JPH0357617B2 - - Google Patents
Info
- Publication number
- JPH0357617B2 JPH0357617B2 JP59171953A JP17195384A JPH0357617B2 JP H0357617 B2 JPH0357617 B2 JP H0357617B2 JP 59171953 A JP59171953 A JP 59171953A JP 17195384 A JP17195384 A JP 17195384A JP H0357617 B2 JPH0357617 B2 JP H0357617B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tool
- semiconductor element
- metal protrusions
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/093—
-
- H10P72/74—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H10W72/012—
-
- H10W72/01204—
-
- H10W72/07236—
-
- H10W72/251—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171953A JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171953A JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6150339A JPS6150339A (ja) | 1986-03-12 |
| JPH0357617B2 true JPH0357617B2 (enExample) | 1991-09-02 |
Family
ID=15932842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171953A Granted JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150339A (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7312785B2 (en) | 2001-10-22 | 2007-12-25 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US7333092B2 (en) | 2002-02-25 | 2008-02-19 | Apple Computer, Inc. | Touch pad for handheld device |
| US7348967B2 (en) | 2001-10-22 | 2008-03-25 | Apple Inc. | Touch pad for handheld device |
| US7495659B2 (en) | 2003-11-25 | 2009-02-24 | Apple Inc. | Touch pad for handheld device |
| US7499040B2 (en) | 2003-08-18 | 2009-03-03 | Apple Inc. | Movable touch pad with added functionality |
| US8866780B2 (en) | 2007-12-03 | 2014-10-21 | Apple Inc. | Multi-dimensional scroll wheel |
| US8872771B2 (en) | 2009-07-07 | 2014-10-28 | Apple Inc. | Touch sensing device having conductive nodes |
| US8933890B2 (en) | 2003-11-25 | 2015-01-13 | Apple Inc. | Techniques for interactive input to portable electronic devices |
| US9354751B2 (en) | 2009-05-15 | 2016-05-31 | Apple Inc. | Input device with optimized capacitive sensing |
| US9360967B2 (en) | 2006-07-06 | 2016-06-07 | Apple Inc. | Mutual capacitance touch sensing device |
| US9367151B2 (en) | 2005-12-30 | 2016-06-14 | Apple Inc. | Touch pad with symbols based on mode |
| US9405421B2 (en) | 2006-07-06 | 2016-08-02 | Apple Inc. | Mutual capacitance touch sensing device |
| US9454256B2 (en) | 2008-03-14 | 2016-09-27 | Apple Inc. | Sensor configurations of an input device that are switchable based on mode |
-
1984
- 1984-08-18 JP JP59171953A patent/JPS6150339A/ja active Granted
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8952886B2 (en) | 2001-10-22 | 2015-02-10 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US7348967B2 (en) | 2001-10-22 | 2008-03-25 | Apple Inc. | Touch pad for handheld device |
| US7312785B2 (en) | 2001-10-22 | 2007-12-25 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US9009626B2 (en) | 2001-10-22 | 2015-04-14 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US7333092B2 (en) | 2002-02-25 | 2008-02-19 | Apple Computer, Inc. | Touch pad for handheld device |
| US7499040B2 (en) | 2003-08-18 | 2009-03-03 | Apple Inc. | Movable touch pad with added functionality |
| US7495659B2 (en) | 2003-11-25 | 2009-02-24 | Apple Inc. | Touch pad for handheld device |
| US8933890B2 (en) | 2003-11-25 | 2015-01-13 | Apple Inc. | Techniques for interactive input to portable electronic devices |
| US9367151B2 (en) | 2005-12-30 | 2016-06-14 | Apple Inc. | Touch pad with symbols based on mode |
| US9360967B2 (en) | 2006-07-06 | 2016-06-07 | Apple Inc. | Mutual capacitance touch sensing device |
| US9405421B2 (en) | 2006-07-06 | 2016-08-02 | Apple Inc. | Mutual capacitance touch sensing device |
| US8866780B2 (en) | 2007-12-03 | 2014-10-21 | Apple Inc. | Multi-dimensional scroll wheel |
| US9454256B2 (en) | 2008-03-14 | 2016-09-27 | Apple Inc. | Sensor configurations of an input device that are switchable based on mode |
| US9354751B2 (en) | 2009-05-15 | 2016-05-31 | Apple Inc. | Input device with optimized capacitive sensing |
| US8872771B2 (en) | 2009-07-07 | 2014-10-28 | Apple Inc. | Touch sensing device having conductive nodes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6150339A (ja) | 1986-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4048438A (en) | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips | |
| JPH0332914B2 (enExample) | ||
| JPH0357617B2 (enExample) | ||
| US5109601A (en) | Method of marking a thin film package | |
| KR19980063532A (ko) | 반도체 장치와 그의 제조방법 및 필름 캐리어 테이프와 그의 제조방법 | |
| JP2003508898A (ja) | マイクロビームアセンブリおよび集積回路と基板との内部連結方法 | |
| JPH0432541B2 (enExample) | ||
| US4965700A (en) | Thin film package for mixed bonding of chips | |
| JP2643613B2 (ja) | 電気的接続接点の形成方法および電子部品の実装方法 | |
| JPH06268098A (ja) | 半導体集積回路装置の製造方法 | |
| JP2721580B2 (ja) | 半導体装置の製造方法 | |
| JPH03101142A (ja) | 半導体装置の製造方法 | |
| JPH06177315A (ja) | 多層リードフレーム | |
| JP2764628B2 (ja) | 電子回路基板とその製造方法 | |
| JPH03129745A (ja) | 半導体装置の実装方法 | |
| EP0343379A2 (en) | Thin film package for mixed bonding of a chip | |
| JP2674786B2 (ja) | Icの実装方法および実装装置 | |
| KR0171099B1 (ko) | 반도체 기판 범프 및 그 제조방법 | |
| JP3021508B2 (ja) | 導電突起の形成方法 | |
| JPH0510365Y2 (enExample) | ||
| JP2867547B2 (ja) | 導電突起の形成方法 | |
| JP2998507B2 (ja) | 半導体装置の製造方法 | |
| JP2705263B2 (ja) | Tab用テープキャリアの製造方法 | |
| JPS6091656A (ja) | 半導体装置の製造方法 | |
| KR20010045916A (ko) | 웨이퍼 레벨 패키지 및 그 제조방법 |