KR970021373A - 무전해 니켈도금용액 및 방법 - Google Patents
무전해 니켈도금용액 및 방법 Download PDFInfo
- Publication number
- KR970021373A KR970021373A KR1019960041833A KR19960041833A KR970021373A KR 970021373 A KR970021373 A KR 970021373A KR 1019960041833 A KR1019960041833 A KR 1019960041833A KR 19960041833 A KR19960041833 A KR 19960041833A KR 970021373 A KR970021373 A KR 970021373A
- Authority
- KR
- South Korea
- Prior art keywords
- workpiece
- electroless
- nickel
- nickel plating
- immersing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
수용성 니켈염, 환원제 및 착화제로 이루어진 무전해 니켈도금용액에 S-S결합을 갖는 화합물, 예컨대 티오황산염, 디티온산염 졸리티온산염 및 아디티온산염을 첨가한다. 또한 본 발명은 무전해 니켈도금 욕에 워크피스를 침지하여 워크피스상에 니켈피막을 화학적으로 부착하는 단계 및 무전해 금도금 욕에 니켈도금된 워크피스를 침지하여, 워크피스상에 금피막을 화학적으로 부착하는 단계로 이루어진 하이빌드 무전해 금도금 방법을 제공한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 화학적으로 부착된 니켈피막에 금피막을 화학적으로 부착시킬 경우. 도금시간의 함수로서 금피막의 두께를 나타내는 그래프이다.
제2도는 니켈피막을 통과 연장하는 핀홀을 나타내고 니켈피막과 금피막을 포함하는 워크피스(workpiece)상의 피막구조의 도식적인 단면도이다.
제3도는 니켈피막을 통과 연장하는 핀흘을 나타내고 니켈하부피막, 니켈피막 및 금 피막을 포함하는 워크피스상의 피막구조의 도식적인 단면도이다.
Claims (6)
- 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 것을 특징으로 하는 무전해 니켈도금용액.
- 제1항에 있어서, S-S결합을 갖는 화합물이 티오황산염, 디티온산염, 폴리티온산염 및 아디티온산염으로 구성된 군으로부터 선택되는 것을 특징으로 하는 무전해 니켈도금용액.
- 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 무전해 니켈 도금 욕에 워크피스를 침지하여, 워크피스상에 니켈피막을 화학적으로 부착시키는 단계로 이루어지는 것을 특징으로 하는 무전해 니켈도금 방법.
- 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 무전해 니켈 도금 욕에 워크피스를 침지하여, 워크피스상에 니켈피막을 화학적으로 부착하는 단계, 및 무전해 금도금 욕에 니켈도금된 워크피스를 침지하여 워크피스상에 금피막을 화학적으로 부착하는 단계로 이루어진 것을 특징으로 하는 하이빌드 무전해 금도금 방법.
- 제4항에 있어서, S-S결합을 갖는 화할물을 함유하는 무전해 니켈도금 욕에 워크피스를 침지하는 단계전에, S-S결합을 갖는 화합물이 없는 무전해 니켈도금 욕에 워크피스를 침지하는 단계전에, S-S결합을 갖는 화합물이 없는 무전해 니켈도금 욕에 워크피스를 침지하여, 워크피스상에 니켈하부피막을 화학적으로 부착하는 단계를 더 포함하는 것을 특징으로 하는 하이빌드 무전해 금도금 방법.
