JPWO2023189513A5 - - Google Patents
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- Publication number
- JPWO2023189513A5 JPWO2023189513A5 JP2024511717A JP2024511717A JPWO2023189513A5 JP WO2023189513 A5 JPWO2023189513 A5 JP WO2023189513A5 JP 2024511717 A JP2024511717 A JP 2024511717A JP 2024511717 A JP2024511717 A JP 2024511717A JP WO2023189513 A5 JPWO2023189513 A5 JP WO2023189513A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- wiring board
- board according
- crystallites
- silica particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022056142 | 2022-03-30 | ||
| PCT/JP2023/009735 WO2023189513A1 (ja) | 2022-03-30 | 2023-03-13 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189513A1 JPWO2023189513A1 (https=) | 2023-10-05 |
| JPWO2023189513A5 true JPWO2023189513A5 (https=) | 2024-11-27 |
Family
ID=88200946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511717A Pending JPWO2023189513A1 (https=) | 2022-03-30 | 2023-03-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250185162A1 (https=) |
| EP (1) | EP4503867A1 (https=) |
| JP (1) | JPWO2023189513A1 (https=) |
| CN (1) | CN118947228A (https=) |
| WO (1) | WO2023189513A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4197110B2 (ja) * | 2001-08-07 | 2008-12-17 | 三井金属鉱業株式会社 | 混合銅粉、その混合銅粉の製造方法、その混合銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板 |
| JP2003277852A (ja) | 2002-03-25 | 2003-10-02 | Kyocera Corp | 銅メタライズ組成物およびセラミック配線基板 |
| JP2004006624A (ja) * | 2002-03-27 | 2004-01-08 | Kyocera Corp | 配線基板及びその製造方法 |
| JP4528502B2 (ja) * | 2002-07-17 | 2010-08-18 | 日本特殊陶業株式会社 | 配線基板 |
| JP4703212B2 (ja) * | 2005-02-21 | 2011-06-15 | 京セラ株式会社 | 配線基板及びその製造方法 |
| JP4781189B2 (ja) * | 2006-07-27 | 2011-09-28 | 京セラ株式会社 | 配線基板 |
| JP2008159726A (ja) * | 2006-12-22 | 2008-07-10 | Kyocera Corp | 多層配線基板 |
| KR101522806B1 (ko) * | 2011-07-14 | 2015-05-26 | 가부시끼가이샤 도시바 | 세라믹스 회로 기판 |
| EP3104400B1 (en) * | 2014-02-04 | 2022-08-31 | Murata Manufacturing Co., Ltd. | Manufacturing method of electronic component module |
| JP6260731B1 (ja) * | 2017-02-15 | 2018-01-17 | Tdk株式会社 | ガラスセラミックス焼結体およびコイル電子部品 |
-
2023
- 2023-03-13 WO PCT/JP2023/009735 patent/WO2023189513A1/ja not_active Ceased
- 2023-03-13 JP JP2024511717A patent/JPWO2023189513A1/ja active Pending
- 2023-03-13 US US18/851,565 patent/US20250185162A1/en active Pending
- 2023-03-13 EP EP23779533.1A patent/EP4503867A1/en not_active Withdrawn
- 2023-03-13 CN CN202380028008.6A patent/CN118947228A/zh active Pending
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