JPWO2023189513A1 - - Google Patents

Info

Publication number
JPWO2023189513A1
JPWO2023189513A1 JP2024511717A JP2024511717A JPWO2023189513A1 JP WO2023189513 A1 JPWO2023189513 A1 JP WO2023189513A1 JP 2024511717 A JP2024511717 A JP 2024511717A JP 2024511717 A JP2024511717 A JP 2024511717A JP WO2023189513 A1 JPWO2023189513 A1 JP WO2023189513A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511717A
Other languages
Japanese (ja)
Other versions
JPWO2023189513A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189513A1 publication Critical patent/JPWO2023189513A1/ja
Publication of JPWO2023189513A5 publication Critical patent/JPWO2023189513A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2024511717A 2022-03-30 2023-03-13 Pending JPWO2023189513A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022056142 2022-03-30
PCT/JP2023/009735 WO2023189513A1 (ja) 2022-03-30 2023-03-13 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023189513A1 true JPWO2023189513A1 (https=) 2023-10-05
JPWO2023189513A5 JPWO2023189513A5 (https=) 2024-11-27

Family

ID=88200946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511717A Pending JPWO2023189513A1 (https=) 2022-03-30 2023-03-13

Country Status (5)

Country Link
US (1) US20250185162A1 (https=)
EP (1) EP4503867A1 (https=)
JP (1) JPWO2023189513A1 (https=)
CN (1) CN118947228A (https=)
WO (1) WO2023189513A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123537A (ja) * 2001-08-07 2003-04-25 Mitsui Mining & Smelting Co Ltd 混合銅粉、その混合銅粉の製造方法、その混合銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板
JP2004006624A (ja) * 2002-03-27 2004-01-08 Kyocera Corp 配線基板及びその製造方法
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2006229144A (ja) * 2005-02-21 2006-08-31 Kyocera Corp 配線基板及びその製造方法
JP2008034551A (ja) * 2006-07-27 2008-02-14 Kyocera Corp 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
WO2013008920A1 (ja) * 2011-07-14 2013-01-17 株式会社東芝 セラミックス回路基板
WO2015118982A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 電子部品モジュール、および電子部品モジュールの製造方法
JP2018131353A (ja) * 2017-02-15 2018-08-23 Tdk株式会社 ガラスセラミックス焼結体およびコイル電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123537A (ja) * 2001-08-07 2003-04-25 Mitsui Mining & Smelting Co Ltd 混合銅粉、その混合銅粉の製造方法、その混合銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板
JP2004006624A (ja) * 2002-03-27 2004-01-08 Kyocera Corp 配線基板及びその製造方法
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2006229144A (ja) * 2005-02-21 2006-08-31 Kyocera Corp 配線基板及びその製造方法
JP2008034551A (ja) * 2006-07-27 2008-02-14 Kyocera Corp 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
WO2013008920A1 (ja) * 2011-07-14 2013-01-17 株式会社東芝 セラミックス回路基板
WO2015118982A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 電子部品モジュール、および電子部品モジュールの製造方法
JP2018131353A (ja) * 2017-02-15 2018-08-23 Tdk株式会社 ガラスセラミックス焼結体およびコイル電子部品

Also Published As

Publication number Publication date
EP4503867A1 (en) 2025-02-05
CN118947228A (zh) 2024-11-12
US20250185162A1 (en) 2025-06-05
WO2023189513A1 (ja) 2023-10-05

Similar Documents

Publication Publication Date Title
JPWO2023189338A1 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
JPWO2023189513A1 (https=)
BR102023001877A2 (https=)
BY13172U (https=)
BY23963C1 (https=)
CN307048801S (https=)
CN307048238S (https=)
CN307047707S (https=)
CN307047509S (https=)
CN307047465S (https=)
CN307046912S (https=)
CN307046679S (https=)
CN307045521S (https=)
CN307045317S (https=)
CN307045068S (https=)
CN307045040S (https=)
BY13166U (https=)
CN307044712S (https=)
BY13167U (https=)
BY13176U (https=)
BY13175U (https=)
BY13174U (https=)
BY13159U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240904

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240904

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250701

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250828

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251030

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20251202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260302