KR890003020A - 캐리어 테이프의 칩 지지부를 시일링 하기 위한 카바 테이프 및 그 제조방법 - Google Patents

캐리어 테이프의 칩 지지부를 시일링 하기 위한 카바 테이프 및 그 제조방법 Download PDF

Info

Publication number
KR890003020A
KR890003020A KR1019880009322A KR880009322A KR890003020A KR 890003020 A KR890003020 A KR 890003020A KR 1019880009322 A KR1019880009322 A KR 1019880009322A KR 880009322 A KR880009322 A KR 880009322A KR 890003020 A KR890003020 A KR 890003020A
Authority
KR
South Korea
Prior art keywords
tape
adhesive layer
adhesive
chip
chip support
Prior art date
Application number
KR1019880009322A
Other languages
English (en)
Other versions
KR940005806B1 (ko
Inventor
가즈미 이또
가즈요시 에베
도시오 미나가와
Original Assignee
쇼오지 고오메이
에프 에스 케이 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26502829&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR890003020(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP62184986A external-priority patent/JPS6437365A/ja
Priority claimed from JP62184985A external-priority patent/JPS6437364A/ja
Application filed by 쇼오지 고오메이, 에프 에스 케이 가부시끼가이샤 filed Critical 쇼오지 고오메이
Publication of KR890003020A publication Critical patent/KR890003020A/ko
Application granted granted Critical
Publication of KR940005806B1 publication Critical patent/KR940005806B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/34—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents and having several recesses to accommodate a series of articles or quantities of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
    • B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D2575/3209—Details
    • B65D2575/3218—Details with special means for gaining access to the contents
    • B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음

Description

캐리어 테이프의 칩 지지부를 시일링 하기 위한 카바 테이프 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 A도는 본 발명의 한 구체적 실시에 따른 카바 테이프의 부분 단면 사시도. 제 1 B도는 본 발명의 또 다른 구체적 실시에 따른 카바 테이프의 부분 단면 사시도. 제 2 도는 엠보싱된 캐리어 테이프 및 본 발명에 따른 카바 테이프로 구성된 어셈블리의 부분 단면 사시도. 제 3 도는 개구를 가진 캐리어 테이프 및 본 발명에 따른 카바 테이프로 구성된 어셈블리의 부분 단면 사시도.

Claims (11)

  1. 베이스 테이프, 상기 베이스 테이프의 한표면에 형성된 접착층 및, 상기 베이스 테이프의 길이방향을 따라 상기 접착층에 형성된 비접착성 코팅물로 구성되고 비접착성 코팅물이 칩보다 넓은 폭을 가지고 상기 접착층보다 좁은 폭을 가진 것을 특징으로 하는 캐리어 테이프에 연속적이고 길이방향으로 형성된 칩 지지부를 가진 캐리어 테이프의 칩지지부에서 칩을 시일링하기 위한 카바 테이프.
  2. 제 1 항에 있어서, 상기 접착층이 압력에 민감한 접착제로 구성된 것을 특징으로 하는 카바테이프.
  3. 제 1 항에 있어서, 상기 접착층이 열에 민감한 접착제로 구성된 것을 특징으로 하는 카바테이프.
  4. 상기 항중 어느 한 항에 있어서, 상기 비접착성 코팅물이 열경화된 또는 산화경화된 잉크로 구성된 것을 특징으로 하는 카바테이프.
  5. 상기 항중 어느 한 항에 있어서, 상기 비접착성 코팅물이 정전기 방지제를 포함한 것을 특징으로 하는 카바테이프.
  6. 카바테이프가 베이스테이프, 상기 베이스테이프의 한 표면에 형성된 접착층, 상기 베이스테이프의 길이 방향을 따라 상기 접착층에 형성된 비접착성 코팅물 및 상기 베이스테이프의 다른 표면에 형성된 이형제층으로 구성되어 있고, 상기 비접착성 코팅물이 칩보다 넓은 폭을 가지고 있고 상기 접착층보다 좁은 폭을 가진 것을 특징으로 캐리어 테이프에 연속적이고 길이방향으로 형성된 칩지지부를 가진 캐리어 테이프의 칩지지부에서 칩을 시일링하기 위한 카바테이프.
  7. 베이스테이프의 한 표면에 접착층을 형성하고, 비접착성 코팅물이 칩보다 넓은 폭을 가지고 접착층보다 좁은 폭을 가지도록 상기 베이스테이프의 길이방향을 따라 상기 접착층에 비접착성 코팅물을 패턴 프린팅하는 것으로 구성된 것을 특징으로 하는 캐리어 테이프에 연속적이고 길이방향으로 형성된 칩지지부를 가진 캐리어 테이프의 칩지지부에서 칩을 시일링하기 위한 카바 테이프의 제조방법.
  8. 제 7 항에 있어서, 상기 접착층이 압력에 민감한 접착제로 구성된 것을 특징으로 하는 방법.
  9. 제 7 항에 있어서, 상기 접착층이 열에 민감한 접착제로 구성된 것을 특징으로 하는 방법.
  10. 제 7 항 내지 제10항중 어느 한 항에 있어서, 상기 비접착성 코팅물이 열경화될 수 있는 잉크로 패턴 프린팅하고 이어서 프린트된 패턴을 열경화시켜 형성하는 것을 특징으로 하는 방법.
  11. 제 7 항 내지 제10항중 어느 한 항에 있어서, 상기 비접착성 코팅물이 정전기 방지제를 포함하고 있는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880009322A 1987-07-24 1988-07-23 캐리어 테이프의 칩 수용부를 시일링 하기위한 칩 반송용 카바 테이프 및 그 제조방법 KR940005806B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP??62-184986 1987-07-24
JP62184986A JPS6437365A (en) 1987-07-24 1987-07-24 Chip body feed cover tape and production thereof
JP62184985A JPS6437364A (en) 1987-07-24 1987-07-24 Chip body feeding cover tape and production thereof
JP?62-184985 1987-07-24
JP??62-184985 1987-07-24
JP?62-184986 1987-07-24

Publications (2)

Publication Number Publication Date
KR890003020A true KR890003020A (ko) 1989-04-12
KR940005806B1 KR940005806B1 (ko) 1994-06-23

Family

ID=26502829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880009322A KR940005806B1 (ko) 1987-07-24 1988-07-23 캐리어 테이프의 칩 수용부를 시일링 하기위한 칩 반송용 카바 테이프 및 그 제조방법

Country Status (5)

