TW299485B - - Google Patents

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Publication number
TW299485B
TW299485B TW084105930A TW84105930A TW299485B TW 299485 B TW299485 B TW 299485B TW 084105930 A TW084105930 A TW 084105930A TW 84105930 A TW84105930 A TW 84105930A TW 299485 B TW299485 B TW 299485B
Authority
TW
Taiwan
Prior art keywords
wafer
basket
side wall
round
crystal
Prior art date
Application number
TW084105930A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shinetsu Handotai Co Ltd
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Co Ltd, Shinetsu Polymer Co filed Critical Shinetsu Handotai Co Ltd
Application granted granted Critical
Publication of TW299485B publication Critical patent/TW299485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW084105930A 1994-06-17 1995-06-10 TW299485B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6158228A JP2791971B2 (ja) 1994-06-17 1994-06-17 ウェーハ収納容器におけるウェーハバスケット

Publications (1)

Publication Number Publication Date
TW299485B true TW299485B (enrdf_load_stackoverflow) 1997-03-01

Family

ID=15667084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105930A TW299485B (enrdf_load_stackoverflow) 1994-06-17 1995-06-10

Country Status (6)

Country Link
JP (1) JP2791971B2 (enrdf_load_stackoverflow)
KR (1) KR100332719B1 (enrdf_load_stackoverflow)
DE (1) DE19521575C2 (enrdf_load_stackoverflow)
FR (1) FR2725185B1 (enrdf_load_stackoverflow)
GB (1) GB2290414B (enrdf_load_stackoverflow)
TW (1) TW299485B (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (enrdf_load_stackoverflow) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
GB2350604A (en) * 1999-06-03 2000-12-06 Horizon Biscuit Company Ltd Th Container
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern
DE10104313C1 (de) * 2001-01-22 2002-08-08 Hunke & Jochheim Aufbewahrungsbehälter für Kassetten
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
TWI239931B (en) 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
DE10337570A1 (de) * 2003-08-14 2005-03-17 Infineon Technologies Ag Transportvorrichtung
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
CN102339777B (zh) * 2010-07-15 2013-09-11 家登精密工业股份有限公司 晶圆盒的晶圆限制件
DE102010040918B4 (de) * 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Behälter zum Stapeln und Transportieren von Scheiben aus brüchigem Material
EP2682211A1 (en) 2011-02-28 2014-01-08 Tungaloy Corporation Guide pad, cutting tool body, and cutting tool
CN103402677B (zh) 2011-02-28 2015-11-25 株式会社钨钛合金 导向块、切削工具主体以及切削工具
KR101658631B1 (ko) 2014-04-03 2016-09-22 형제기계공업 주식회사 격벽을 이용한 제설장치
CN106784145B (zh) * 2016-12-23 2018-03-06 中赣新能源股份有限公司 一种硅片插片方法
CN116936432B (zh) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 一种晶圆收纳盒、使用该收纳盒的取放装置及取放方法
CN119364745B (zh) * 2024-12-26 2025-04-01 深圳市奔强电路有限公司 一种电路板加工用堆叠电路板输送装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648126A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Auxiliary carrier for replacing wafers
JPS60160539U (ja) * 1984-04-02 1985-10-25 ソニー株式会社 半導体ウエハ等収納容器
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
JPH0284319U (enrdf_load_stackoverflow) * 1988-12-20 1990-06-29
US5154301A (en) * 1991-09-12 1992-10-13 Fluoroware, Inc. Wafer carrier
ATE147045T1 (de) * 1992-07-08 1997-01-15 Daifuku Kk Behälter für scheibenähnliche gegenstände

Also Published As

Publication number Publication date
DE19521575A1 (de) 1995-12-21
KR960002468A (ko) 1996-01-26
JPH088332A (ja) 1996-01-12
DE19521575C2 (de) 2002-04-18
GB9512022D0 (en) 1995-08-09
JP2791971B2 (ja) 1998-08-27
KR100332719B1 (ko) 2002-10-31
GB2290414B (en) 1998-07-29
FR2725185B1 (fr) 1997-10-17
GB2290414A (en) 1995-12-20
FR2725185A1 (fr) 1996-04-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees