KR100525545B1 - 질화물 반도체 발광소자 및 그 제조방법 - Google Patents
질화물 반도체 발광소자 및 그 제조방법 Download PDFInfo
- Publication number
- KR100525545B1 KR100525545B1 KR10-2003-0041409A KR20030041409A KR100525545B1 KR 100525545 B1 KR100525545 B1 KR 100525545B1 KR 20030041409 A KR20030041409 A KR 20030041409A KR 100525545 B1 KR100525545 B1 KR 100525545B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- gan
- nitride semiconductor
- doped
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
Landscapes
- Led Devices (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0041409A KR100525545B1 (ko) | 2003-06-25 | 2003-06-25 | 질화물 반도체 발광소자 및 그 제조방법 |
| EP04737100.0A EP1636858B1 (en) | 2003-06-25 | 2004-06-21 | Light emitting device using nitride semiconductor and fabrication method of the same |
| US10/517,819 US7193236B2 (en) | 2003-06-25 | 2004-06-21 | Light emitting device using nitride semiconductor and fabrication method of the same |
| JP2005518142A JP2006510234A (ja) | 2003-06-25 | 2004-06-21 | 窒化物半導体の発光素子及びその製造方法 |
| CNB2004800003288A CN100468793C (zh) | 2003-06-25 | 2004-06-21 | 使用氮化物半导体的发光器件和其制造方法 |
| PCT/KR2004/001480 WO2004114421A1 (en) | 2003-06-25 | 2004-06-21 | A light emitting device using nitride semiconductor and fabrication method of the same |
| CN200710196586.3A CN101179106B (zh) | 2003-06-25 | 2004-06-21 | 使用氮化物半导体的发光器件和其制造方法 |
| DE202004021874U DE202004021874U1 (de) | 2003-06-25 | 2004-06-21 | Eine lichtemittierende Vorrichtung unter Verwendung eines Nitridhalbleiters |
| US11/288,310 US7691657B2 (en) | 2003-06-25 | 2005-11-29 | Light emitting device using nitride semiconductor and fabrication method of the same |
| JP2008111431A JP2008182284A (ja) | 2003-06-25 | 2008-04-22 | 窒化物半導体の発光素子及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0041409A KR100525545B1 (ko) | 2003-06-25 | 2003-06-25 | 질화물 반도체 발광소자 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050000846A KR20050000846A (ko) | 2005-01-06 |
| KR100525545B1 true KR100525545B1 (ko) | 2005-10-31 |
Family
ID=36165438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0041409A Expired - Fee Related KR100525545B1 (ko) | 2003-06-25 | 2003-06-25 | 질화물 반도체 발광소자 및 그 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7193236B2 (https=) |
| EP (1) | EP1636858B1 (https=) |
| JP (2) | JP2006510234A (https=) |
| KR (1) | KR100525545B1 (https=) |
| CN (2) | CN100468793C (https=) |
| DE (1) | DE202004021874U1 (https=) |
| WO (1) | WO2004114421A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997908B1 (ko) | 2008-09-10 | 2010-12-02 | 박은현 | 3족 질화물 반도체 발광소자 |
| KR20120052744A (ko) * | 2010-11-16 | 2012-05-24 | 엘지이노텍 주식회사 | 발광소자 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100583163B1 (ko) * | 2002-08-19 | 2006-05-23 | 엘지이노텍 주식회사 | 질화물 반도체 및 그 제조방법 |
| KR100525545B1 (ko) * | 2003-06-25 | 2005-10-31 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| KR100641989B1 (ko) | 2003-10-15 | 2006-11-02 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 |
| KR100661708B1 (ko) | 2004-10-19 | 2006-12-26 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| US20060267043A1 (en) * | 2005-05-27 | 2006-11-30 | Emerson David T | Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices |
