JPWO2025013298A1 - - Google Patents
Info
- Publication number
- JPWO2025013298A1 JPWO2025013298A1 JP2025532361A JP2025532361A JPWO2025013298A1 JP WO2025013298 A1 JPWO2025013298 A1 JP WO2025013298A1 JP 2025532361 A JP2025532361 A JP 2025532361A JP 2025532361 A JP2025532361 A JP 2025532361A JP WO2025013298 A1 JPWO2025013298 A1 JP WO2025013298A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/025947 WO2025013298A1 (ja) | 2023-07-13 | 2023-07-13 | 配線基板の製造方法、半導体装置の製造方法、配線基板、及び、半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025013298A1 true JPWO2025013298A1 (https=) | 2025-01-16 |
| JPWO2025013298A5 JPWO2025013298A5 (https=) | 2026-04-10 |
Family
ID=94214865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025532361A Pending JPWO2025013298A1 (https=) | 2023-07-13 | 2023-07-13 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025013298A1 (https=) |
| CN (1) | CN121002653A (https=) |
| TW (1) | TW202508392A (https=) |
| WO (1) | WO2025013298A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091385A (ja) * | 2006-09-29 | 2008-04-17 | Toppan Printing Co Ltd | 多層回路配線板及び半導体装置 |
| JP5007250B2 (ja) * | 2008-02-14 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5503466B2 (ja) * | 2010-08-31 | 2014-05-28 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2012191123A (ja) * | 2011-03-14 | 2012-10-04 | Renesas Electronics Corp | 半導体集積回路装置およびその製造方法ならびにそれを用いた電子システム |
-
2023
- 2023-07-13 CN CN202380097456.1A patent/CN121002653A/zh active Pending
- 2023-07-13 WO PCT/JP2023/025947 patent/WO2025013298A1/ja active Pending
- 2023-07-13 JP JP2025532361A patent/JPWO2025013298A1/ja active Pending
-
2024
- 2024-07-12 TW TW113126149A patent/TW202508392A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025013298A1 (ja) | 2025-01-16 |
| TW202508392A (zh) | 2025-02-16 |
| CN121002653A (zh) | 2025-11-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251016 |