JPWO2024176988A5 - - Google Patents

Info

Publication number
JPWO2024176988A5
JPWO2024176988A5 JP2025502699A JP2025502699A JPWO2024176988A5 JP WO2024176988 A5 JPWO2024176988 A5 JP WO2024176988A5 JP 2025502699 A JP2025502699 A JP 2025502699A JP 2025502699 A JP2025502699 A JP 2025502699A JP WO2024176988 A5 JPWO2024176988 A5 JP WO2024176988A5
Authority
JP
Japan
Prior art keywords
resin portion
semiconductor device
conductor
resin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025502699A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024176988A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005655 external-priority patent/WO2024176988A1/ja
Publication of JPWO2024176988A1 publication Critical patent/JPWO2024176988A1/ja
Publication of JPWO2024176988A5 publication Critical patent/JPWO2024176988A5/ja
Pending legal-status Critical Current

Links

JP2025502699A 2023-02-21 2024-02-19 Pending JPWO2024176988A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023025220 2023-02-21
PCT/JP2024/005655 WO2024176988A1 (ja) 2023-02-21 2024-02-19 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024176988A1 JPWO2024176988A1 (https=) 2024-08-29
JPWO2024176988A5 true JPWO2024176988A5 (https=) 2025-11-04

Family

ID=92501211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025502699A Pending JPWO2024176988A1 (https=) 2023-02-21 2024-02-19

Country Status (3)

Country Link
US (1) US20250364404A1 (https=)
JP (1) JPWO2024176988A1 (https=)
WO (1) WO2024176988A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319094A (ja) * 2005-05-12 2006-11-24 Fujikura Ltd 半導体装置およびその製造方法
JP2010109269A (ja) * 2008-10-31 2010-05-13 Panasonic Corp 半導体装置
JP2011253944A (ja) * 2010-06-02 2011-12-15 Toshiba Corp 半導体装置及びその製造方法
CN205081096U (zh) * 2013-02-28 2016-03-09 株式会社村田制作所 Esd保护器件
CN105051886B (zh) * 2013-03-25 2018-06-08 瑞萨电子株式会社 半导体装置及其制造方法
US9640607B2 (en) * 2015-03-04 2017-05-02 Tower Semiconductor Ltd. Die including a high voltage capacitor

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