷青铜带及其生产工艺 |
| CN114032416A (zh) * | 2021-11-18 | 2022-02-11 | 浙江惟精新材料股份有限公司 | 一种超高强度锡磷青铜及其制备方法 |
| CN114875270B (zh) * | 2022-05-11 | 2023-04-11 | 宁波金田铜业(集团)股份有限公司 | 锡磷青铜合金及其制备方法 |
| CN116287851B (zh) * | 2022-09-09 | 2024-05-14 | 中铝科学技术研究院有限公司 | 锡磷青铜带材、其制备方法及应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3930894A (en) * | 1974-02-25 | 1976-01-06 | Olin Corporation | Method of preparing copper base alloys |
| JPH05279824A (ja) * | 1992-03-30 | 1993-10-26 | Mitsubishi Shindoh Co Ltd | スタンピング金型を摩耗させることの少ない銅合金条材 |
| JPH07331363A (ja) * | 1994-06-01 | 1995-12-19 | Nikko Kinzoku Kk | 高力高導電性銅合金 |
| US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
| US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
| JP2000256814A (ja) * | 1999-03-03 | 2000-09-19 | Sumitomo Metal Mining Co Ltd | 端子用銅基合金条の製造方法 |
| JP2000273561A (ja) * | 1999-03-24 | 2000-10-03 | Sumitomo Metal Mining Co Ltd | 端子用銅基合金及びその製造方法 |
-
2001
- 2001-12-26 JP JP2002554288A patent/JP4177104B2/ja not_active Expired - Fee Related
- 2001-12-26 US US10/380,291 patent/US20030188814A1/en not_active Abandoned
- 2001-12-26 CN CNB018195121A patent/CN1250756C/zh not_active Expired - Fee Related
- 2001-12-26 WO PCT/JP2001/011483 patent/WO2002053790A1/fr active IP Right Grant
- 2001-12-26 KR KR10-2003-7007183A patent/KR100535737B1/ko active IP Right Grant
- 2001-12-26 TW TW090132285A patent/TW526272B/zh active
-
2008
- 2008-04-11 US US12/082,531 patent/US20080210353A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TW526272B (en) | 2003-04-01 |
| CN1476486A (zh) | 2004-02-18 |
| US20080210353A1 (en) | 2008-09-04 |
| JPWO2002053790A1 (ja) | 2004-05-13 |
| WO2002053790A1 (fr) | 2002-07-11 |
| JP4177104B2 (ja) | 2008-11-05 |
| KR20030057561A (ko) | 2003-07-04 |
| US20030188814A1 (en) | 2003-10-09 |
| CN1250756C (zh) | 2006-04-12 |
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