JPH0357617B2 - - Google Patents

Info

Publication number
JPH0357617B2
JPH0357617B2 JP59171953A JP17195384A JPH0357617B2 JP H0357617 B2 JPH0357617 B2 JP H0357617B2 JP 59171953 A JP59171953 A JP 59171953A JP 17195384 A JP17195384 A JP 17195384A JP H0357617 B2 JPH0357617 B2 JP H0357617B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59171953A
Other versions
JPS6150339A (en
Inventor
Kenzo Hatada
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP59171953A priority Critical patent/JPH0357617B2/ja
Publication of JPS6150339A publication Critical patent/JPS6150339A/en
Publication of JPH0357617B2 publication Critical patent/JPH0357617B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/11001Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
JP59171953A 1984-08-18 1984-08-18 Expired - Lifetime JPH0357617B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59171953A JPH0357617B2 (en) 1984-08-18 1984-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59171953A JPH0357617B2 (en) 1984-08-18 1984-08-18

Publications (2)

Publication Number Publication Date
JPS6150339A JPS6150339A (en) 1986-03-12
JPH0357617B2 true JPH0357617B2 (en) 1991-09-02

Family

ID=15932842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59171953A Expired - Lifetime JPH0357617B2 (en) 1984-08-18 1984-08-18

Country Status (1)

Country Link
JP (1) JPH0357617B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866780B2 (en) 2007-12-03 2014-10-21 Apple Inc. Multi-dimensional scroll wheel
US8933890B2 (en) 2003-11-25 2015-01-13 Apple Inc. Techniques for interactive input to portable electronic devices
US8952886B2 (en) 2001-10-22 2015-02-10 Apple Inc. Method and apparatus for accelerated scrolling
US9354751B2 (en) 2009-05-15 2016-05-31 Apple Inc. Input device with optimized capacitive sensing
US9360967B2 (en) 2006-07-06 2016-06-07 Apple Inc. Mutual capacitance touch sensing device
US9367151B2 (en) 2005-12-30 2016-06-14 Apple Inc. Touch pad with symbols based on mode
US9405421B2 (en) 2006-07-06 2016-08-02 Apple Inc. Mutual capacitance touch sensing device
US9454256B2 (en) 2008-03-14 2016-09-27 Apple Inc. Sensor configurations of an input device that are switchable based on mode

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8952886B2 (en) 2001-10-22 2015-02-10 Apple Inc. Method and apparatus for accelerated scrolling
US9009626B2 (en) 2001-10-22 2015-04-14 Apple Inc. Method and apparatus for accelerated scrolling
US8933890B2 (en) 2003-11-25 2015-01-13 Apple Inc. Techniques for interactive input to portable electronic devices
US9367151B2 (en) 2005-12-30 2016-06-14 Apple Inc. Touch pad with symbols based on mode
US9360967B2 (en) 2006-07-06 2016-06-07 Apple Inc. Mutual capacitance touch sensing device
US9405421B2 (en) 2006-07-06 2016-08-02 Apple Inc. Mutual capacitance touch sensing device
US8866780B2 (en) 2007-12-03 2014-10-21 Apple Inc. Multi-dimensional scroll wheel
US9454256B2 (en) 2008-03-14 2016-09-27 Apple Inc. Sensor configurations of an input device that are switchable based on mode
US9354751B2 (en) 2009-05-15 2016-05-31 Apple Inc. Input device with optimized capacitive sensing

Also Published As

Publication number Publication date
JPS6150339A (en) 1986-03-12

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