KR100278594B1 - - Google Patents
Info
- Publication number
- KR100278594B1 KR100278594B1 KR19970037541A KR19970037541A KR100278594B1 KR 100278594 B1 KR100278594 B1 KR 100278594B1 KR 19970037541 A KR19970037541 A KR 19970037541A KR 19970037541 A KR19970037541 A KR 19970037541A KR 100278594 B1 KR100278594 B1 KR 100278594B1
- Authority
- KR
- South Korea
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T156/1062—Prior to assembly
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- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP20687496 | 1996-08-06 |
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EP (1) | EP0824270B1 (ko) |
JP (3) | JP3928753B2 (ko) |
KR (1) | KR100278594B1 (ko) |
CN (1) | CN1098617C (ko) |
DE (1) | DE69727014T2 (ko) |
TW (1) | TW428259B (ko) |
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-
1997
- 1997-07-22 JP JP19568797A patent/JP3928753B2/ja not_active Expired - Lifetime
- 1997-08-02 TW TW086111049A patent/TW428259B/zh not_active IP Right Cessation
- 1997-08-06 CN CN97117465A patent/CN1098617C/zh not_active Expired - Fee Related
- 1997-08-06 DE DE69727014T patent/DE69727014T2/de not_active Expired - Lifetime
- 1997-08-06 KR KR19970037541A patent/KR100278594B1/ko not_active IP Right Cessation
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- 1997-08-06 EP EP97113530A patent/EP0824270B1/en not_active Expired - Lifetime
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2000
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-
2002
- 2002-10-01 US US10/260,342 patent/US6841022B2/en not_active Expired - Fee Related
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2009
- 2009-07-21 JP JP2009170295A patent/JP2009283962A/ja active Pending
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US622839A (en) * | 1899-04-11 | Acetylene-gas generator |
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JP3928753B2 (ja) | 2007-06-13 |
DE69727014D1 (de) | 2004-02-05 |
US6479757B1 (en) | 2002-11-12 |
US20030029556A1 (en) | 2003-02-13 |
EP0824270A3 (en) | 1999-06-09 |
TW428259B (en) | 2001-04-01 |
DE69727014T2 (de) | 2004-06-09 |
CN1174490A (zh) | 1998-02-25 |
EP0824270B1 (en) | 2004-01-02 |
JP2009283961A (ja) | 2009-12-03 |
US6841022B2 (en) | 2005-01-11 |
CN1098617C (zh) | 2003-01-08 |
EP0824270A2 (en) | 1998-02-18 |
US6158115A (en) | 2000-12-12 |
JP2009283962A (ja) | 2009-12-03 |
JPH10107048A (ja) | 1998-04-24 |
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