KR0123187B1 - 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 - Google Patents

테이프캐리어 및 이것을 사용한 테이프캐리어디바이스

Info

Publication number
KR0123187B1
KR0123187B1 KR1019930014798A KR930014798A KR0123187B1 KR 0123187 B1 KR0123187 B1 KR 0123187B1 KR 1019930014798 A KR1019930014798 A KR 1019930014798A KR 930014798 A KR930014798 A KR 930014798A KR 0123187 B1 KR0123187 B1 KR 0123187B1
Authority
KR
South Korea
Prior art keywords
tape carrier
resin
pattern
agent
overcoat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019930014798A
Other languages
English (en)
Korean (ko)
Other versions
KR950005125A (ko
Inventor
마사하루 시자카
타케시 오사메
나오유키 타지마
Original Assignee
카와키타 토오루
미쯔이 긴조꾸 고오교오 가부시기가이샤
쯔지 하루오
샤프 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35860792A external-priority patent/JP2509509B2/ja
Application filed by 카와키타 토오루, 미쯔이 긴조꾸 고오교오 가부시기가이샤, 쯔지 하루오, 샤프 가부시기가이샤 filed Critical 카와키타 토오루
Publication of KR950005125A publication Critical patent/KR950005125A/ko
Application granted granted Critical
Publication of KR0123187B1 publication Critical patent/KR0123187B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Packages (AREA)
KR1019930014798A 1992-12-28 1993-07-31 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 Expired - Lifetime KR0123187B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35860792A JP2509509B2 (ja) 1992-01-20 1992-12-28 テ―プキャリアおよびこれを用いたテ―プキャリアデバイス
JP92-358607 1992-12-28

Publications (2)

Publication Number Publication Date
KR950005125A KR950005125A (ko) 1995-02-18
KR0123187B1 true KR0123187B1 (ko) 1997-11-22

Family

ID=18460193

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930014798A Expired - Lifetime KR0123187B1 (ko) 1992-12-28 1993-07-31 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스

Country Status (3)

Country Link
US (2) US5477080A (enExample)
KR (1) KR0123187B1 (enExample)
TW (1) TW263596B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950034696A (ko) * 1994-05-16 1995-12-28 김광호 초박형 반도체 패키지 및 그 제조방법
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
JP3343642B2 (ja) * 1996-04-26 2002-11-11 シャープ株式会社 テープキャリアパッケージ及び液晶表示装置
US6074898A (en) * 1996-09-18 2000-06-13 Sony Corporation Lead frame and integrated circuit package
JPH10173003A (ja) * 1996-12-13 1998-06-26 Sharp Corp 半導体装置とその製造方法およびフィルムキャリアテープとその製造方法
US6580157B2 (en) * 1997-06-10 2003-06-17 Micron Technology, Inc. Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
US5780923A (en) * 1997-06-10 1998-07-14 Micron Technology, Inc. Modified bus bar with Kapton™ tape or insulative material on LOC packaged part
JP4296588B2 (ja) * 1999-04-22 2009-07-15 味の素株式会社 熱硬化性樹脂組成物およびこれを用いたフレキシブル回路オーバーコート剤
JP3750113B2 (ja) * 2002-03-25 2006-03-01 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ及びその製造方法
US7626255B2 (en) * 2003-10-15 2009-12-01 Koninklijke Philips Electronics N.V. Device, system and electric element

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
US5227232A (en) * 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JP2982450B2 (ja) * 1991-11-26 1999-11-22 日本電気株式会社 フィルムキャリア半導体装置及びその製造方法
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
KR950005125A (ko) 1995-02-18
US5477080A (en) 1995-12-19
TW263596B (enExample) 1995-11-21
US5814879A (en) 1998-09-29

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