JP2025111734A5 - - Google Patents

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Publication number
JP2025111734A5
JP2025111734A5 JP2025075422A JP2025075422A JP2025111734A5 JP 2025111734 A5 JP2025111734 A5 JP 2025111734A5 JP 2025075422 A JP2025075422 A JP 2025075422A JP 2025075422 A JP2025075422 A JP 2025075422A JP 2025111734 A5 JP2025111734 A5 JP 2025111734A5
Authority
JP
Japan
Prior art keywords
hole
metal layer
electrode substrate
substrate according
distances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2025075422A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025111734A (ja
Filing date
Publication date
Priority claimed from JP2022093190A external-priority patent/JP7239045B2/ja
Priority claimed from JP2023031648A external-priority patent/JP7677362B2/ja
Application filed filed Critical
Priority to JP2025075422A priority Critical patent/JP2025111734A/ja
Publication of JP2025111734A publication Critical patent/JP2025111734A/ja
Publication of JP2025111734A5 publication Critical patent/JP2025111734A5/ja
Withdrawn legal-status Critical Current

Links

JP2025075422A 2022-06-08 2025-04-30 貫通電極基板および半導体装置 Withdrawn JP2025111734A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025075422A JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022093190A JP7239045B2 (ja) 2020-12-02 2022-06-08 貫通電極基板および半導体装置
JP2023031648A JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置
JP2025075422A JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2023031648A Division JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置

Publications (2)

Publication Number Publication Date
JP2025111734A JP2025111734A (ja) 2025-07-30
JP2025111734A5 true JP2025111734A5 (https=) 2025-08-26

Family

ID=83150996

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023031648A Active JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置
JP2025075422A Withdrawn JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2023031648A Active JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置

Country Status (1)

Country Link
JP (2) JP7677362B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7677362B2 (ja) * 2022-06-08 2025-05-15 大日本印刷株式会社 貫通電極基板および半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154187A (ja) * 1990-10-18 1992-05-27 Mitsubishi Materials Corp スルーホール配線板の構造及びその製造方法
JP2003218518A (ja) * 2002-01-28 2003-07-31 Tokuyama Corp 回路基板の製造方法
JP6056386B2 (ja) * 2012-11-02 2017-01-11 凸版印刷株式会社 貫通電極付き配線基板及びその製造方法
JP2014139963A (ja) * 2013-01-21 2014-07-31 Ngk Spark Plug Co Ltd ガラス基板の製造方法
JP6250309B2 (ja) * 2013-06-14 2017-12-20 日本特殊陶業株式会社 多層配線基板の製造方法
US9517963B2 (en) * 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP6273873B2 (ja) * 2014-02-04 2018-02-07 大日本印刷株式会社 ガラスインターポーザー基板の製造方法
JP7610400B2 (ja) * 2020-12-11 2025-01-08 日本放送協会 配信サーバ、受信装置、動画配信システム、及びプログラム
JP7677362B2 (ja) * 2022-06-08 2025-05-15 大日本印刷株式会社 貫通電極基板および半導体装置

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