JPWO2023189513A5 - - Google Patents

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Publication number
JPWO2023189513A5
JPWO2023189513A5 JP2024511717A JP2024511717A JPWO2023189513A5 JP WO2023189513 A5 JPWO2023189513 A5 JP WO2023189513A5 JP 2024511717 A JP2024511717 A JP 2024511717A JP 2024511717 A JP2024511717 A JP 2024511717A JP WO2023189513 A5 JPWO2023189513 A5 JP WO2023189513A5
Authority
JP
Japan
Prior art keywords
conductor layer
wiring board
board according
crystallites
silica particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511717A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189513A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/009735 external-priority patent/WO2023189513A1/ja
Publication of JPWO2023189513A1 publication Critical patent/JPWO2023189513A1/ja
Publication of JPWO2023189513A5 publication Critical patent/JPWO2023189513A5/ja
Pending legal-status Critical Current

Links

JP2024511717A 2022-03-30 2023-03-13 Pending JPWO2023189513A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022056142 2022-03-30
PCT/JP2023/009735 WO2023189513A1 (ja) 2022-03-30 2023-03-13 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023189513A1 JPWO2023189513A1 (https=) 2023-10-05
JPWO2023189513A5 true JPWO2023189513A5 (https=) 2024-11-27

Family

ID=88200946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511717A Pending JPWO2023189513A1 (https=) 2022-03-30 2023-03-13

Country Status (5)

Country Link
US (1) US20250185162A1 (https=)
EP (1) EP4503867A1 (https=)
JP (1) JPWO2023189513A1 (https=)
CN (1) CN118947228A (https=)
WO (1) WO2023189513A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197110B2 (ja) * 2001-08-07 2008-12-17 三井金属鉱業株式会社 混合銅粉、その混合銅粉の製造方法、その混合銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004006624A (ja) * 2002-03-27 2004-01-08 Kyocera Corp 配線基板及びその製造方法
JP4528502B2 (ja) * 2002-07-17 2010-08-18 日本特殊陶業株式会社 配線基板
JP4703212B2 (ja) * 2005-02-21 2011-06-15 京セラ株式会社 配線基板及びその製造方法
JP4781189B2 (ja) * 2006-07-27 2011-09-28 京セラ株式会社 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
JP6129738B2 (ja) * 2011-07-14 2017-05-17 株式会社東芝 セラミックス回路基板
JP6337909B2 (ja) * 2014-02-04 2018-06-06 株式会社村田製作所 電子部品モジュールの製造方法
JP6260731B1 (ja) * 2017-02-15 2018-01-17 Tdk株式会社 ガラスセラミックス焼結体およびコイル電子部品

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