- 제4항 또는 제5항에 있어서, 상기 무전해 금도금 욕이 금원료로서 시안화금염을 함유하고, pH4 내지 9인 것을 특징으로 하는 하이빌드 무전해 금도금 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-299186 | 1995-10-23 | ||
JP29918695 | 1995-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970021373A true KR970021373A (ko) | 1997-05-28 |
KR100404369B1 KR100404369B1 (ko) | 2004-03-20 |
Family
ID=17869263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960041833A KR100404369B1 (ko) | 1995-10-23 | 1996-09-24 | 무전해니켈도금용액및방법 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100404369B1 (ko) |
DE (1) | DE19639174C5 (ko) |
TW (1) | TW390915B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19733991A1 (de) * | 1997-08-06 | 1999-02-11 | Doduco Gmbh | Reduktives Ni-Bad |
US20020002128A1 (en) | 2000-03-01 | 2002-01-03 | Gernon Michael D. | Aqueous solutions containing dithionic acid and/or metal dithionate |
KR100839930B1 (ko) * | 2007-02-15 | 2008-06-20 | 주식회사 단양솔텍 | 전자파 차폐용 비금속재의 도금 방법 및 이에 의해 도금된전자파 차폐용 비금속재 |
EP2551375A1 (en) * | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
CN106463376B (zh) * | 2014-06-19 | 2019-09-27 | 汉阳大学校Erica产学协力团 | 硅基板的表面剥离方法 |
KR101595757B1 (ko) * | 2014-06-19 | 2016-02-19 | 한양대학교 에리카산학협력단 | 실리콘 기판의 표면 박리 방법 |
CN110527992A (zh) * | 2019-09-27 | 2019-12-03 | 广州皓悦新材料科技有限公司 | 一种化学镀镍镀液 |
CN114875392A (zh) * | 2022-05-11 | 2022-08-09 | 深圳市松柏实业发展有限公司 | 活化液及其使用方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2762723A (en) * | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
DE2028950B2 (de) * | 1970-06-12 | 1976-05-13 | Shipley Co., Inc., Newton, Mass. (V.SLA.) | Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon |
US3782978A (en) * | 1971-07-06 | 1974-01-01 | Shipley Co | Electroless nickel plating |
US4128691A (en) * | 1974-02-21 | 1978-12-05 | Fuji Photo Film Co., Ltd. | Process for the production of a magnetic recording medium |
JPS5151908A (ko) * | 1974-11-01 | 1976-05-07 | Fuji Photo Film Co Ltd | |
US4169171A (en) * | 1977-11-07 | 1979-09-25 | Harold Narcus | Bright electroless plating process and plated articles produced thereby |
US4699811A (en) * | 1986-09-16 | 1987-10-13 | Macdermid, Incorporated | Chromium mask for electroless nickel or copper plating |
JP3353960B2 (ja) * | 1993-04-23 | 2002-12-09 | イビデン株式会社 | プリント配線板のボンディングパッド及び導体パターンの無電解金メッキ方法 |
-
1996
- 1996-09-19 TW TW085111474A patent/TW390915B/zh active
- 1996-09-24 DE DE19639174A patent/DE19639174C5/de not_active Expired - Fee Related
- 1996-09-24 KR KR1019960041833A patent/KR100404369B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100404369B1 (ko) | 2004-03-20 |
DE19639174C5 (de) | 2009-11-05 |
TW390915B (en) | 2000-05-21 |
DE19639174A1 (de) | 1997-04-24 |
DE19639174B4 (de) | 2006-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE8201309L (sv) | Vattenhaltig komposition for stromfri pletering av guld | |
KR960023235A (ko) | 무전해 도금법에서의 촉매화 방법 | |
JPH0949085A (ja) | 無電解黒色めっき浴組成と皮膜の形成方法 | |
KR870004163A (ko) | 무전해 금 도금액 | |
KR970021373A (ko) | 무전해 니켈도금용액 및 방법 | |
KR940009364A (ko) | 철 도금 알루미늄 합금 부품 및 그 도금 방법 | |
CA2023871A1 (en) | Electrodeposition of palladium films | |
WO1991002110A1 (en) | Treatment to reduce solder plating whisker formation | |
NO903868D0 (no) | Galvanisk gull-legeringsbad. | |
GB1426462A (en) | Process and composition for sensitizing articles for metallization | |
EP0361705A3 (en) | Gold plating bath and method | |
CA2086341C (en) | Combination of aqueous baths for the non-electrical deposition of gold | |
KR900001885A (ko) | 내충격밀착성이 우수한 Za-Ni합금도금강판 및 그 제조방법 | |
KR930009046A (ko) | 리드프레임 | |
DE3463528D1 (en) | Process for the deposition of low carat brilliant gold-silver alloy coatings | |
FR2455096A1 (fr) | Bain d'electrodeposition d'un alliage d'or blanc, son application a l'obtention d'un depot electrolytique et le depot obtenu | |
SE8205087L (sv) | Forfarande for hojning av korrosionsbestendigheten hos en galvaniskt avskild palladium/nickel-legering | |
DE50001514D1 (de) | Verfahren zur herstellung einer cyanidfreien, für galvanische gold-bäder geeigneten goldverbindungslösung | |
JPS62218594A (ja) | 金めつき用前処理液および金めつき液 | |
KR940015077A (ko) | 전자파 차폐성이 우수한 무전해 도금섬유의 제조방법 | |
JPS57145351A (en) | Lead frame for semiconductor | |
KR960037864A (ko) | 인산염 처리성이 우수한 아연-망간 이층도금강판 제조방법 | |
Emonnot | Chemical deposition of precious metals | |
KR910016969A (ko) | 아연-실리카 복합전기 도금강판의 제조방법 | |
DD299382A7 (de) | Chemisch-reduktive gold-elektrolyt-kombination und verfahren zur goldabscheidung unter verwendung dieser kombination |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130813 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20140819 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20150820 Year of fee payment: 13 |
|
EXPY | Expiration of term |