KR0123187B1 - 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 - Google Patents

테이프캐리어 및 이것을 사용한 테이프캐리어디바이스

Info

Publication number
KR0123187B1
KR0123187B1 KR1019930014798A KR930014798A KR0123187B1 KR 0123187 B1 KR0123187 B1 KR 0123187B1 KR 1019930014798 A KR1019930014798 A KR 1019930014798A KR 930014798 A KR930014798 A KR 930014798A KR 0123187 B1 KR0123187 B1 KR 0123187B1
Authority
KR
South Korea
Prior art keywords
tape carrier
resin
pattern
agent
overcoat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019930014798A
Other languages
English (en)
Korean (ko)
Other versions
KR950005125A (ko
Inventor
마사하루 시자카
타케시 오사메
나오유키 타지마
Original Assignee
카와키타 토오루
미쯔이 긴조꾸 고오교오 가부시기가이샤
쯔지 하루오
샤프 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35860792A external-priority patent/JP2509509B2/ja
Application filed by 카와키타 토오루, 미쯔이 긴조꾸 고오교오 가부시기가이샤, 쯔지 하루오, 샤프 가부시기가이샤 filed Critical 카와키타 토오루
Publication of KR950005125A publication Critical patent/KR950005125A/ko
Application granted granted Critical
Publication of KR0123187B1 publication Critical patent/KR0123187B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Packages (AREA)
KR1019930014798A 1992-12-28 1993-07-31 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 Expired - Lifetime KR0123187B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35860792A JP2509509B2 (ja) 1992-01-20 1992-12-28 テ―プキャリアおよびこれを用いたテ―プキャリアデバイス
JP92-358607 1992-12-28

Publications (2)

Publication Number Publication Date
KR950005125A KR950005125A (ko) 1995-02-18
KR0123187B1 true KR0123187B1 (ko) 1997-11-22

Family

ID=18460193

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930014798A Expired - Lifetime KR0123187B1 (ko) 1992-12-28 1993-07-31 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스

Country Status (3)

Country Link
US (2) US5477080A (enExample)
KR (1) KR0123187B1 (enExample)
TW (1) TW263596B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950034696A (ko) * 1994-05-16 1995-12-28 김광호 초박형 반도체 패키지 및 그 제조방법
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
JP3343642B2 (ja) * 1996-04-26 2002-11-11 シャープ株式会社 テープキャリアパッケージ及び液晶表示装置
US6074898A (en) * 1996-09-18 2000-06-13 Sony Corporation Lead frame and integrated circuit package
JPH10173003A (ja) * 1996-12-13 1998-06-26 Sharp Corp 半導体装置とその製造方法およびフィルムキャリアテープとその製造方法
US6580157B2 (en) 1997-06-10 2003-06-17 Micron Technology, Inc. Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
US5780923A (en) * 1997-06-10 1998-07-14 Micron Technology, Inc. Modified bus bar with Kapton™ tape or insulative material on LOC packaged part
EP1176159B1 (en) * 1999-04-22 2005-09-28 Ajinomoto Co., Inc. Thermosetting resin composition and flexible-circuit overcoating material comprising the same
JP3750113B2 (ja) * 2002-03-25 2006-03-01 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ及びその製造方法
WO2005038911A1 (en) * 2003-10-15 2005-04-28 Koninklijke Philips Electronics N.V. Device, system and electric element

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
US5227232A (en) * 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JP2982450B2 (ja) * 1991-11-26 1999-11-22 日本電気株式会社 フィルムキャリア半導体装置及びその製造方法
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US5814879A (en) 1998-09-29
US5477080A (en) 1995-12-19
TW263596B (enExample) 1995-11-21
KR950005125A (ko) 1995-02-18

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