JPWO2024185313A5 - - Google Patents

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Publication number
JPWO2024185313A5
JPWO2024185313A5 JP2025505104A JP2025505104A JPWO2024185313A5 JP WO2024185313 A5 JPWO2024185313 A5 JP WO2024185313A5 JP 2025505104 A JP2025505104 A JP 2025505104A JP 2025505104 A JP2025505104 A JP 2025505104A JP WO2024185313 A5 JPWO2024185313 A5 JP WO2024185313A5
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JP
Japan
Prior art keywords
region
trench
doping concentration
semiconductor device
semiconductor substrate
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Pending
Application number
JP2025505104A
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English (en)
Japanese (ja)
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JPWO2024185313A1 (https=
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Priority claimed from PCT/JP2024/001519 external-priority patent/WO2024185313A1/ja
Publication of JPWO2024185313A1 publication Critical patent/JPWO2024185313A1/ja
Publication of JPWO2024185313A5 publication Critical patent/JPWO2024185313A5/ja
Pending legal-status Critical Current

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JP2025505104A 2023-03-07 2024-01-19 Pending JPWO2024185313A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023034677 2023-03-07
PCT/JP2024/001519 WO2024185313A1 (ja) 2023-03-07 2024-01-19 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024185313A1 JPWO2024185313A1 (https=) 2024-09-12
JPWO2024185313A5 true JPWO2024185313A5 (https=) 2025-05-19

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ID=92674386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505104A Pending JPWO2024185313A1 (https=) 2023-03-07 2024-01-19

Country Status (5)

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US (1) US20250194228A1 (https=)
JP (1) JPWO2024185313A1 (https=)
CN (1) CN119836854A (https=)
DE (1) DE112024000109T5 (https=)
WO (1) WO2024185313A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5707681B2 (ja) * 2009-03-04 2015-04-30 富士電機株式会社 半導体装置およびその製造方法
JP6154292B2 (ja) * 2013-11-06 2017-06-28 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP6472714B2 (ja) * 2015-06-03 2019-02-20 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2018030440A1 (ja) * 2016-08-12 2018-02-15 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6984347B2 (ja) * 2017-11-24 2021-12-17 富士電機株式会社 半導体装置
JP7456520B2 (ja) * 2020-12-07 2024-03-27 富士電機株式会社 半導体装置
CN116349006A (zh) * 2021-05-11 2023-06-27 富士电机株式会社 半导体装置

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