Country Link
US (3) US4929486A (ko)
EP (1) EP0300838B2 (ko)
KR (1) KR940005806B1 (ko)
DE (1) DE3877846T3 (ko)
MY (1) MY103125A (ko)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0257576A (ja) * 1988-08-12 1990-02-27 Minnesota Mining & Mfg Co <3M> 電子部品収納用テープ
JP2519543B2 (ja) * 1989-10-07 1996-07-31 秀雄 浜田 粘接着剤組成物、粘接着剤組成物層および該層を有する転写シ―ト
TW203624B (ko) * 1991-02-28 1993-04-11 Sumitomo Bakelite Co
US5372836A (en) * 1992-03-27 1994-12-13 Tokyo Electron Limited Method of forming polycrystalling silicon film in process of manufacturing LCD
US5390472A (en) * 1992-06-19 1995-02-21 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
US6110378A (en) * 1993-02-25 2000-08-29 Sandia Corporation Method of using novel silico-titanates
DE4305910A1 (de) * 1993-02-26 1994-09-01 Beiersdorf Ag Selbstklebender Verdeckelungsfilm für die Verpackung elektronischer Bauelemente
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
US5340629A (en) * 1993-08-05 1994-08-23 Rodighiero Gerald D Adhesive tape
JPH07101461A (ja) * 1993-09-30 1995-04-18 Yayoi Kk エンボスキャリアテープ
TW310121U (en) * 1993-12-22 1997-07-01 Lintec Corp Cover tape
US5425991A (en) * 1994-03-25 1995-06-20 Mobil Oil Corporation Release sheet
US5447784A (en) * 1994-06-01 1995-09-05 Rexham Industries Corp. Electrostatic dissipating cover tape
US5491013A (en) * 1994-08-31 1996-02-13 Rexam Industries Corp. Static-dissipating adhesive tape
US5590787A (en) * 1995-01-04 1997-01-07 Micron Technology, Inc. UV light sensitive die-pac for securing semiconductor dies during transport
US5599621A (en) * 1995-09-29 1997-02-04 Brady Precision Tape Co. Cover tape for surface mount device packaging
US5670254A (en) * 1995-09-29 1997-09-23 Brady Precision Tape Co. Cover tape for surface mount device packaging
US6291044B1 (en) 1995-12-05 2001-09-18 John M. Chayka Packaging tape
US6030692A (en) * 1996-09-13 2000-02-29 Netpco Incorporated Cover tape for formed tape packing system and process for making same
KR100473378B1 (ko) * 1997-09-29 2005-07-07 삼성전자주식회사 자외선감응접착테이프가부착된테이프배선기판
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
US6568535B1 (en) 2000-01-14 2003-05-27 Peak International Ltd. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
US20020078777A1 (en) * 2000-12-27 2002-06-27 Witucki David E. Gear assembly
JP2002362623A (ja) * 2001-06-08 2002-12-18 Smk Corp 梱包用テープ部材及び梱包用テープ部材を用いた梱包方法
WO2005102860A1 (ja) * 2004-04-26 2005-11-03 Denki Kagaku Kogyo Kabushiki Kaisha カバーテープ及び電子部品包装用キャリアテープシステム
US20090181229A1 (en) * 2005-02-04 2009-07-16 Power Support Co., Ltd. Protective film for electronic device
US7794811B2 (en) * 2005-02-04 2010-09-14 Power Support Co., Ltd. Protective film for electronic device
JP3111410U (ja) * 2005-02-04 2005-07-28 株式会社パワーサポート 押スイッチ用保護フィルム
JP2006299019A (ja) * 2005-04-18 2006-11-02 Three M Innovative Properties Co 支持基材を有しない紫外線硬化型粘着テープまたはフィルム
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
JP5112625B2 (ja) * 2005-11-07 2013-01-09 矢崎総業株式会社 被覆電線外装シート及びワイヤーハーネス
CN101501155B (zh) 2006-08-09 2014-06-25 3M创新有限公司 具有撕开引发盖带的载带及其制作方法
KR20090049641A (ko) * 2007-11-14 2009-05-19 삼성전자주식회사 커버 테이프 및 그를 구비하는 전자부품 포장용기
US9101389B2 (en) * 2008-07-31 2015-08-11 Medtronic, Inc. Apparatus for guiding the placement of a subcutaneous device
KR101145344B1 (ko) * 2010-04-09 2012-05-14 박진성 전자 부품 이송용 커버 테이프
JP5299378B2 (ja) * 2010-08-11 2013-09-25 株式会社村田製作所 キャリアテープ、キャリアテープ製造装置、キャリアテープの製造方法
US20140120293A1 (en) * 2011-12-22 2014-05-01 Mohit Gupta Electrostatic discharge compatible dicing tape with laser scribe capability
US8962392B2 (en) * 2012-03-13 2015-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill curing method using carrier
US20160244230A1 (en) * 2015-02-24 2016-08-25 American Packaging Corporation Dissipation of static electricity on a printed film
CN110316472A (zh) * 2018-03-30 2019-10-11 玮锋科技股份有限公司 高隔离性电子包装覆盖带
US11240947B2 (en) * 2018-06-28 2022-02-01 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier tape system and components and methods of use

