KR100306087B1 - 세정장치 - Google Patents

세정장치 Download PDF

Info

Publication number
KR100306087B1
KR100306087B1 KR1019930030041A KR930030041A KR100306087B1 KR 100306087 B1 KR100306087 B1 KR 100306087B1 KR 1019930030041 A KR1019930030041 A KR 1019930030041A KR 930030041 A KR930030041 A KR 930030041A KR 100306087 B1 KR100306087 B1 KR 100306087B1
Authority
KR
South Korea
Prior art keywords
rectifying
cleaning
holes
substrate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930030041A
Other languages
English (en)
Korean (ko)
Other versions
KR940016548A (ko
Inventor
요코미조겐지
다시마지하야
무카이에이이치
혼다요시유키
하라무라나오히코
무라카미신야
쵸노야스히로
Original Assignee
다카시마 히로시
도오교오에레구토론큐우슈우가부시끼가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다카시마 히로시, 도오교오에레구토론큐우슈우가부시끼가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 다카시마 히로시
Publication of KR940016548A publication Critical patent/KR940016548A/ko
Application granted granted Critical
Publication of KR100306087B1 publication Critical patent/KR100306087B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1019930030041A 1992-12-26 1993-12-27 세정장치 Expired - Fee Related KR100306087B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-358224 1992-12-26
JP04358224A JP3118739B2 (ja) 1992-12-26 1992-12-26 洗浄装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1019980017968A Division KR19990066686A (ko) 1992-12-26 1998-05-19 세정처리장치
KR1019980017969A Division KR19990066687A (ko) 1992-12-26 1998-05-19 세정장치

Publications (2)

Publication Number Publication Date
KR940016548A KR940016548A (ko) 1994-07-23
KR100306087B1 true KR100306087B1 (ko) 2001-11-30

Family

ID=18458186

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1019930030041A Expired - Fee Related KR100306087B1 (ko) 1992-12-26 1993-12-27 세정장치
KR1019980017969A Ceased KR19990066687A (ko) 1992-12-26 1998-05-19 세정장치
KR1019980017968A Ceased KR19990066686A (ko) 1992-12-26 1998-05-19 세정처리장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1019980017969A Ceased KR19990066687A (ko) 1992-12-26 1998-05-19 세정장치
KR1019980017968A Ceased KR19990066686A (ko) 1992-12-26 1998-05-19 세정처리장치

Country Status (3)

Country Link
JP (1) JP3118739B2 (enExample)
KR (3) KR100306087B1 (enExample)
TW (1) TW238401B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328481B2 (ja) * 1995-10-13 2002-09-24 東京エレクトロン株式会社 処理方法および装置
KR101425813B1 (ko) * 2012-12-24 2014-08-05 주식회사 케이씨텍 웨이퍼의 침지식 세정 건조 장치
KR102137876B1 (ko) * 2018-08-29 2020-08-13 이한주 개폐식 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
JP3118739B2 (ja) 2000-12-18
TW238401B (enExample) 1995-01-11
JPH06204199A (ja) 1994-07-22
KR940016548A (ko) 1994-07-23
KR19990066686A (ko) 1999-08-16
KR19990066687A (ko) 1999-08-16

Similar Documents

Publication Publication Date Title
US5327921A (en) Processing vessel for a wafer washing system
US5503171A (en) Substrates-washing apparatus
EP0854499B1 (en) Substrate transporting and processing system
US5370142A (en) Substrate washing device
KR100433330B1 (ko) 기판세정방법및기판세정장치
KR100357316B1 (ko) 기판 건조장치 및 기판 건조방법
KR100304145B1 (ko) 반송척의세정장치
KR100190539B1 (ko) 세정처리장치
KR102414340B1 (ko) 반도체 웨이퍼를 세정하기 위한 방법 및 장치
KR20220088561A (ko) 처리액 공급 장치 및 처리액 공급 방법
JP2002305134A (ja) 現像処理装置
KR100306087B1 (ko) 세정장치
KR102683731B1 (ko) 기판 처리 장치 및 방법
JP3177729B2 (ja) 処理装置
JP3127073B2 (ja) 洗浄装置及び洗浄方法
JP3200291B2 (ja) 洗浄装置
KR101757820B1 (ko) 포토 마스크 처리 장치
JP3008001B2 (ja) 洗浄処理装置
JP2970894B2 (ja) 洗浄装置
JP3003017B2 (ja) 洗浄処理装置
JP3172023B2 (ja) 洗浄装置
JP2840799B2 (ja) 枚葉式洗浄方法及び装置
JPH07176506A (ja) 洗浄処理装置および洗浄処理方法
JP3682157B2 (ja) 基板処理装置
JP3013909B2 (ja) 洗浄装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20090724

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100807

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100807

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000