JP7704985B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
JP7704985B1
JP7704985B1 JP2024534111A JP2024534111A JP7704985B1 JP 7704985 B1 JP7704985 B1 JP 7704985B1 JP 2024534111 A JP2024534111 A JP 2024534111A JP 2024534111 A JP2024534111 A JP 2024534111A JP 7704985 B1 JP7704985 B1 JP 7704985B1
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Japan
Prior art keywords
electrode
semiconductor manufacturing
manufacturing equipment
internal
bias
Prior art date
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JP2024534111A
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English (en)
Japanese (ja)
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JPWO2025094343A5 (https=
JPWO2025094343A1 (https=
Inventor
央史 竹林
隼也 和氣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
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Publication date
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Publication of JPWO2025094343A1 publication Critical patent/JPWO2025094343A1/ja
Application granted granted Critical
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Publication of JPWO2025094343A5 publication Critical patent/JPWO2025094343A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2024534111A 2023-11-02 2023-11-02 半導体製造装置用部材 Active JP7704985B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/039549 WO2025094343A1 (ja) 2023-11-02 2023-11-02 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025094343A1 JPWO2025094343A1 (https=) 2025-05-08
JP7704985B1 true JP7704985B1 (ja) 2025-07-08
JPWO2025094343A5 JPWO2025094343A5 (https=) 2025-10-02

Family

ID=95561712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024534111A Active JP7704985B1 (ja) 2023-11-02 2023-11-02 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250149370A1 (https=)
JP (1) JP7704985B1 (https=)
TW (1) TW202520417A (https=)
WO (1) WO2025094343A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136350A (ja) * 2003-10-31 2005-05-26 Tokyo Electron Ltd 静電吸着装置、プラズマ処理装置及びプラズマ処理方法
JP2019522889A (ja) * 2016-06-07 2019-08-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高周波結合による高電力静電チャック設計

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3098838B1 (en) * 2014-01-22 2021-01-27 ULVAC, Inc. Plasma treatment device and wafer transportation tray
JP7271330B2 (ja) * 2019-06-18 2023-05-11 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP7414751B2 (ja) * 2021-02-04 2024-01-16 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7677862B2 (ja) * 2021-09-17 2025-05-15 東京エレクトロン株式会社 プラズマ処理装置
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
TW202326801A (zh) * 2021-11-26 2023-07-01 日商東京威力科創股份有限公司 靜電吸盤及電漿處理裝置
JP7554220B2 (ja) * 2022-03-08 2024-09-19 日本碍子株式会社 半導体製造装置用部材
JP7622002B2 (ja) * 2022-03-31 2025-01-27 日本碍子株式会社 ウエハ載置台
WO2025094344A1 (ja) * 2023-11-02 2025-05-08 日本碍子株式会社 半導体製造装置用部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136350A (ja) * 2003-10-31 2005-05-26 Tokyo Electron Ltd 静電吸着装置、プラズマ処理装置及びプラズマ処理方法
JP2019522889A (ja) * 2016-06-07 2019-08-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高周波結合による高電力静電チャック設計

Also Published As

Publication number Publication date
WO2025094343A1 (ja) 2025-05-08
TW202520417A (zh) 2025-05-16
JPWO2025094343A1 (https=) 2025-05-08
US20250149370A1 (en) 2025-05-08

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