TW278139B - - Google Patents

Info

Publication number
TW278139B
TW278139B TW084105477A TW84105477A TW278139B TW 278139 B TW278139 B TW 278139B TW 084105477 A TW084105477 A TW 084105477A TW 84105477 A TW84105477 A TW 84105477A TW 278139 B TW278139 B TW 278139B
Authority
TW
Taiwan
Application number
TW084105477A
Original Assignee
Tokyo Electron Co Ltd
Tel Yamanishi Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10943394A external-priority patent/JP3094056B2/ja
Priority claimed from JP29930894A external-priority patent/JP3230940B2/ja
Application filed by Tokyo Electron Co Ltd, Tel Yamanishi Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW278139B publication Critical patent/TW278139B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW084105477A 1994-05-23 1995-05-30 TW278139B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10848594 1994-05-23
JP10943394A JP3094056B2 (ja) 1994-05-24 1994-05-24 プローブ装置
JP29930894A JP3230940B2 (ja) 1994-05-23 1994-12-02 プローブ装置

Publications (1)

Publication Number Publication Date
TW278139B true TW278139B (zh) 1996-06-11

Family

ID=27311238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105477A TW278139B (zh) 1994-05-23 1995-05-30

Country Status (3)

Country Link
US (1) US5604443A (zh)
KR (1) KR100213991B1 (zh)
TW (1) TW278139B (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785186A (en) * 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5999268A (en) * 1996-10-18 1999-12-07 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US6082950A (en) * 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
US5833426A (en) * 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
JP3099183B2 (ja) * 1997-05-14 2000-10-16 株式会社東京精密 ウェーハプロービングマシン
US5803696A (en) * 1997-05-16 1998-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Safety interlock device for a standard manufacturing interface arm and equipment
US6104184A (en) * 1997-11-17 2000-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for loading a wafer into a test machine
KR100253091B1 (ko) * 1997-11-21 2000-04-15 윤종용 반도체 보트 이송용 자동 수평조절 엘리베이터장치
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
DE19813684C2 (de) * 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
JP3519595B2 (ja) * 1998-03-31 2004-04-19 松下電器産業株式会社 ウエハ搬送装置
US6489741B1 (en) 1998-08-25 2002-12-03 Genmark Automation, Inc. Robot motion compensation system
DE19845504A1 (de) * 1998-10-02 2000-04-20 Wacker Siltronic Halbleitermat Hordenaufnahmevorrichtung
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
DE19958082A1 (de) * 1999-12-02 2001-06-07 Logitex Reinstmedientechnik Gm Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben
US7054713B2 (en) * 2002-01-07 2006-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration cassette pod for robot teaching and method of using
TW528709B (en) * 2002-08-01 2003-04-21 Nanya Technology Corp Wafer carrying device with blade position detection
TW200725785A (en) * 2005-12-30 2007-07-01 Powerchip Semiconductor Corp Displaced wafer detection systems
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US8099190B2 (en) * 2007-06-22 2012-01-17 Asm International N.V. Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
US20150200514A1 (en) * 2014-01-13 2015-07-16 United Microelectronics Corp. Method for calibrating a plurality of pincettes of a wafer conveyer
CN109273384B (zh) * 2018-09-07 2021-08-06 上海华岭集成电路技术股份有限公司 适用于检测装载晶圆料盒的调节装置
CN110907665B (zh) * 2019-11-25 2021-10-22 江苏爱矽半导体科技有限公司 一种抵靠程度可控的集成电路封装测试座
JP7357549B2 (ja) * 2020-01-07 2023-10-06 東京エレクトロン株式会社 基板の位置ずれ検出方法、基板位置の異常判定方法、基板搬送制御方法、及び基板の位置ずれ検出装置
CN115101430B (zh) * 2021-12-22 2022-12-27 沈阳新松机器人自动化股份有限公司 一种多尺寸晶圆兼容开盒器的检测方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US4901011A (en) * 1988-11-04 1990-02-13 Tokyo Electron Limited Carrier for transferring plate-like objects one by one, a handling apparatus for loading or unloading the carrier, and a wafer probing machine fitted with the handling apparatus for the wafer carrier
JPH04340250A (ja) * 1991-01-30 1992-11-26 Yaskawa Electric Corp ウエハキャリッジの位置決め装置
JPH05136218A (ja) * 1991-02-19 1993-06-01 Tokyo Electron Yamanashi Kk 検査装置

Also Published As

Publication number Publication date
KR950033490A (ko) 1995-12-26
KR100213991B1 (ko) 1999-08-02
US5604443A (en) 1997-02-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees