JPWO2025094343A1 - - Google Patents
Info
- Publication number
- JPWO2025094343A1 JPWO2025094343A1 JP2024534111A JP2024534111A JPWO2025094343A1 JP WO2025094343 A1 JPWO2025094343 A1 JP WO2025094343A1 JP 2024534111 A JP2024534111 A JP 2024534111A JP 2024534111 A JP2024534111 A JP 2024534111A JP WO2025094343 A1 JPWO2025094343 A1 JP WO2025094343A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/039549 WO2025094343A1 (ja) | 2023-11-02 | 2023-11-02 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025094343A1 true JPWO2025094343A1 (https=) | 2025-05-08 |
| JP7704985B1 JP7704985B1 (ja) | 2025-07-08 |
| JPWO2025094343A5 JPWO2025094343A5 (https=) | 2025-10-02 |
Family
ID=95561712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534111A Active JP7704985B1 (ja) | 2023-11-02 | 2023-11-02 | 半導体製造装置用部材 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250149370A1 (https=) |
| JP (1) | JP7704985B1 (https=) |
| TW (1) | TW202520417A (https=) |
| WO (1) | WO2025094343A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4421874B2 (ja) * | 2003-10-31 | 2010-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| EP3098838B1 (en) * | 2014-01-22 | 2021-01-27 | ULVAC, Inc. | Plasma treatment device and wafer transportation tray |
| US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
| JP7271330B2 (ja) * | 2019-06-18 | 2023-05-11 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP7414751B2 (ja) * | 2021-02-04 | 2024-01-16 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
| JP7677862B2 (ja) * | 2021-09-17 | 2025-05-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2023044634A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| TW202326801A (zh) * | 2021-11-26 | 2023-07-01 | 日商東京威力科創股份有限公司 | 靜電吸盤及電漿處理裝置 |
| JP7554220B2 (ja) * | 2022-03-08 | 2024-09-19 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7622002B2 (ja) * | 2022-03-31 | 2025-01-27 | 日本碍子株式会社 | ウエハ載置台 |
| WO2025094344A1 (ja) * | 2023-11-02 | 2025-05-08 | 日本碍子株式会社 | 半導体製造装置用部材 |
-
2023
- 2023-11-02 JP JP2024534111A patent/JP7704985B1/ja active Active
- 2023-11-02 WO PCT/JP2023/039549 patent/WO2025094343A1/ja active Pending
-
2024
- 2024-04-29 TW TW113115955A patent/TW202520417A/zh unknown
- 2024-06-06 US US18/735,576 patent/US20250149370A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025094343A1 (ja) | 2025-05-08 |
| JP7704985B1 (ja) | 2025-07-08 |
| TW202520417A (zh) | 2025-05-16 |
| US20250149370A1 (en) | 2025-05-08 |
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