JPWO2025013298A5 - - Google Patents

Info

Publication number
JPWO2025013298A5
JPWO2025013298A5 JP2025532361A JP2025532361A JPWO2025013298A5 JP WO2025013298 A5 JPWO2025013298 A5 JP WO2025013298A5 JP 2025532361 A JP2025532361 A JP 2025532361A JP 2025532361 A JP2025532361 A JP 2025532361A JP WO2025013298 A5 JPWO2025013298 A5 JP WO2025013298A5
Authority
JP
Japan
Prior art keywords
electrode
wiring
dummy
dummy electrode
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025532361A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025013298A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/025947 external-priority patent/WO2025013298A1/ja
Publication of JPWO2025013298A1 publication Critical patent/JPWO2025013298A1/ja
Publication of JPWO2025013298A5 publication Critical patent/JPWO2025013298A5/ja
Pending legal-status Critical Current

Links

JP2025532361A 2023-07-13 2023-07-13 Pending JPWO2025013298A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/025947 WO2025013298A1 (ja) 2023-07-13 2023-07-13 配線基板の製造方法、半導体装置の製造方法、配線基板、及び、半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025013298A1 JPWO2025013298A1 (https=) 2025-01-16
JPWO2025013298A5 true JPWO2025013298A5 (https=) 2026-04-10

Family

ID=94214865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025532361A Pending JPWO2025013298A1 (https=) 2023-07-13 2023-07-13

Country Status (4)

Country Link
JP (1) JPWO2025013298A1 (https=)
CN (1) CN121002653A (https=)
TW (1) TW202508392A (https=)
WO (1) WO2025013298A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091385A (ja) * 2006-09-29 2008-04-17 Toppan Printing Co Ltd 多層回路配線板及び半導体装置
JP5007250B2 (ja) * 2008-02-14 2012-08-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5503466B2 (ja) * 2010-08-31 2014-05-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2012191123A (ja) * 2011-03-14 2012-10-04 Renesas Electronics Corp 半導体集積回路装置およびその製造方法ならびにそれを用いた電子システム

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