KR100190261B1 - 집적회로의 게이트 스택 제조 방법 - Google Patents

집적회로의 게이트 스택 제조 방법 Download PDF

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Publication number
KR100190261B1
KR100190261B1 KR1019940040055A KR19940040055A KR100190261B1 KR 100190261 B1 KR100190261 B1 KR 100190261B1 KR 1019940040055 A KR1019940040055 A KR 1019940040055A KR 19940040055 A KR19940040055 A KR 19940040055A KR 100190261 B1 KR100190261 B1 KR 100190261B1
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KR
South Korea
Prior art keywords
layer
patterned
metal
gate stack
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940040055A
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English (en)
Korean (ko)
Other versions
KR950024337A (ko
Inventor
장총핑
이쿠후아
리우춘팅
리우루이첸
Original Assignee
엘리 웨이스, 알 비 레비
에이티 앤드 티 코포레이션
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Publication date
Application filed by 엘리 웨이스, 알 비 레비, 에이티 앤드 티 코포레이션 filed Critical 엘리 웨이스, 알 비 레비
Publication of KR950024337A publication Critical patent/KR950024337A/ko
Application granted granted Critical
Publication of KR100190261B1 publication Critical patent/KR100190261B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/105—Masks, metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019940040055A 1994-01-03 1994-12-30 집적회로의 게이트 스택 제조 방법 Expired - Fee Related KR100190261B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/176,600 US5438006A (en) 1994-01-03 1994-01-03 Method of fabricating gate stack having a reduced height
US176,600 1994-01-03

Publications (2)

Publication Number Publication Date
KR950024337A KR950024337A (ko) 1995-08-21
KR100190261B1 true KR100190261B1 (ko) 1999-06-01

Family

ID=22645037

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940040055A Expired - Fee Related KR100190261B1 (ko) 1994-01-03 1994-12-30 집적회로의 게이트 스택 제조 방법

Country Status (5)

Country Link
US (1) US5438006A (enExample)
EP (1) EP0665579A1 (enExample)
JP (1) JP3177572B2 (enExample)
KR (1) KR100190261B1 (enExample)
TW (1) TW298666B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0135166B1 (ko) * 1993-07-20 1998-04-25 문정환 반도체장치의 게이트 형성방법
JP2638573B2 (ja) * 1995-06-26 1997-08-06 日本電気株式会社 半導体装置の製造方法
DE19535618A1 (de) * 1995-09-25 1997-03-27 Siemens Ag Verfahren zur Herstellung von mikroelektronischen Strukturen
US5886410A (en) * 1996-06-26 1999-03-23 Intel Corporation Interconnect structure with hard mask and low dielectric constant materials
US7078342B1 (en) 1996-07-16 2006-07-18 Micron Technology, Inc. Method of forming a gate stack
US6613673B2 (en) * 1996-07-16 2003-09-02 Micron Technology, Inc. Technique for elimination of pitting on silicon substrate during gate stack etch
US7041548B1 (en) * 1996-07-16 2006-05-09 Micron Technology, Inc. Methods of forming a gate stack that is void of silicon clusters within a metallic silicide film thereof
US6087254A (en) * 1996-07-16 2000-07-11 Micron Technology, Inc. Technique for elimination of pitting on silicon substrate during gate stack etch
US5851926A (en) * 1996-10-01 1998-12-22 Applied Materials, Inc Method for etching transistor gates using a hardmask
US6369423B2 (en) 1998-03-03 2002-04-09 Kabushiki Kaisha Toshiba Semiconductor device with a thin gate stack having a plurality of insulating layers
US6399432B1 (en) 1998-11-24 2002-06-04 Philips Semiconductors Inc. Process to control poly silicon profiles in a dual doped poly silicon process
US6096653A (en) * 1998-12-07 2000-08-01 Worldwide Semiconductor Manufacturing Corporation Method for fabricating conducting lines with a high topography height
US6630405B1 (en) 1999-12-20 2003-10-07 Chartered Semiconductor Manufacturing Ltd. Method of gate patterning for sub-0.1 μm technology
TW552669B (en) * 2000-06-19 2003-09-11 Infineon Technologies Corp Process for etching polysilicon gate stacks with raised shallow trench isolation structures
DE10147791A1 (de) * 2001-09-27 2003-04-10 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis eines Nitrid-Verbindungshalbleiters
SE0201566D0 (sv) * 2002-05-27 2002-05-27 Karlshamns Ab New composition
JP2006186276A (ja) 2004-12-28 2006-07-13 Toshiba Corp 半導体装置の製造方法
KR20070047624A (ko) * 2005-11-02 2007-05-07 주성엔지니어링(주) 박막 패턴 형성 방법
US8809179B2 (en) * 2006-04-13 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method for reducing topography of non-volatile memory and resulting memory cells
EP2802004B1 (en) 2013-05-08 2020-11-04 ams AG Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818715A (en) * 1987-07-09 1989-04-04 Industrial Technology Research Institute Method of fabricating a LDDFET with self-aligned silicide
JPH01189170A (ja) * 1988-01-25 1989-07-28 Seiko Epson Corp 半導体装置の製造方法
NL8800222A (nl) * 1988-01-29 1989-08-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij op zelfregistrerende wijze metaalsilicide wordt aangebracht.
EP0704883A3 (en) * 1988-02-11 1997-07-09 Sgs Thomson Microelectronics Melting metal silicide encapsulation to protect multilayered polyicides
US4971655A (en) * 1989-12-26 1990-11-20 Micron Technology, Inc. Protection of a refractory metal silicide during high-temperature processing using a dual-layer cap of silicon dioxide and silicon nitride
US5034348A (en) * 1990-08-16 1991-07-23 International Business Machines Corp. Process for forming refractory metal silicide layers of different thicknesses in an integrated circuit
US5094712A (en) * 1990-10-09 1992-03-10 Micron Technology, Inc. One chamber in-situ etch process for oxide and conductive material
JP2901423B2 (ja) * 1992-08-04 1999-06-07 三菱電機株式会社 電界効果トランジスタの製造方法
US5346586A (en) * 1992-12-23 1994-09-13 Micron Semiconductor, Inc. Method for selectively etching polysilicon to gate oxide using an insitu ozone photoresist strip

Also Published As

Publication number Publication date
EP0665579A1 (en) 1995-08-02
JPH07221193A (ja) 1995-08-18
JP3177572B2 (ja) 2001-06-18
TW298666B (enExample) 1997-02-21
US5438006A (en) 1995-08-01
KR950024337A (ko) 1995-08-21

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