KR100240915B1 - 회로 기판 및 그의 제조 방법 - Google Patents

회로 기판 및 그의 제조 방법 Download PDF

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Publication number
KR100240915B1
KR100240915B1 KR1019960046024A KR19960046024A KR100240915B1 KR 100240915 B1 KR100240915 B1 KR 100240915B1 KR 1019960046024 A KR1019960046024 A KR 1019960046024A KR 19960046024 A KR19960046024 A KR 19960046024A KR 100240915 B1 KR100240915 B1 KR 100240915B1
Authority
KR
South Korea
Prior art keywords
layer
dielectric
electrically conductive
material layer
dielectric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960046024A
Other languages
English (en)
Korean (ko)
Other versions
KR970058406A (ko
Inventor
아닐쿠마르 치누프라사드 브하트
아쉬윈쿠마르 치누프라사드 브하트
로버트 제프리 대이
토마스 패트릭 두피
제프리 알란 나이트
리차드 윌리암 말렉
보야 리스타 마르코비츠
Original Assignee
포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 포만 제프리 엘, 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 포만 제프리 엘
Publication of KR970058406A publication Critical patent/KR970058406A/ko
Application granted granted Critical
Publication of KR100240915B1 publication Critical patent/KR100240915B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1019960046024A 1995-12-01 1996-10-15 회로 기판 및 그의 제조 방법 Expired - Fee Related KR100240915B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/566,363 US5707893A (en) 1995-12-01 1995-12-01 Method of making a circuitized substrate using two different metallization processes
US08/566,363 1995-12-01
US8/566,363 1995-12-01

Publications (2)

Publication Number Publication Date
KR970058406A KR970058406A (ko) 1997-07-31
KR100240915B1 true KR100240915B1 (ko) 2000-01-15

Family

ID=24262573

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960046024A Expired - Fee Related KR100240915B1 (ko) 1995-12-01 1996-10-15 회로 기판 및 그의 제조 방법

Country Status (5)

Country Link
US (2) US5707893A (https=)
KR (1) KR100240915B1 (https=)
CN (1) CN1088321C (https=)
SG (1) SG44058A1 (https=)
TW (1) TW312080B (https=)

Families Citing this family (26)

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US6013417A (en) * 1998-04-02 2000-01-11 International Business Machines Corporation Process for fabricating circuitry on substrates having plated through-holes
US6296897B1 (en) * 1998-08-12 2001-10-02 International Business Machines Corporation Process for reducing extraneous metal plating
IT1312433B1 (it) * 1999-05-14 2002-04-17 Cadif Srl Pannello con tessuto elettro-termico,ad alto isolamento elettrico
US6869750B2 (en) * 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
JP3736607B2 (ja) * 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
CN100336426C (zh) * 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
US6753483B2 (en) * 2000-06-14 2004-06-22 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
US6617239B1 (en) 2000-08-31 2003-09-09 Micron Technology, Inc. Subtractive metallization structure and method of making
CN1278413C (zh) 2000-09-25 2006-10-04 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
DE10126734B4 (de) * 2001-05-31 2009-02-26 Qimonda Ag Umverdrahtungsverfahren und damit hergestelltes Bauelement
US20040188257A1 (en) * 2001-08-31 2004-09-30 John Klocke Methods for processing micro-feature workpieces, patterned structures on micro-feature workpieces, and integrated tools for processing micro-feature workpieces
JP3807312B2 (ja) * 2002-01-18 2006-08-09 富士通株式会社 プリント基板とその製造方法
JP4285629B2 (ja) * 2002-04-25 2009-06-24 富士通株式会社 集積回路を搭載するインターポーザ基板の作製方法
KR100499004B1 (ko) * 2002-12-18 2005-07-01 삼성전기주식회사 광비아홀을 구비하는 인쇄회로기판 및 가공 공정
US7179738B2 (en) * 2004-06-17 2007-02-20 Texas Instruments Incorporated Semiconductor assembly having substrate with electroplated contact pads
US7411303B2 (en) * 2004-11-09 2008-08-12 Texas Instruments Incorporated Semiconductor assembly having substrate with electroplated contact pads
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
KR100643496B1 (ko) * 2004-12-23 2006-11-10 삼성전자주식회사 노말 오픈/클로즈 타입 겸용 광센서 보드
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
KR100990618B1 (ko) * 2008-04-15 2010-10-29 삼성전기주식회사 랜드리스 비아홀을 갖는 인쇄회로기판 및 그 제조방법
US8186053B2 (en) * 2008-11-14 2012-05-29 Fujitsu Limited Circuit board and method of manufacturing the same
JP5565950B2 (ja) * 2010-08-23 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板の製造方法
CN104053305B (zh) * 2013-03-13 2017-06-16 北大方正集团有限公司 一种印制线路板及其制作方法
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
CN104703409B (zh) * 2013-12-09 2018-03-16 深南电路有限公司 电路板加工方法和相关装置
US10356906B2 (en) * 2016-06-21 2019-07-16 Abb Schweiz Ag Method of manufacturing a PCB including a thick-wall via