| KR100918968B1 (ko) * | 2005-05-30 | 2009-09-25 | 갤럭시아포토닉스 주식회사 | 초접촉층을 구비한 질화갈륨 소자 제작방법 및 그 소자 |
| US7847279B2 (en) * | 2005-07-06 | 2010-12-07 | Lg Innotek Co., Ltd. | Nitride semiconductor LED and fabrication method thereof |
| KR101241477B1 (ko) | 2006-01-27 | 2013-03-08 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조 방법 |
| EP1821347B1 (en) * | 2006-02-16 | 2018-01-03 | LG Electronics Inc. | Light emitting device having vertical structure and method for manufacturing the same |
| US20080149946A1 (en) * | 2006-12-22 | 2008-06-26 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light |
| KR100910365B1 (ko) * | 2007-06-11 | 2009-08-04 | 고려대학교 산학협력단 | 수직형 질화물계 발광소자 및 그 제조방법 |
| JP2009016467A (ja) * | 2007-07-03 | 2009-01-22 | Sony Corp | 窒化ガリウム系半導体素子及びこれを用いた光学装置並びにこれを用いた画像表示装置 |
| KR100864609B1 (ko) * | 2007-07-04 | 2008-10-22 | 우리엘에스티 주식회사 | 화합물 반도체를 이용한 발광소자 |
| US20100123119A1 (en) * | 2008-11-20 | 2010-05-20 | Seoul Opto Device Co., Ltd. | Light emitting diode having indium nitride |
| KR101507130B1 (ko) * | 2008-11-20 | 2015-03-30 | 서울바이오시스 주식회사 | 초격자층을 갖는 발광 다이오드 |
| US8992558B2 (en) | 2008-12-18 | 2015-03-31 | Osteomed, Llc | Lateral access system for the lumbar spine |
| DE102009040438A1 (de) * | 2009-07-24 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper mit einer Quantentopfstruktur |
| KR101285527B1 (ko) * | 2012-05-11 | 2013-07-17 | 엘지전자 주식회사 | 발광 다이오드 |
| KR102014172B1 (ko) * | 2012-08-07 | 2019-08-26 | 엘지이노텍 주식회사 | 자외선 발광 소자 및 발광 소자 패키지 |
| JP6223075B2 (ja) * | 2012-10-09 | 2017-11-01 | キヤノン株式会社 | 発光素子の製造方法及び発光素子 |
| US10969805B2 (en) | 2013-02-11 | 2021-04-06 | Graco Minnesota Inc. | Paint sprayer distributed control and output volume monitoring architectures |
| EP2954504A4 (en) | 2013-02-11 | 2016-10-12 | Graco Minnesota Inc | REMOTE MONITORING FOR A FLUID APPLICATOR SYSTEM |
| FR3003397B1 (fr) * | 2013-03-15 | 2016-07-22 | Soitec Silicon On Insulator | Structures semi-conductrices dotées de régions actives comprenant de l'INGAN |
| TWI626765B (zh) * | 2013-03-15 | 2018-06-11 | 梭意泰科公司 | 具有包含InGaN之作用區域之半導體結構、形成此等半導體結構之方法及由此等半導體結構所形成之發光裝置 |
| DE112014001385T5 (de) * | 2013-03-15 | 2015-12-17 | Soitec | Halbleiterlichtemitterstruktur mit einem aktiven Gebiet, das InGaN enthält, und Verfahren für seine Herstellung |
| TWI593135B (zh) | 2013-03-15 | 2017-07-21 | 索泰克公司 | 具有含氮化銦鎵之主動區域之半導體結構,形成此等半導體結構之方法,以及應用此等半導體結構形成之發光元件 |
| KR102120682B1 (ko) * | 2013-03-15 | 2020-06-17 | 소이텍 | InGaN을 포함하는 활성 영역을 가지는 반도체 구조, 그와 같은 반도체 구조를 형성하는 방법, 및 그와 같은 반도체 구조로부터 형성되는 발광 장치 |
| US9343626B2 (en) | 2013-03-15 | 2016-05-17 | Soitec | Semiconductor structures having active regions comprising InGaN, methods of forming such semiconductor structures, and light emitting devices formed from such semiconductor structures |
| CN103779467A (zh) * | 2014-01-14 | 2014-05-07 | 江苏新广联科技股份有限公司 | 可提高发光效率的外延PGaN层生长结构 |
| CN104300047B (zh) * | 2014-10-11 | 2017-06-23 | 华芯半导体科技有限公司 | 一种Si基GaN的LED结构及其制作方法 |
| CN105355741B (zh) * | 2015-11-02 | 2017-09-29 | 厦门市三安光电科技有限公司 | 一种led外延结构及制作方法 |
| WO2018039228A1 (en) | 2016-08-23 | 2018-03-01 | Stryker European Holdings I, Llc | Instrumentation for the implantation of spinal implants |
