JPWO2023228888A5 - - Google Patents
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- Publication number
- JPWO2023228888A5 JPWO2023228888A5 JP2024523093A JP2024523093A JPWO2023228888A5 JP WO2023228888 A5 JPWO2023228888 A5 JP WO2023228888A5 JP 2024523093 A JP2024523093 A JP 2024523093A JP 2024523093 A JP2024523093 A JP 2024523093A JP WO2023228888 A5 JPWO2023228888 A5 JP WO2023228888A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- component according
- silica particles
- circuit component
- metal phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022086676 | 2022-05-27 | ||
| PCT/JP2023/018838 WO2023228888A1 (ja) | 2022-05-27 | 2023-05-19 | 回路部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228888A1 JPWO2023228888A1 (https=) | 2023-11-30 |
| JPWO2023228888A5 true JPWO2023228888A5 (https=) | 2025-01-21 |
Family
ID=88919290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523093A Pending JPWO2023228888A1 (https=) | 2022-05-27 | 2023-05-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250338399A1 (https=) |
| EP (1) | EP4535931A1 (https=) |
| JP (1) | JPWO2023228888A1 (https=) |
| CN (1) | CN119174287A (https=) |
| WO (1) | WO2023228888A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811696B2 (ja) * | 1993-04-22 | 1996-02-07 | 日本電気株式会社 | 多層ガラスセラミック基板とその製造方法 |
| JP2001044633A (ja) * | 1999-07-30 | 2001-02-16 | Hitachi Ltd | セラミック回路基板 |
| JP2003277852A (ja) | 2002-03-25 | 2003-10-02 | Kyocera Corp | 銅メタライズ組成物およびセラミック配線基板 |
| JP4528502B2 (ja) * | 2002-07-17 | 2010-08-18 | 日本特殊陶業株式会社 | 配線基板 |
| JP4466863B2 (ja) * | 2005-09-16 | 2010-05-26 | Ｔｄｋ株式会社 | 多層セラミックス基板 |
-
2023
- 2023-05-19 JP JP2024523093A patent/JPWO2023228888A1/ja active Pending
- 2023-05-19 EP EP23811760.0A patent/EP4535931A1/en active Pending
- 2023-05-19 US US18/867,233 patent/US20250338399A1/en active Pending
- 2023-05-19 WO PCT/JP2023/018838 patent/WO2023228888A1/ja not_active Ceased
- 2023-05-19 CN CN202380039927.3A patent/CN119174287A/zh active Pending
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