KR100213991B1 - 프로우브 장치 - Google Patents

프로우브 장치 Download PDF

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Publication number
KR100213991B1
KR100213991B1 KR1019950012842A KR19950012842A KR100213991B1 KR 100213991 B1 KR100213991 B1 KR 100213991B1 KR 1019950012842 A KR1019950012842 A KR 1019950012842A KR 19950012842 A KR19950012842 A KR 19950012842A KR 100213991 B1 KR100213991 B1 KR 100213991B1
Authority
KR
South Korea
Prior art keywords
cassette
substrate
wafer
probe device
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950012842A
Other languages
English (en)
Korean (ko)
Other versions
KR950033490A (ko
Inventor
기타무라요시스케
Original Assignee
히가시 데쓰로
동경 엘렉트론주식회사
이노우에 쥰이치
도쿄 에레쿠토론 야마나시 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10943394A external-priority patent/JP3094056B2/ja
Priority claimed from JP29930894A external-priority patent/JP3230940B2/ja
Application filed by 히가시 데쓰로, 동경 엘렉트론주식회사, 이노우에 쥰이치, 도쿄 에레쿠토론 야마나시 가부시키가이샤 filed Critical 히가시 데쓰로
Publication of KR950033490A publication Critical patent/KR950033490A/ko
Application granted granted Critical
Publication of KR100213991B1 publication Critical patent/KR100213991B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019950012842A 1994-05-23 1995-05-23 프로우브 장치 Expired - Fee Related KR100213991B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP10848594 1994-05-23
JP94-108485 1994-05-23
JP94-109433 1994-05-24
JP10943394A JP3094056B2 (ja) 1994-05-24 1994-05-24 プローブ装置
JP94-299308 1994-12-02
JP29930894A JP3230940B2 (ja) 1994-05-23 1994-12-02 プローブ装置

Publications (2)

Publication Number Publication Date
KR950033490A KR950033490A (ko) 1995-12-26
KR100213991B1 true KR100213991B1 (ko) 1999-08-02

Family

ID=27311238

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950012842A Expired - Fee Related KR100213991B1 (ko) 1994-05-23 1995-05-23 프로우브 장치

Country Status (3)

Country Link
US (1) US5604443A (https=)
KR (1) KR100213991B1 (https=)
TW (1) TW278139B (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785186A (en) * 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5999268A (en) * 1996-10-18 1999-12-07 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US6082950A (en) * 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
US5833426A (en) * 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
JP3099183B2 (ja) * 1997-05-14 2000-10-16 株式会社東京精密 ウェーハプロービングマシン
US5803696A (en) * 1997-05-16 1998-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Safety interlock device for a standard manufacturing interface arm and equipment
US6104184A (en) * 1997-11-17 2000-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for loading a wafer into a test machine
KR100253091B1 (ko) * 1997-11-21 2000-04-15 윤종용 반도체 보트 이송용 자동 수평조절 엘리베이터장치
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
DE19813684C2 (de) * 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
JP3519595B2 (ja) * 1998-03-31 2004-04-19 松下電器産業株式会社 ウエハ搬送装置
US6489741B1 (en) 1998-08-25 2002-12-03 Genmark Automation, Inc. Robot motion compensation system
DE19845504A1 (de) * 1998-10-02 2000-04-20 Wacker Siltronic Halbleitermat Hordenaufnahmevorrichtung
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
DE19958082A1 (de) * 1999-12-02 2001-06-07 Logitex Reinstmedientechnik Gm Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben
US7054713B2 (en) * 2002-01-07 2006-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration cassette pod for robot teaching and method of using
TW528709B (en) * 2002-08-01 2003-04-21 Nanya Technology Corp Wafer carrying device with blade position detection
TW200725785A (en) * 2005-12-30 2007-07-01 Powerchip Semiconductor Corp Displaced wafer detection systems
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US8099190B2 (en) * 2007-06-22 2012-01-17 Asm International N.V. Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
US20150200514A1 (en) * 2014-01-13 2015-07-16 United Microelectronics Corp. Method for calibrating a plurality of pincettes of a wafer conveyer
CN109273384B (zh) * 2018-09-07 2021-08-06 上海华岭集成电路技术股份有限公司 适用于检测装载晶圆料盒的调节装置
CN110907665B (zh) * 2019-11-25 2021-10-22 江苏爱矽半导体科技有限公司 一种抵靠程度可控的集成电路封装测试座
JP7357549B2 (ja) * 2020-01-07 2023-10-06 東京エレクトロン株式会社 基板の位置ずれ検出方法、基板位置の異常判定方法、基板搬送制御方法、及び基板の位置ずれ検出装置
CN115552583B (zh) 2020-06-05 2025-06-27 日商乐华股份有限公司 晶圆搬运装置以及晶圆搬运方法
JP7608106B2 (ja) * 2020-10-05 2025-01-06 キオクシア株式会社 半導体製造装置
CN115101430B (zh) * 2021-12-22 2022-12-27 沈阳新松机器人自动化股份有限公司 一种多尺寸晶圆兼容开盒器的检测方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US4901011A (en) * 1988-11-04 1990-02-13 Tokyo Electron Limited Carrier for transferring plate-like objects one by one, a handling apparatus for loading or unloading the carrier, and a wafer probing machine fitted with the handling apparatus for the wafer carrier
JPH04340250A (ja) * 1991-01-30 1992-11-26 Yaskawa Electric Corp ウエハキャリッジの位置決め装置
JPH05136218A (ja) * 1991-02-19 1993-06-01 Tokyo Electron Yamanashi Kk 検査装置

Also Published As

Publication number Publication date
TW278139B (https=) 1996-06-11
US5604443A (en) 1997-02-18
KR950033490A (ko) 1995-12-26

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