KR950005125A - 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 - Google Patents

테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 Download PDF

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KR950005125A
KR950005125A KR1019930014798A KR930014798A KR950005125A KR 950005125 A KR950005125 A KR 950005125A KR 1019930014798 A KR1019930014798 A KR 1019930014798A KR 930014798 A KR930014798 A KR 930014798A KR 950005125 A KR950005125 A KR 950005125A
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tape carrier
resin
coated
pattern surface
encapsulating
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KR1019930014798A
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KR0123187B1 (ko
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마사하루 이시자카
타케시 오사메
나오유키 타지마
Original Assignee
카와키타 토오루
미쯔이 긴조꾸 고오교오 가부시기가이샤
쯔지 하루오
샤프 가부시기가이샤
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Priority claimed from JP35860792A external-priority patent/JP2509509B2/ja
Application filed by 카와키타 토오루, 미쯔이 긴조꾸 고오교오 가부시기가이샤, 쯔지 하루오, 샤프 가부시기가이샤 filed Critical 카와키타 토오루
Publication of KR950005125A publication Critical patent/KR950005125A/ko
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Publication of KR0123187B1 publication Critical patent/KR0123187B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
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Abstract

본 발명은 테이프케리어(필름캐리어) 및 IC를 실장한 테이프캐리어디바이스에 관한 것으로서, IC봉지수지와의 밀착성을 떨어뜨리는 일없이, 휘어짐을 현저히 작게 하고, 그 결과로서 신뢰성을 향상시킨 테이프캐리어 및 테이프캐리어디바이스를 제공하는 것을 목적으로 한 것이며, 그 구성에 있어서, 절연성필름과 그 위에 금속박막으로 형성된 패턴을 가진 필름캐리어에 있어서, IC봉지수지도포부 둘레가장자리의 패턴면에 접착성수지 오버코우트제가 도포되고, 다른 패턴면에 폴리이미드계 오버코우트제가 도포되어 있는 것을 특징으로 한 것이다.

Description

테이프캐리어 및 이것을 사용한 테이프캐리어디바이스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3 도(a) 및 (b)는, 본 발명의 액정드라이버용 테이프캐리어 및 테이프캐리어디바이스의 제 1 의 예를 표시한 개략평면도, 제 4 도는 본 발명의 테이프캐리어의 제 2 의 예를 표시한 개략평면도, 제 5 도(a) 및 (b)는, 본 발명의 액정드라이버용 테이프캐리어 및 테이프캐리어디바이스의 제 3 의 예를 표시한 개략평면도, 제 6 도(a) 및 (b)는, 본 발명의 액정드라이버용 테이프캐리어 및 테이프캐리어디바이스의 제 4 의 예를 표시한 개략평면도.

Claims (8)

  1. 절연성필름과 그 적어도 한쪽의 면위에 금속박막으로 형성된 패턴을 가진 테이프캐리어에 있어서, IC봉지수지도포부 둘레가장자리의 패턴면에 접착성수지 오버코우트제가 도포되고, 다른 패턴면에 폴리이미드수지계 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  2. 제 1 항에 있어서, 상기 IC봉지수지도포부의 단부에, IC봉지수지를 튀기는 서질을 가진 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  3. 절연성필름과 그 적어도 한쪽의 면위에 금속박막으로 형성된 패턴을 가진 테이프캐리어에 있어서, IC봉지수단도포부 둘레가장자리를 제외한 패턴면에 폴리이미드수지계 오버코우트제가 도포되고, 상기 패턴면의 단부에 접착성수지 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  4. 제 3 항에 있어서, 상기 IC봉지수지도포부 둘레가장자리의 패턴면에 접착성수지 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  5. 제 4 항에 있어서, 상기 IC봉지수지도포부의 단부에, IC봉지수지를 튀기는 성질을 가진 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  6. 제 1 항, 제 2 항, 제 3 항, 제 4 항 또는 제 5 항에 있어서, 상기 패턴면과 반대쪽의 절연성필름면의 IC봉지수지도포부 둘레가장자리에 접착성수지 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  7. 제 6 항에 있어서, 상기 패턴면과 반대쪽의 절연성필름면의 IC봉지수지도포부 둘레가장자리를 제외한 부분에, 또 오버코우트제가 도포되어 있는 것을 특징으로 하는 테이프캐리어.
  8. 특허청구범위 제 1 항~제 7 항의 어느 한 항에 기재의 테이프캐리어를 사용한 것을 특징으로 하는 테이프캐리어디바이스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930014798A 1992-12-28 1993-07-31 테이프캐리어 및 이것을 사용한 테이프캐리어디바이스 KR0123187B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-358607 1992-12-28
JP35860792A JP2509509B2 (ja) 1992-01-20 1992-12-28 テ―プキャリアおよびこれを用いたテ―プキャリアデバイス

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KR950005125A true KR950005125A (ko) 1995-02-18
KR0123187B1 KR0123187B1 (ko) 1997-11-22

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KR (1) KR0123187B1 (ko)
TW (1) TW263596B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950034696A (ko) * 1994-05-16 1995-12-28 김광호 초박형 반도체 패키지 및 그 제조방법
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
JP3343642B2 (ja) * 1996-04-26 2002-11-11 シャープ株式会社 テープキャリアパッケージ及び液晶表示装置
US6074898A (en) * 1996-09-18 2000-06-13 Sony Corporation Lead frame and integrated circuit package
JPH10173003A (ja) * 1996-12-13 1998-06-26 Sharp Corp 半導体装置とその製造方法およびフィルムキャリアテープとその製造方法
US6580157B2 (en) * 1997-06-10 2003-06-17 Micron Technology, Inc. Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
US5780923A (en) * 1997-06-10 1998-07-14 Micron Technology, Inc. Modified bus bar with Kapton™ tape or insulative material on LOC packaged part
TWI229095B (en) * 1999-04-22 2005-03-11 Ajinomoto Kk Thermosetting resin composition and flexible-circuit overcoating material comprising the same
JP3750113B2 (ja) * 2002-03-25 2006-03-01 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ及びその製造方法
WO2005038911A1 (en) * 2003-10-15 2005-04-28 Koninklijke Philips Electronics N.V. Device, system and electric element

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US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
US5227232A (en) * 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JP2982450B2 (ja) * 1991-11-26 1999-11-22 日本電気株式会社 フィルムキャリア半導体装置及びその製造方法
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置

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US5477080A (en) 1995-12-19
US5814879A (en) 1998-09-29
KR0123187B1 (ko) 1997-11-22
TW263596B (ko) 1995-11-21

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