JPWO2024018798A5 - - Google Patents

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Publication number
JPWO2024018798A5
JPWO2024018798A5 JP2024534973A JP2024534973A JPWO2024018798A5 JP WO2024018798 A5 JPWO2024018798 A5 JP WO2024018798A5 JP 2024534973 A JP2024534973 A JP 2024534973A JP 2024534973 A JP2024534973 A JP 2024534973A JP WO2024018798 A5 JPWO2024018798 A5 JP WO2024018798A5
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JP
Japan
Prior art keywords
layer
semiconductor device
insulating layer
wiring layer
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024534973A
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English (en)
Japanese (ja)
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JPWO2024018798A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2023/022613 external-priority patent/WO2024018798A1/ja
Publication of JPWO2024018798A1 publication Critical patent/JPWO2024018798A1/ja
Publication of JPWO2024018798A5 publication Critical patent/JPWO2024018798A5/ja
Pending legal-status Critical Current

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JP2024534973A 2022-07-22 2023-06-19 Pending JPWO2024018798A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022117162 2022-07-22
PCT/JP2023/022613 WO2024018798A1 (ja) 2022-07-22 2023-06-19 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024018798A1 JPWO2024018798A1 (https=) 2024-01-25
JPWO2024018798A5 true JPWO2024018798A5 (https=) 2025-04-01

Family

ID=89617638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024534973A Pending JPWO2024018798A1 (https=) 2022-07-22 2023-06-19

Country Status (2)

Country Link
JP (1) JPWO2024018798A1 (https=)
WO (1) WO2024018798A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5732948B2 (ja) * 2011-03-23 2015-06-10 富士通セミコンダクター株式会社 半導体装置の製造方法
JP5799541B2 (ja) * 2011-03-25 2015-10-28 株式会社ソシオネクスト 半導体装置及びその製造方法
JP5829562B2 (ja) * 2012-03-28 2015-12-09 ルネサスエレクトロニクス株式会社 半導体装置
JP7741087B2 (ja) * 2020-10-16 2025-09-17 ローム株式会社 半導体装置

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