KR100241843B1 - 경화성 수지 및 그의 제조방법, 및 전자 부품용 보호막 - Google Patents

경화성 수지 및 그의 제조방법, 및 전자 부품용 보호막 Download PDF

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Publication number
KR100241843B1
KR100241843B1 KR1019930000529A KR930000529A KR100241843B1 KR 100241843 B1 KR100241843 B1 KR 100241843B1 KR 1019930000529 A KR1019930000529 A KR 1019930000529A KR 930000529 A KR930000529 A KR 930000529A KR 100241843 B1 KR100241843 B1 KR 100241843B1
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KR
South Korea
Prior art keywords
group
general formula
integer
curable resin
organic group
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Expired - Fee Related
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KR1019930000529A
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English (en)
Korean (ko)
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KR930016471A (ko
Inventor
히로시게 오끼노시마
히데또 가또
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시키가이샤
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Publication of KR930016471A publication Critical patent/KR930016471A/ko
Application granted granted Critical
Publication of KR100241843B1 publication Critical patent/KR100241843B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Silicon Polymers (AREA)
  • Organic Insulating Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
KR1019930000529A 1992-01-17 1993-01-16 경화성 수지 및 그의 제조방법, 및 전자 부품용 보호막 Expired - Fee Related KR100241843B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4026223A JP2722915B2 (ja) 1992-01-17 1992-01-17 硬化性樹脂及びその製造方法並びに電子部品用保護膜
JP92-026223 1992-01-17

Publications (2)

Publication Number Publication Date
KR930016471A KR930016471A (ko) 1993-08-26
KR100241843B1 true KR100241843B1 (ko) 2000-02-01

Family

ID=12187387

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930000529A Expired - Fee Related KR100241843B1 (ko) 1992-01-17 1993-01-16 경화성 수지 및 그의 제조방법, 및 전자 부품용 보호막

Country Status (4)

Country Link
US (1) US5346979A (enExample)
JP (1) JP2722915B2 (enExample)
KR (1) KR100241843B1 (enExample)
TW (1) TW222288B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527862A (en) * 1993-08-25 1996-06-18 Dow Corning Asia, Ltd. Diorganopolysiloxane-rigid aromatic polymer compositions and preparation thereof
FR2815038B1 (fr) * 2000-10-09 2003-01-17 Cit Alcatel Composition de vernis , procede de fabrication de la composition , fil de bobinage revetu et bobine resultante
CN100427531C (zh) * 2006-02-21 2008-10-22 南京大学 有机硅嵌段自发孔聚酰亚胺的制备方法
JP4991943B2 (ja) 2010-02-26 2012-08-08 キヤノン株式会社 光学用部材、ポリイミド、およびその製造方法
CN103328488B (zh) * 2011-01-06 2015-12-09 吉坤日矿日石能源株式会社 酰亚胺化合物及其制造方法、润滑脂用增稠剂和润滑脂组合物
JP5932222B2 (ja) * 2011-01-19 2016-06-08 キヤノン株式会社 光学用部材及びその製造方法
TWI415878B (zh) * 2011-02-10 2013-11-21 Chin Yee Chemical Industres Co Ltd Transparent polyimide siloxane, a method for producing the same, and a film thereof
TWI612099B (zh) * 2013-02-07 2018-01-21 鐘化股份有限公司 烷氧基矽烷改質聚醯胺酸溶液、使用其之積層體及可撓性裝置、與積層體之製造方法
JP6071920B2 (ja) * 2014-02-12 2017-02-01 富士フイルム株式会社 ガス分離複合膜、ガス分離モジュール、ガス分離装置、ガス分離方法、及びガス分離複合膜の製造方法
WO2016024457A1 (ja) 2014-08-12 2016-02-18 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体及びフレキシブルデバイス、並びに積層体の製造方法
CN108099340B (zh) * 2016-08-31 2019-09-24 苏州凯英工业材料有限公司 一种聚酰亚胺复合材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL130570C (enExample) * 1963-12-12
US3950308A (en) * 1973-06-07 1976-04-13 Ciba-Geigy Corporation Crosslinked polymers containing siloxane groups
US4518735A (en) * 1981-10-29 1985-05-21 National Semiconductor Corporation High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process
CH660744A5 (de) * 1982-11-05 1987-06-15 Inventa Ag Verfahren zur herstellung hochviskoser bzw. thermisch formstabiler, mindestens teilvernetzter polyamide.
DE3852987T2 (de) * 1987-11-10 1995-06-01 Chisso Corp Silizium enthaltendes Polyimid-Prepolymer, davon abgeleitete ausgehärtete Produkte und Verfahren zu deren Herstellung.
JPH03140328A (ja) * 1989-10-27 1991-06-14 Chisso Corp 高接着性ポリアミド酸及びその硬化物の各製造法

Also Published As

Publication number Publication date
JPH05194747A (ja) 1993-08-03
KR930016471A (ko) 1993-08-26
JP2722915B2 (ja) 1998-03-09
TW222288B (enExample) 1994-04-11
US5346979A (en) 1994-09-13

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