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US3568312A (en) * 1968-10-04 1971-03-09 Hewlett Packard Co Method of making printed circuit boards
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
GB8500906D0 (en) * 1985-01-15 1985-02-20 Prestwick Circuits Ltd Printed circuit boards
DE3576900D1 (de) * 1985-12-30 1990-05-03 Ibm Deutschland Verfahren zum herstellen von gedruckten schaltungen.
US5314788A (en) * 1986-01-24 1994-05-24 Canon Kabushiki Kaisha Matrix printed board and process of forming the same
US4866008A (en) * 1987-12-11 1989-09-12 Texas Instruments Incorporated Methods for forming self-aligned conductive pillars on interconnects
JPH01260886A (ja) * 1988-04-11 1989-10-18 Minolta Camera Co Ltd プリント基板の製造方法
US4810332A (en) * 1988-07-21 1989-03-07 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer copper interconnect
FR2649578B1 (fr) * 1989-07-10 1991-09-20 Alcatel Business Systems Dispositif de dissipation thermique pour composant de type cms monte sur plaque de circuit imprime
US4920639A (en) * 1989-08-04 1990-05-01 Microelectronics And Computer Technology Corporation Method of making a multilevel electrical airbridge interconnect
US5358907A (en) * 1990-01-30 1994-10-25 Xerox Corporation Method of electrolessly depositing metals on a silicon substrate by immersing the substrate in hydrofluoric acid containing a buffered metal salt solution
US5079065A (en) * 1990-04-02 1992-01-07 Fuji Xerox Co., Ltd. Printed-circuit substrate and method of making thereof
US5098860A (en) * 1990-05-07 1992-03-24 The Boeing Company Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers
JPH0636472B2 (ja) * 1990-05-28 1994-05-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
US5252195A (en) * 1990-08-20 1993-10-12 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board
JPH04100294A (ja) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
JPH05218618A (ja) * 1992-01-30 1993-08-27 Cmk Corp プリント配線板の製造方法
JP2773578B2 (ja) * 1992-10-02 1998-07-09 日本電気株式会社 半導体装置の製造方法
US5354712A (en) * 1992-11-12 1994-10-11 Northern Telecom Limited Method for forming interconnect structures for integrated circuits
US5421083A (en) * 1994-04-01 1995-06-06 Motorola, Inc. Method of manufacturing a circuit carrying substrate having coaxial via holes

Also Published As

Publication number Publication date
SG44058A1 (en) 1997-11-14
CN1156948A (zh) 1997-08-13
US5817405A (en) 1998-10-06
KR970058406A (ko) 1997-07-31
TW312080B (https=) 1997-08-01
US5707893A (en) 1998-01-13
CN1088321C (zh) 2002-07-24

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