KR970021373A - 무전해 니켈도금용액 및 방법 - Google Patents

무전해 니켈도금용액 및 방법 Download PDF

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Publication number
KR970021373A
KR970021373A KR1019960041833A KR19960041833A KR970021373A KR 970021373 A KR970021373 A KR 970021373A KR 1019960041833 A KR1019960041833 A KR 1019960041833A KR 19960041833 A KR19960041833 A KR 19960041833A KR 970021373 A KR970021373 A KR 970021373A
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South Korea
Prior art keywords
workpiece
electroless
nickel
nickel plating
immersing
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KR1019960041833A
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English (en)
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KR100404369B1 (ko
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히로키 우치다
마사유키 기소
다카유키 나카무라
도루 가미타마리
루미코 스스키
고이치로 시미즈
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우에무라 아키히도
우에무라 고교 가부시키가이샤
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Publication of KR970021373A publication Critical patent/KR970021373A/ko
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Publication of KR100404369B1 publication Critical patent/KR100404369B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

수용성 니켈염, 환원제 및 착화제로 이루어진 무전해 니켈도금용액에 S-S결합을 갖는 화합물, 예컨대 티오황산염, 디티온산염 졸리티온산염 및 아디티온산염을 첨가한다. 또한 본 발명은 무전해 니켈도금 욕에 워크피스를 침지하여 워크피스상에 니켈피막을 화학적으로 부착하는 단계 및 무전해 금도금 욕에 니켈도금된 워크피스를 침지하여, 워크피스상에 금피막을 화학적으로 부착하는 단계로 이루어진 하이빌드 무전해 금도금 방법을 제공한다.

Description

무전해 니켈도금용액 및 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 화학적으로 부착된 니켈피막에 금피막을 화학적으로 부착시킬 경우. 도금시간의 함수로서 금피막의 두께를 나타내는 그래프이다.
제2도는 니켈피막을 통과 연장하는 핀홀을 나타내고 니켈피막과 금피막을 포함하는 워크피스(workpiece)상의 피막구조의 도식적인 단면도이다.
제3도는 니켈피막을 통과 연장하는 핀흘을 나타내고 니켈하부피막, 니켈피막 및 금 피막을 포함하는 워크피스상의 피막구조의 도식적인 단면도이다.

Claims (6)

  1. 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 것을 특징으로 하는 무전해 니켈도금용액.
  2. 제1항에 있어서, S-S결합을 갖는 화합물이 티오황산염, 디티온산염, 폴리티온산염 및 아디티온산염으로 구성된 군으로부터 선택되는 것을 특징으로 하는 무전해 니켈도금용액.
  3. 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 무전해 니켈 도금 욕에 워크피스를 침지하여, 워크피스상에 니켈피막을 화학적으로 부착시키는 단계로 이루어지는 것을 특징으로 하는 무전해 니켈도금 방법.
  4. 수용성 니켈염, 환원제, 착화제 및 S-S결합을 갖는 화합물로 이루어지는 무전해 니켈 도금 욕에 워크피스를 침지하여, 워크피스상에 니켈피막을 화학적으로 부착하는 단계, 및 무전해 금도금 욕에 니켈도금된 워크피스를 침지하여 워크피스상에 금피막을 화학적으로 부착하는 단계로 이루어진 것을 특징으로 하는 하이빌드 무전해 금도금 방법.
  5. 제4항에 있어서, S-S결합을 갖는 화할물을 함유하는 무전해 니켈도금 욕에 워크피스를 침지하는 단계전에, S-S결합을 갖는 화합물이 없는 무전해 니켈도금 욕에 워크피스를 침지하는 단계전에, S-S결합을 갖는 화합물이 없는 무전해 니켈도금 욕에 워크피스를 침지하여, 워크피스상에 니켈하부피막을 화학적으로 부착하는 단계를 더 포함하는 것을 특징으로 하는 하이빌드 무전해 금도금 방법.
  6. 제4항 또는 제5항에 있어서, 상기 무전해 금도금 욕이 금원료로서 시안화금염을 함유하고, pH4 내지 9인 것을 특징으로 하는 하이빌드 무전해 금도금 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960041833A 1995-10-23 1996-09-24 무전해니켈도금용액및방법 KR100404369B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-299186 1995-10-23
JP29918695 1995-10-23

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KR970021373A true KR970021373A (ko) 1997-05-28
KR100404369B1 KR100404369B1 (ko) 2004-03-20

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KR (1) KR100404369B1 (ko)
DE (1) DE19639174C5 (ko)
TW (1) TW390915B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19733991A1 (de) * 1997-08-06 1999-02-11 Doduco Gmbh Reduktives Ni-Bad
US20020002128A1 (en) 2000-03-01 2002-01-03 Gernon Michael D. Aqueous solutions containing dithionic acid and/or metal dithionate
KR100839930B1 (ko) * 2007-02-15 2008-06-20 주식회사 단양솔텍 전자파 차폐용 비금속재의 도금 방법 및 이에 의해 도금된전자파 차폐용 비금속재
EP2551375A1 (en) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Electroless nickel plating bath composition
KR101595757B1 (ko) * 2014-06-19 2016-02-19 한양대학교 에리카산학협력단 실리콘 기판의 표면 박리 방법
CN106463376B (zh) * 2014-06-19 2019-09-27 汉阳大学校Erica产学协力团 硅基板的表面剥离方法
CN110527992A (zh) * 2019-09-27 2019-12-03 广州皓悦新材料科技有限公司 一种化学镀镍镀液
CN114875392A (zh) * 2022-05-11 2022-08-09 深圳市松柏实业发展有限公司 活化液及其使用方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
DE2028950B2 (de) * 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
US3782978A (en) * 1971-07-06 1974-01-01 Shipley Co Electroless nickel plating
US4128691A (en) * 1974-02-21 1978-12-05 Fuji Photo Film Co., Ltd. Process for the production of a magnetic recording medium
JPS5151908A (ko) * 1974-11-01 1976-05-07 Fuji Photo Film Co Ltd
US4169171A (en) * 1977-11-07 1979-09-25 Harold Narcus Bright electroless plating process and plated articles produced thereby
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
JP3353960B2 (ja) * 1993-04-23 2002-12-09 イビデン株式会社 プリント配線板のボンディングパッド及び導体パターンの無電解金メッキ方法

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DE19639174B4 (de) 2006-11-09
TW390915B (en) 2000-05-21
KR100404369B1 (ko) 2004-03-20
DE19639174A1 (de) 1997-04-24
DE19639174C5 (de) 2009-11-05

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