JPWO2024084994A1 - - Google Patents
Info
- Publication number
- JPWO2024084994A1 JPWO2024084994A1 JP2024551483A JP2024551483A JPWO2024084994A1 JP WO2024084994 A1 JPWO2024084994 A1 JP WO2024084994A1 JP 2024551483 A JP2024551483 A JP 2024551483A JP 2024551483 A JP2024551483 A JP 2024551483A JP WO2024084994 A1 JPWO2024084994 A1 JP WO2024084994A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022168266 | 2022-10-20 | ||
| PCT/JP2023/036476 WO2024084994A1 (ja) | 2022-10-20 | 2023-10-06 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024084994A1 true JPWO2024084994A1 (https=) | 2024-04-25 |
| JPWO2024084994A5 JPWO2024084994A5 (https=) | 2025-07-02 |
Family
ID=90737408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024551483A Pending JPWO2024084994A1 (https=) | 2022-10-20 | 2023-10-06 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024084994A1 (https=) |
| CN (1) | CN119999344A (https=) |
| WO (1) | WO2024084994A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144441A (ja) * | 1999-11-05 | 2001-05-25 | Three M Innovative Properties Co | 多層両面配線基板とその製造方法 |
| JP2009094191A (ja) * | 2007-10-05 | 2009-04-30 | Ube Ind Ltd | 多層配線基板の製造方法 |
| EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
-
2023
- 2023-10-06 WO PCT/JP2023/036476 patent/WO2024084994A1/ja not_active Ceased
- 2023-10-06 JP JP2024551483A patent/JPWO2024084994A1/ja active Pending
- 2023-10-06 CN CN202380070350.2A patent/CN119999344A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN119999344A (zh) | 2025-05-13 |
| WO2024084994A1 (ja) | 2024-04-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250304 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260421 |