| CN106856217A (zh) * | 2016-12-27 | 2017-06-16 | 圆融光电科技股份有限公司 | N型超晶格接触层的生长方法 |
| CN107195736B (zh) * | 2017-05-27 | 2019-12-31 | 华灿光电(浙江)有限公司 | 一种氮化镓基发光二极管外延片及其生长方法 |
| US10372363B2 (en) * | 2017-09-14 | 2019-08-06 | International Business Machines Corporation | Thin provisioning using cloud based ranks |
| JPWO2019188318A1 (ja) * | 2018-03-26 | 2021-04-08 | パナソニック株式会社 | 半導体発光素子 |
| US11191532B2 (en) | 2018-03-30 | 2021-12-07 | Stryker European Operations Holdings Llc | Lateral access retractor and core insertion |
| JP2020021798A (ja) * | 2018-07-31 | 2020-02-06 | 日機装株式会社 | 窒化物半導体発光素子及びその製造方法 |
| WO2020248098A1 (zh) * | 2019-06-10 | 2020-12-17 | 苏州晶湛半导体有限公司 | 半导体结构和半导体结构的制备方法 |
| CN110707187B (zh) * | 2019-08-21 | 2021-01-29 | 华灿光电(苏州)有限公司 | 小间距发光二极管的外延片及其制造方法 |
| US11564674B2 (en) | 2019-11-27 | 2023-01-31 | K2M, Inc. | Lateral access system and method of use |
| TW202201807A (zh) * | 2020-05-19 | 2022-01-01 | 美商瑞克斯姆股份有限公司 | 用於發光元件之應變管理層之組合 |
| CN117457824B (zh) * | 2023-12-25 | 2024-03-12 | 江西兆驰半导体有限公司 | 一种发光二极管外延片及其制备方法 |
| CN117476827B (zh) * | 2023-12-25 | 2024-04-26 | 江西兆驰半导体有限公司 | 一种低接触电阻的发光二极管的外延片及其制备方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2828002B2 (ja) * | 1995-01-19 | 1998-11-25 | 松下電器産業株式会社 | 半導体発光素子およびその製造方法 |
| EP0762516B1 (en) * | 1995-08-28 | 1999-04-21 | Mitsubishi Cable Industries, Ltd. | Group-III nitride based light emitter |
| JPH09232629A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 半導体素子 |
| JPH09304272A (ja) * | 1996-05-10 | 1997-11-28 | Fuji Electric Co Ltd | 液体の吸光度測定装置 |
| JP3753793B2 (ja) * | 1996-06-14 | 2006-03-08 | 豊田合成株式会社 | 3族窒化物化合物半導体発光素子 |
| JPH10189944A (ja) * | 1996-12-24 | 1998-07-21 | Furukawa Electric Co Ltd:The | 高電子移動度トランジスタ |
| US6677619B1 (en) * | 1997-01-09 | 2004-01-13 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| JPH10214999A (ja) * | 1997-01-30 | 1998-08-11 | Toyota Central Res & Dev Lab Inc | Iii−v族窒化物半導体素子 |
| JPH10303458A (ja) * | 1997-04-24 | 1998-11-13 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体素子 |
| US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
| JP3080155B2 (ja) * | 1997-11-05 | 2000-08-21 | サンケン電気株式会社 | 窒化ガリウム半導体層を有する半導体装置及びその製造方法 |
| JP3680558B2 (ja) * | 1998-05-25 | 2005-08-10 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| KR100589621B1 (ko) * | 1998-03-12 | 2006-06-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
| US6194742B1 (en) * | 1998-06-05 | 2001-02-27 | Lumileds Lighting, U.S., Llc | Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices |
| US6608330B1 (en) * | 1998-09-21 | 2003-08-19 | Nichia Corporation | Light emitting device |
| US6153894A (en) * | 1998-11-12 | 2000-11-28 | Showa Denko Kabushiki Kaisha | Group-III nitride semiconductor light-emitting device |
| JP3551101B2 (ja) * | 1999-03-29 | 2004-08-04 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6838705B1 (en) * | 1999-03-29 | 2005-01-04 | Nichia Corporation | Nitride semiconductor device |
| JP3763701B2 (ja) * | 1999-05-17 | 2006-04-05 | 株式会社東芝 | 窒化ガリウム系半導体発光素子 |
| JP3719047B2 (ja) * | 1999-06-07 | 2005-11-24 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3609661B2 (ja) * | 1999-08-19 | 2005-01-12 | 株式会社東芝 | 半導体発光素子 |
| JP3497790B2 (ja) * | 1999-11-29 | 2004-02-16 | 星和電機株式会社 | P型窒化ガリウム系半導体の製造方法及びp型窒化ガリウム系半導体を用いた発光素子 |
| JP2001185493A (ja) * | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 |
| JP3925066B2 (ja) * | 2000-09-28 | 2007-06-06 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| US6906352B2 (en) * | 2001-01-16 | 2005-06-14 | Cree, Inc. | Group III nitride LED with undoped cladding layer and multiple quantum well |
| US6958497B2 (en) * | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
| TW493287B (en) * | 2001-05-30 | 2002-07-01 | Epistar Corp | Light emitting diode structure with non-conductive substrate |
| EP2034530B1 (en) * | 2001-06-15 | 2015-01-21 | Cree, Inc. | GaN based LED formed on a SiC substrate |
| JP2003110197A (ja) * | 2001-09-28 | 2003-04-11 | Toshiba Corp | 窒化物半導体発光装置、窒化物半導体装置及びその製造方法 |
| US6833564B2 (en) * | 2001-11-02 | 2004-12-21 | Lumileds Lighting U.S., Llc | Indium gallium nitride separate confinement heterostructure light emitting devices |
| JP4150527B2 (ja) | 2002-02-27 | 2008-09-17 | 日鉱金属株式会社 | 結晶の製造方法 |
| US6720570B2 (en) * | 2002-04-17 | 2004-04-13 | Tekcore Co., Ltd. | Gallium nitride-based semiconductor light emitting device |
| US7058105B2 (en) * | 2002-10-17 | 2006-06-06 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor optoelectronic device |
| KR100525545B1 (ko) * | 2003-06-25 | 2005-10-31 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
-
2003
- 2003-06-25 KR KR10-2003-0041409A patent/KR100525545B1/ko not_active Expired - Fee Related
-
2004
- 2004-06-21 EP EP04737100.0A patent/EP1636858B1/en not_active Expired - Lifetime
- 2004-06-21 CN CNB2004800003288A patent/CN100468793C/zh not_active Expired - Fee Related
- 2004-06-21 CN CN200710196586.3A patent/CN101179106B/zh not_active Expired - Fee Related
- 2004-06-21 US US10/517,819 patent/US7193236B2/en not_active Expired - Lifetime
- 2004-06-21 DE DE202004021874U patent/DE202004021874U1/de not_active Expired - Lifetime
- 2004-06-21 WO PCT/KR2004/001480 patent/WO2004114421A1/en not_active Ceased
- 2004-06-21 JP JP2005518142A patent/JP2006510234A/ja active Pending
-
2005
- 2005-11-29 US US11/288,310 patent/US7691657B2/en not_active Expired - Lifetime
-
2008
- 2008-04-22 JP JP2008111431A patent/JP2008182284A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997908B1 (ko) | 2008-09-10 | 2010-12-02 | 박은현 | 3족 질화물 반도체 발광소자 |
| KR20120052744A (ko) * | 2010-11-16 | 2012-05-24 | 엘지이노텍 주식회사 | 발광소자 |
| KR101710892B1 (ko) * | 2010-11-16 | 2017-02-28 | 엘지이노텍 주식회사 | 발광소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004114421A1 (en) | 2004-12-29 |
| US20050236631A1 (en) | 2005-10-27 |
| EP1636858A4 (en) | 2007-01-24 |
| JP2006510234A (ja) | 2006-03-23 |
| CN100468793C (zh) | 2009-03-11 |
| US7691657B2 (en) | 2010-04-06 |
| US20060081831A1 (en) | 2006-04-20 |
| CN101179106B (zh) | 2013-01-23 |
| JP2008182284A (ja) | 2008-08-07 |
| CN101179106A (zh) | 2008-05-14 |
| US7193236B2 (en) | 2007-03-20 |
| EP1636858B1 (en) | 2016-11-16 |
| CN1698212A (zh) | 2005-11-16 |
| DE202004021874U1 (de) | 2012-01-18 |
| EP1636858A1 (en) | 2006-03-22 |
| KR20050000846A (ko) | 2005-01-06 |
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