CN118947228A - 布线基板 - Google Patents

布线基板 Download PDF

Info

Publication number
CN118947228A
CN118947228A CN202380028008.6A CN202380028008A CN118947228A CN 118947228 A CN118947228 A CN 118947228A CN 202380028008 A CN202380028008 A CN 202380028008A CN 118947228 A CN118947228 A CN 118947228A
Authority
CN
China
Prior art keywords
conductor layer
silica particles
conductor
layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380028008.6A
Other languages
English (en)
Chinese (zh)
Inventor
佐野裕明
东登志文
井本晃
山口贵史
山元泉太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118947228A publication Critical patent/CN118947228A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202380028008.6A 2022-03-30 2023-03-13 布线基板 Pending CN118947228A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-056142 2022-03-30
JP2022056142 2022-03-30
PCT/JP2023/009735 WO2023189513A1 (ja) 2022-03-30 2023-03-13 配線基板

Publications (1)

Publication Number Publication Date
CN118947228A true CN118947228A (zh) 2024-11-12

Family

ID=88200946

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380028008.6A Pending CN118947228A (zh) 2022-03-30 2023-03-13 布线基板

Country Status (5)

Country Link
US (1) US20250185162A1 (https=)
EP (1) EP4503867A1 (https=)
JP (1) JPWO2023189513A1 (https=)
CN (1) CN118947228A (https=)
WO (1) WO2023189513A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197110B2 (ja) * 2001-08-07 2008-12-17 三井金属鉱業株式会社 混合銅粉、その混合銅粉の製造方法、その混合銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004006624A (ja) * 2002-03-27 2004-01-08 Kyocera Corp 配線基板及びその製造方法
JP4528502B2 (ja) * 2002-07-17 2010-08-18 日本特殊陶業株式会社 配線基板
JP4703212B2 (ja) * 2005-02-21 2011-06-15 京セラ株式会社 配線基板及びその製造方法
JP4781189B2 (ja) * 2006-07-27 2011-09-28 京セラ株式会社 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
JP6129738B2 (ja) * 2011-07-14 2017-05-17 株式会社東芝 セラミックス回路基板
JP6337909B2 (ja) * 2014-02-04 2018-06-06 株式会社村田製作所 電子部品モジュールの製造方法
JP6260731B1 (ja) * 2017-02-15 2018-01-17 Tdk株式会社 ガラスセラミックス焼結体およびコイル電子部品

Also Published As

Publication number Publication date
EP4503867A1 (en) 2025-02-05
US20250185162A1 (en) 2025-06-05
JPWO2023189513A1 (https=) 2023-10-05
WO2023189513A1 (ja) 2023-10-05

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