JPWO2025094343A5 - - Google Patents

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Publication number
JPWO2025094343A5
JPWO2025094343A5 JP2024534111A JP2024534111A JPWO2025094343A5 JP WO2025094343 A5 JPWO2025094343 A5 JP WO2025094343A5 JP 2024534111 A JP2024534111 A JP 2024534111A JP 2024534111 A JP2024534111 A JP 2024534111A JP WO2025094343 A5 JPWO2025094343 A5 JP WO2025094343A5
Authority
JP
Japan
Prior art keywords
electrode
semiconductor manufacturing
manufacturing equipment
member according
equipment member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024534111A
Other languages
English (en)
Japanese (ja)
Other versions
JP7704985B1 (ja
JPWO2025094343A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/039549 external-priority patent/WO2025094343A1/ja
Publication of JPWO2025094343A1 publication Critical patent/JPWO2025094343A1/ja
Application granted granted Critical
Publication of JP7704985B1 publication Critical patent/JP7704985B1/ja
Publication of JPWO2025094343A5 publication Critical patent/JPWO2025094343A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024534111A 2023-11-02 2023-11-02 半導体製造装置用部材 Active JP7704985B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/039549 WO2025094343A1 (ja) 2023-11-02 2023-11-02 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025094343A1 JPWO2025094343A1 (https=) 2025-05-08
JP7704985B1 JP7704985B1 (ja) 2025-07-08
JPWO2025094343A5 true JPWO2025094343A5 (https=) 2025-10-02

Family

ID=95561712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024534111A Active JP7704985B1 (ja) 2023-11-02 2023-11-02 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250149370A1 (https=)
JP (1) JP7704985B1 (https=)
TW (1) TW202520417A (https=)
WO (1) WO2025094343A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
EP3098838B1 (en) * 2014-01-22 2021-01-27 ULVAC, Inc. Plasma treatment device and wafer transportation tray
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP7271330B2 (ja) * 2019-06-18 2023-05-11 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP7414751B2 (ja) * 2021-02-04 2024-01-16 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7677862B2 (ja) * 2021-09-17 2025-05-15 東京エレクトロン株式会社 プラズマ処理装置
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
TW202326801A (zh) * 2021-11-26 2023-07-01 日商東京威力科創股份有限公司 靜電吸盤及電漿處理裝置
JP7554220B2 (ja) * 2022-03-08 2024-09-19 日本碍子株式会社 半導体製造装置用部材
JP7622002B2 (ja) * 2022-03-31 2025-01-27 日本碍子株式会社 ウエハ載置台
WO2025094344A1 (ja) * 2023-11-02 2025-05-08 日本碍子株式会社 半導体製造装置用部材

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