JPWO2024195461A5 - - Google Patents

Info

Publication number
JPWO2024195461A5
JPWO2024195461A5 JP2025508264A JP2025508264A JPWO2024195461A5 JP WO2024195461 A5 JPWO2024195461 A5 JP WO2024195461A5 JP 2025508264 A JP2025508264 A JP 2025508264A JP 2025508264 A JP2025508264 A JP 2025508264A JP WO2024195461 A5 JPWO2024195461 A5 JP WO2024195461A5
Authority
JP
Japan
Prior art keywords
electrode
main surface
opening
interlayer film
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025508264A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024195461A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/007383 external-priority patent/WO2024195461A1/ja
Publication of JPWO2024195461A1 publication Critical patent/JPWO2024195461A1/ja
Publication of JPWO2024195461A5 publication Critical patent/JPWO2024195461A5/ja
Pending legal-status Critical Current

Links

JP2025508264A 2023-03-20 2024-02-28 Pending JPWO2024195461A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023044003 2023-03-20
PCT/JP2024/007383 WO2024195461A1 (ja) 2023-03-20 2024-02-28 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024195461A1 JPWO2024195461A1 (https=) 2024-09-26
JPWO2024195461A5 true JPWO2024195461A5 (https=) 2025-12-09

Family

ID=92841794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025508264A Pending JPWO2024195461A1 (https=) 2023-03-20 2024-02-28

Country Status (5)

Country Link
US (1) US20260013201A1 (https=)
JP (1) JPWO2024195461A1 (https=)
CN (1) CN120958968A (https=)
DE (1) DE112024001317T5 (https=)
WO (1) WO2024195461A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175124A (ja) * 1983-03-24 1984-10-03 Toshiba Corp 半導体装置の製造方法
JPS61296740A (ja) * 1985-06-25 1986-12-27 Nec Kansai Ltd 半導体装置
JPH05198589A (ja) * 1992-01-23 1993-08-06 Seiko Epson Corp 半導体装置及び半導体装置の製造方法
JP4501533B2 (ja) * 2004-05-31 2010-07-14 株式会社デンソー 半導体装置の製造方法
JP2011109021A (ja) * 2009-11-20 2011-06-02 Renesas Electronics Corp 半導体装置
US9543427B2 (en) * 2014-09-04 2017-01-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device and method for fabricating the same
JP7028093B2 (ja) * 2017-11-08 2022-03-02 富士電機株式会社 半導体装置
JP6626541B2 (ja) * 2018-08-09 2019-12-25 ローム株式会社 半導体装置

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