KR100332719B1 - 웨이퍼수납박스내의웨이퍼배스킷 - Google Patents

웨이퍼수납박스내의웨이퍼배스킷 Download PDF

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Publication number
KR100332719B1
KR100332719B1 KR1019950016073A KR19950016073A KR100332719B1 KR 100332719 B1 KR100332719 B1 KR 100332719B1 KR 1019950016073 A KR1019950016073 A KR 1019950016073A KR 19950016073 A KR19950016073 A KR 19950016073A KR 100332719 B1 KR100332719 B1 KR 100332719B1
Authority
KR
South Korea
Prior art keywords
wafer
basket
groove
device stage
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950016073A
Other languages
English (en)
Korean (ko)
Other versions
KR960002468A (ko
Inventor
호소이마사또
Original Assignee
신에쯔 한도타이 가부시키가이샤
신에츠 포리마 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤, 신에츠 포리마 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR960002468A publication Critical patent/KR960002468A/ko
Application granted granted Critical
Publication of KR100332719B1 publication Critical patent/KR100332719B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1019950016073A 1994-06-17 1995-06-16 웨이퍼수납박스내의웨이퍼배스킷 Expired - Fee Related KR100332719B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-158228 1994-06-17
JP6158228A JP2791971B2 (ja) 1994-06-17 1994-06-17 ウェーハ収納容器におけるウェーハバスケット

Publications (2)

Publication Number Publication Date
KR960002468A KR960002468A (ko) 1996-01-26
KR100332719B1 true KR100332719B1 (ko) 2002-10-31

Family

ID=15667084

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950016073A Expired - Fee Related KR100332719B1 (ko) 1994-06-17 1995-06-16 웨이퍼수납박스내의웨이퍼배스킷

Country Status (6)

Country Link
JP (1) JP2791971B2 (enrdf_load_stackoverflow)
KR (1) KR100332719B1 (enrdf_load_stackoverflow)
DE (1) DE19521575C2 (enrdf_load_stackoverflow)
FR (1) FR2725185B1 (enrdf_load_stackoverflow)
GB (1) GB2290414B (enrdf_load_stackoverflow)
TW (1) TW299485B (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (enrdf_load_stackoverflow) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
GB2350604A (en) * 1999-06-03 2000-12-06 Horizon Biscuit Company Ltd Th Container
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern
DE10104313C1 (de) * 2001-01-22 2002-08-08 Hunke & Jochheim Aufbewahrungsbehälter für Kassetten
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
TWI239931B (en) 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
DE10337570A1 (de) * 2003-08-14 2005-03-17 Infineon Technologies Ag Transportvorrichtung
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
CN102339777B (zh) * 2010-07-15 2013-09-11 家登精密工业股份有限公司 晶圆盒的晶圆限制件
DE102010040918B4 (de) 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Behälter zum Stapeln und Transportieren von Scheiben aus brüchigem Material
JP5652540B2 (ja) 2011-02-28 2015-01-14 株式会社タンガロイ ガイドパッド、切削工具本体および切削工具
EP2682212B1 (en) 2011-02-28 2020-10-07 Tungaloy Corporation Guide pad and cutting tool
KR101658631B1 (ko) 2014-04-03 2016-09-22 형제기계공업 주식회사 격벽을 이용한 제설장치
CN106784145B (zh) * 2016-12-23 2018-03-06 中赣新能源股份有限公司 一种硅片插片方法
CN116936432B (zh) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 一种晶圆收纳盒、使用该收纳盒的取放装置及取放方法
CN119364745B (zh) * 2024-12-26 2025-04-01 深圳市奔强电路有限公司 一种电路板加工用堆叠电路板输送装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648126A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Auxiliary carrier for replacing wafers
JPS60160539U (ja) * 1984-04-02 1985-10-25 ソニー株式会社 半導体ウエハ等収納容器
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
JPH0284319U (enrdf_load_stackoverflow) * 1988-12-20 1990-06-29
US5154301A (en) * 1991-09-12 1992-10-13 Fluoroware, Inc. Wafer carrier
US5351836A (en) * 1992-07-08 1994-10-04 Daifuku Co., Ltd. Container for plate-like objects

Also Published As

Publication number Publication date
GB2290414B (en) 1998-07-29
FR2725185B1 (fr) 1997-10-17
DE19521575C2 (de) 2002-04-18
GB2290414A (en) 1995-12-20
FR2725185A1 (fr) 1996-04-05
GB9512022D0 (en) 1995-08-09
TW299485B (enrdf_load_stackoverflow) 1997-03-01
JP2791971B2 (ja) 1998-08-27
DE19521575A1 (de) 1995-12-21
KR960002468A (ko) 1996-01-26
JPH088332A (ja) 1996-01-12

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