JPWO2024018798A1 - - Google Patents
Info
- Publication number
- JPWO2024018798A1 JPWO2024018798A1 JP2024534973A JP2024534973A JPWO2024018798A1 JP WO2024018798 A1 JPWO2024018798 A1 JP WO2024018798A1 JP 2024534973 A JP2024534973 A JP 2024534973A JP 2024534973 A JP2024534973 A JP 2024534973A JP WO2024018798 A1 JPWO2024018798 A1 JP WO2024018798A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022117162 | 2022-07-22 | ||
| PCT/JP2023/022613 WO2024018798A1 (ja) | 2022-07-22 | 2023-06-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024018798A1 true JPWO2024018798A1 (https=) | 2024-01-25 |
| JPWO2024018798A5 JPWO2024018798A5 (https=) | 2025-04-01 |
Family
ID=89617638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534973A Pending JPWO2024018798A1 (https=) | 2022-07-22 | 2023-06-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024018798A1 (https=) |
| WO (1) | WO2024018798A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5732948B2 (ja) * | 2011-03-23 | 2015-06-10 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| JP5799541B2 (ja) * | 2011-03-25 | 2015-10-28 | 株式会社ソシオネクスト | 半導体装置及びその製造方法 |
| JP5829562B2 (ja) * | 2012-03-28 | 2015-12-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP7741087B2 (ja) * | 2020-10-16 | 2025-09-17 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-06-19 JP JP2024534973A patent/JPWO2024018798A1/ja active Pending
- 2023-06-19 WO PCT/JP2023/022613 patent/WO2024018798A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024018798A1 (ja) | 2024-01-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241218 |