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2307406A (en) * 1939-09-19 1943-01-05 Lawrie L Witter Method of applying sealing strips
US2565509A (en) * 1946-07-27 1951-08-28 Balys C Marcin Manufacture of tapes and sheets with adhesive coatings on opposite sides thereof
BE541740A (ko) * 1954-10-01 1900-01-01
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3780856A (en) * 1971-07-26 1973-12-25 Medi Dose Inc Medicinal dispensing device
US4177812A (en) * 1973-08-20 1979-12-11 Minnesota Mining And Manufacturing Company Tape structure and garment closure made therewith
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4211329A (en) * 1979-04-27 1980-07-08 Milton Braverman Extender and header card for medicinal dispensing device
FR2455273A2 (fr) * 1979-04-27 1980-11-21 Probio Dms Perfectionnements apportes aux dispositifs de thromboelastographie
NL8005052A (nl) * 1980-09-08 1982-04-01 Philips Nv Verpakking voor elektrische en/of elektronische componenten.
DE3104623A1 (de) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer
EP0066339A2 (en) * 1981-05-22 1982-12-08 North American Philips Corporation Polyfoam chip carrier tape
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
JPS59158596A (ja) * 1983-02-28 1984-09-08 奥井　徳次郎 小型電子部品の収納方法
JPS6092700A (ja) * 1983-10-26 1985-05-24 株式会社東芝 フラツトパツケ−ジ集積回路素子収納装置
US4568416A (en) * 1984-06-06 1986-02-04 Tokujiro Okui Taping package method for small-size electronic parts
US4736841A (en) * 1985-02-20 1988-04-12 Murata Manufacturing Co., Ltd. Electronic component series
JPS62158673A (ja) * 1985-12-28 1987-07-14 株式会社村田製作所 テ−ピング電子部品連
US4781953A (en) * 1987-03-27 1988-11-01 Motorola Inc. Plastic carrier tape having lowered cross rails

Also Published As

Publication number Publication date
DE3877846D1 (de) 1993-03-11
EP0300838B2 (en) 1997-03-26
EP0300838B1 (en) 1993-01-27
DE3877846T3 (de) 1997-06-05
EP0300838A1 (en) 1989-01-25
MY103125A (en) 1993-04-30
US4929486A (en) 1990-05-29
US4994300A (en) 1991-02-19
DE3877846T2 (de) 1993-05-19
US5064064A (en) 1991-11-12
KR940005806B1 (ko) 1994-06-23

Similar Documents

Publication Publication Date Title
KR890003020A (ko) 캐리어 테이프의 칩 지지부를 시일링 하기 위한 카바 테이프 및 그 제조방법
KR900001568A (ko) 반도체장치용 테이핑부품
KR900012526A (ko) 전자부품 반송체
KR920011768A (ko) 열전사지용 원지 및 그 원지를 사용한 열전사지
KR900003479A (ko) 드랙 감소재
KR870008989A (ko) 표면피복제
DE69218723D1 (de) Metallisierte Filmstruktur und Verfahren
ES2056142T3 (es) Etiqueta autoadhesiva y procedimiento de impresion.
DE60105795D1 (de) Magnetstreifen mit einer klebeschicht
ES2098755T3 (es) Elemento de registro termosensible.
ATE103718T1 (de) Schneidemaskierfilm.
KR880700616A (ko) 다층 프린트 기판
ATE262422T1 (de) Schiebebilder
JPS60133029U (ja) 屋根下地用防水シ−ト
KR890008396A (ko) 직물지에 금속박형 반사무늬를 형성하는 방법
JPS5957545U (ja) 透明粘着シ−ト
FI892622A (fi) Sjaelvlimmande saekerhetsdataunderlag och dess anvaendning foer att goera handlingar foerfalskningsodugliga.
JPS5839859U (ja) 色彩模様を有する金属箔積層装飾板
JPS60192472U (ja) フレキシブル回路基板
KR840006861A (ko) 박막자기헤드(薄膜磁氣 head)의 제조방법
JPS5921939U (ja) アルミニウム基材
KR890004897A (ko) 자동차 커버지의 제조방법
KR900004898A (ko) 점착재 및 그의 제조 방법
KR940003435A (ko) 알루미늄 회로기판의 제조방법 및 그 회로기판
JPS59152769U (ja) アデイテイブ印刷配線板用基板

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060612

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee