KR100404369B1 - 무전해니켈도금용액및방법 - Google Patents

무전해니켈도금용액및방법 Download PDF

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Publication number
KR100404369B1
KR100404369B1 KR1019960041833A KR19960041833A KR100404369B1 KR 100404369 B1 KR100404369 B1 KR 100404369B1 KR 1019960041833 A KR1019960041833 A KR 1019960041833A KR 19960041833 A KR19960041833 A KR 19960041833A KR 100404369 B1 KR100404369 B1 KR 100404369B1
Authority
KR
South Korea
Prior art keywords
nickel
electroless
workpiece
gold
plating
Prior art date
Application number
KR1019960041833A
Other languages
English (en)
Korean (ko)
Other versions
KR970021373A (ko
Inventor
히로키 우치다
마사유키 기소
다카유키 나카무라
도루 가미타마리
루미코 스즈키
고이치로 시미즈
Original Assignee
우에무라 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우에무라 고교 가부시키가이샤 filed Critical 우에무라 고교 가부시키가이샤
Publication of KR970021373A publication Critical patent/KR970021373A/ko
Application granted granted Critical
Publication of KR100404369B1 publication Critical patent/KR100404369B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1019960041833A 1995-10-23 1996-09-24 무전해니켈도금용액및방법 KR100404369B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-299186 1995-10-23
JP29918695 1995-10-23

Publications (2)

Publication Number Publication Date
KR970021373A KR970021373A (ko) 1997-05-28
KR100404369B1 true KR100404369B1 (ko) 2004-03-20

Family

ID=17869263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960041833A KR100404369B1 (ko) 1995-10-23 1996-09-24 무전해니켈도금용액및방법

Country Status (3)

Country Link
KR (1) KR100404369B1 (de)
DE (1) DE19639174C5 (de)
TW (1) TW390915B (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839930B1 (ko) * 2007-02-15 2008-06-20 주식회사 단양솔텍 전자파 차폐용 비금속재의 도금 방법 및 이에 의해 도금된전자파 차폐용 비금속재
WO2015194878A1 (ko) * 2014-06-19 2015-12-23 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법
KR20150145446A (ko) * 2014-06-19 2015-12-30 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19733991A1 (de) * 1997-08-06 1999-02-11 Doduco Gmbh Reduktives Ni-Bad
US20020002128A1 (en) 2000-03-01 2002-01-03 Gernon Michael D. Aqueous solutions containing dithionic acid and/or metal dithionate
EP2551375A1 (de) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Stromlose Vernickelungsbadzusammensetzung
CN110527992A (zh) * 2019-09-27 2019-12-03 广州皓悦新材料科技有限公司 一种化学镀镍镀液
CN114875392A (zh) * 2022-05-11 2022-08-09 深圳市松柏实业发展有限公司 活化液及其使用方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
DE2028950B2 (de) * 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
US3782978A (en) * 1971-07-06 1974-01-01 Shipley Co Electroless nickel plating
US4128691A (en) * 1974-02-21 1978-12-05 Fuji Photo Film Co., Ltd. Process for the production of a magnetic recording medium
JPS5151908A (de) * 1974-11-01 1976-05-07 Fuji Photo Film Co Ltd
US4169171A (en) * 1977-11-07 1979-09-25 Harold Narcus Bright electroless plating process and plated articles produced thereby
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
JP3353960B2 (ja) * 1993-04-23 2002-12-09 イビデン株式会社 プリント配線板のボンディングパッド及び導体パターンの無電解金メッキ方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839930B1 (ko) * 2007-02-15 2008-06-20 주식회사 단양솔텍 전자파 차폐용 비금속재의 도금 방법 및 이에 의해 도금된전자파 차폐용 비금속재
WO2015194878A1 (ko) * 2014-06-19 2015-12-23 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법
KR20150145446A (ko) * 2014-06-19 2015-12-30 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법
KR101595757B1 (ko) * 2014-06-19 2016-02-19 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법
CN106463376A (zh) * 2014-06-19 2017-02-22 汉阳大学校Erica产学协力团 硅基板的表面剥离方法
CN106463376B (zh) * 2014-06-19 2019-09-27 汉阳大学校Erica产学协力团 硅基板的表面剥离方法

Also Published As

Publication number Publication date
KR970021373A (ko) 1997-05-28
DE19639174C5 (de) 2009-11-05
TW390915B (en) 2000-05-21
DE19639174A1 (de) 1997-04-24
DE19639174B4 (de) 2006-11-09

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