TW200725785A - Displaced wafer detection systems - Google Patents

Displaced wafer detection systems

Info

Publication number
TW200725785A
TW200725785A TW094147624A TW94147624A TW200725785A TW 200725785 A TW200725785 A TW 200725785A TW 094147624 A TW094147624 A TW 094147624A TW 94147624 A TW94147624 A TW 94147624A TW 200725785 A TW200725785 A TW 200725785A
Authority
TW
Taiwan
Prior art keywords
pod
unified pod
wafer detection
detection systems
wafers
Prior art date
Application number
TW094147624A
Other languages
Chinese (zh)
Inventor
Yuan-Hsing Lin
Lin-Jo Ko
Chiung-Chun Lee
Chang-Liang Huang
Original Assignee
Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Priority to TW094147624A priority Critical patent/TW200725785A/en
Priority to US11/444,500 priority patent/US20070154291A1/en
Priority to KR1020060055841A priority patent/KR100780085B1/en
Publication of TW200725785A publication Critical patent/TW200725785A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40562—Position and orientation of end effector, teach probe, track them
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Abstract

A displaced wafer detection system comprises a unified pod, an pod opener, a horizontal transmission robot, and a sensor. The unified pod encloses a plurality of wafers in a first position. The pod opener opens the unified pod. The horizontal transmission robot carries the wafers from the unified pod to a second position. When one of the wafers reaches the second position, the sensor detects if any wafer slips during wafer transmission from the unified pod.
TW094147624A 2005-12-30 2005-12-30 Displaced wafer detection systems TW200725785A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094147624A TW200725785A (en) 2005-12-30 2005-12-30 Displaced wafer detection systems
US11/444,500 US20070154291A1 (en) 2005-12-30 2006-06-01 Displaced wafer detection systems
KR1020060055841A KR100780085B1 (en) 2005-12-30 2006-06-21 Displaced wafer detection systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094147624A TW200725785A (en) 2005-12-30 2005-12-30 Displaced wafer detection systems

Publications (1)

Publication Number Publication Date
TW200725785A true TW200725785A (en) 2007-07-01

Family

ID=38224588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147624A TW200725785A (en) 2005-12-30 2005-12-30 Displaced wafer detection systems

Country Status (3)

Country Link
US (1) US20070154291A1 (en)
KR (1) KR100780085B1 (en)
TW (1) TW200725785A (en)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
JPH04186862A (en) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd Equipment for detecting substrate
US5604443A (en) * 1994-05-23 1997-02-18 Tokyo Electron Limited Probe test apparatus
US5706201A (en) * 1996-05-07 1998-01-06 Fortrend Engineering Corporation Software to determine the position of the center of a wafer
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
JPH10107122A (en) * 1996-10-01 1998-04-24 Tokyo Electron Ltd Device for carrying in cassette for substrate to be processed
US6224312B1 (en) * 1996-11-18 2001-05-01 Applied Materials, Inc. Optimal trajectory robot motion
KR100252041B1 (en) * 1997-10-30 2000-04-15 윤종용 Apparatus for detecting loading status of wafer in carrier and method therefor
JP3590517B2 (en) 1998-01-21 2004-11-17 株式会社 日立インダストリイズ Wafer detection device in cassette
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
JP2001060615A (en) 1999-08-20 2001-03-06 Rorze Corp Wafer recognition device in wafer transfer device
JP4246420B2 (en) * 2000-09-14 2009-04-02 平田機工株式会社 FOUP opener and FOUP opener mapping method
KR20020032702A (en) * 2000-10-26 2002-05-04 윤종용 Apparatus for holding in check drop of wafer adapted to semiconductor fabrication equipment
KR100481178B1 (en) * 2002-09-03 2005-04-07 삼성전자주식회사 Substrate existence inspection apparatus
US7255524B2 (en) * 2003-04-14 2007-08-14 Brooks Automation, Inc. Substrate cassette mapper
KR20050049988A (en) * 2003-11-24 2005-05-27 삼성전자주식회사 Apparatus for detecting a wafer in a transfer chamber of semiconductor fabrication
WO2007008939A2 (en) * 2005-07-11 2007-01-18 Brooks Automation, Inc. Apparatus with on-the-fly workpiece centering

Also Published As

Publication number Publication date
US20070154291A1 (en) 2007-07-05
KR20070072329A (en) 2007-07-04
KR100780085B1 (en) 2007-11-29

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