JPWO2024084994A5 - - Google Patents

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Publication number
JPWO2024084994A5
JPWO2024084994A5 JP2024551483A JP2024551483A JPWO2024084994A5 JP WO2024084994 A5 JPWO2024084994 A5 JP WO2024084994A5 JP 2024551483 A JP2024551483 A JP 2024551483A JP 2024551483 A JP2024551483 A JP 2024551483A JP WO2024084994 A5 JPWO2024084994 A5 JP WO2024084994A5
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JP
Japan
Prior art keywords
copper layer
layer
hole
copper
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551483A
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English (en)
Japanese (ja)
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JPWO2024084994A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036476 external-priority patent/WO2024084994A1/ja
Publication of JPWO2024084994A1 publication Critical patent/JPWO2024084994A1/ja
Publication of JPWO2024084994A5 publication Critical patent/JPWO2024084994A5/ja
Pending legal-status Critical Current

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JP2024551483A 2022-10-20 2023-10-06 Pending JPWO2024084994A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022168266 2022-10-20
PCT/JP2023/036476 WO2024084994A1 (ja) 2022-10-20 2023-10-06 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024084994A1 JPWO2024084994A1 (https=) 2024-04-25
JPWO2024084994A5 true JPWO2024084994A5 (https=) 2025-07-02

Family

ID=90737408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551483A Pending JPWO2024084994A1 (https=) 2022-10-20 2023-10-06

Country Status (3)

Country Link
JP (1) JPWO2024084994A1 (https=)
CN (1) CN119999344A (https=)
WO (1) WO2024084994A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144441A (ja) * 1999-11-05 2001-05-25 Three M Innovative Properties Co 多層両面配線基板とその製造方法
JP2009094191A (ja) * 2007-10-05 2009-04-30 Ube Ind Ltd 多層配線基板の製造方法
EP2566311A1 (en) * 2011-09-02 2013-03-06 Atotech Deutschland GmbH Direct plating method

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