TW238401B - - Google Patents

Info

Publication number
TW238401B
TW238401B TW082111074A TW82111074A TW238401B TW 238401 B TW238401 B TW 238401B TW 082111074 A TW082111074 A TW 082111074A TW 82111074 A TW82111074 A TW 82111074A TW 238401 B TW238401 B TW 238401B
Authority
TW
Taiwan
Application number
TW082111074A
Inventor
Chouno Yasuhiro
Original Assignee
Tokyo Electron Co Ltd
Tokyo Electron Kyushu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tokyo Electron Kyushu Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW238401B publication Critical patent/TW238401B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
TW082111074A 1992-12-26 1993-12-28 TW238401B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04358224A JP3118739B2 (ja) 1992-12-26 1992-12-26 洗浄装置

Publications (1)

Publication Number Publication Date
TW238401B true TW238401B (zh) 1995-01-11

Family

ID=18458186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082111074A TW238401B (zh) 1992-12-26 1993-12-28

Country Status (3)

Country Link
JP (1) JP3118739B2 (zh)
KR (3) KR100306087B1 (zh)
TW (1) TW238401B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328481B2 (ja) * 1995-10-13 2002-09-24 東京エレクトロン株式会社 処理方法および装置
KR101425813B1 (ko) * 2012-12-24 2014-08-05 주식회사 케이씨텍 웨이퍼의 침지식 세정 건조 장치
KR102137876B1 (ko) * 2018-08-29 2020-08-13 이한주 개폐식 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
KR100306087B1 (ko) 2001-11-30
JP3118739B2 (ja) 2000-12-18
KR19990066687A (ko) 1999-08-16
KR19990066686A (ko) 1999-08-16
KR940016548A (ko) 1994-07-23
JPH06204199A (ja) 1994-07-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees