JP2024109649A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2024109649A5 JP2024109649A5 JP2024076144A JP2024076144A JP2024109649A5 JP 2024109649 A5 JP2024109649 A5 JP 2024109649A5 JP 2024076144 A JP2024076144 A JP 2024076144A JP 2024076144 A JP2024076144 A JP 2024076144A JP 2024109649 A5 JP2024109649 A5 JP 2024109649A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- conductive film
- transparent conductive
- layer
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862760376P | 2018-11-13 | 2018-11-13 | |
| US62/760,376 | 2018-11-13 | ||
| PCT/US2019/061231 WO2020102392A1 (en) | 2018-11-13 | 2019-11-13 | Transparent conductive circuit |
| JP2021538149A JP7568296B2 (ja) | 2018-11-13 | 2019-11-13 | 透明導電回路 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021538149A Division JP7568296B2 (ja) | 2018-11-13 | 2019-11-13 | 透明導電回路 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024109649A JP2024109649A (ja) | 2024-08-14 |
| JP2024109649A5 true JP2024109649A5 (https=) | 2024-11-08 |
| JP7840069B2 JP7840069B2 (ja) | 2026-04-03 |
Family
ID=70731727
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021538149A Active JP7568296B2 (ja) | 2018-11-13 | 2019-11-13 | 透明導電回路 |
| JP2023178478A Active JP7659243B2 (ja) | 2018-11-13 | 2023-10-16 | 透明導電回路 |
| JP2024076144A Active JP7840069B2 (ja) | 2018-11-13 | 2024-05-08 | 透明導電回路 |
| JP2025042501A Pending JP2025089334A (ja) | 2018-11-13 | 2025-03-17 | 透明導電回路 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021538149A Active JP7568296B2 (ja) | 2018-11-13 | 2019-11-13 | 透明導電回路 |
| JP2023178478A Active JP7659243B2 (ja) | 2018-11-13 | 2023-10-16 | 透明導電回路 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025042501A Pending JP2025089334A (ja) | 2018-11-13 | 2025-03-17 | 透明導電回路 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US11943865B2 (https=) |
| EP (1) | EP3880746B1 (https=) |
| JP (4) | JP7568296B2 (https=) |
| KR (2) | KR102746522B1 (https=) |
| CN (2) | CN113272372B (https=) |
| ES (1) | ES3042792T3 (https=) |
| WO (1) | WO2020102392A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230087579A (ko) * | 2020-10-13 | 2023-06-16 | 캐즘 어드밴스드 머티리얼스, 인크. | 경화성 탄소 나노튜브 잉크 및 잉크를 사용하여 생성된 투명 전도성 필름 |
| CN114698254B (zh) * | 2020-12-31 | 2025-01-24 | 天材创新材料科技(厦门)有限公司 | 叠构结构及触控感应器 |
| WO2023214994A2 (en) * | 2021-10-25 | 2023-11-09 | Chasm Advanced Materials, Inc. | Transparent radio frequency antenna and emi shield |
| CN121285467A (zh) | 2023-06-30 | 2026-01-06 | 法国圣戈班安全玻璃公司 | 包括可加热透明膜和用于p偏振辐射的反射层的复合嵌板 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8580128B2 (en) * | 2005-06-20 | 2013-11-12 | Toray Industries, Inc. | Method of manufacturing electromagnetic-wave shielding plate, electromagnetic-wave shielding plate manufactured thereby, and filter display using the same |
| JP2008288102A (ja) * | 2007-05-18 | 2008-11-27 | Fujifilm Corp | 透明導電性フイルム、透明導電性フイルムの製造方法、透明電極フイルム、色素増感太陽電池、エレクトロルミネッセンス素子及び電子ペーパー |
| JP5245113B2 (ja) * | 2007-12-14 | 2013-07-24 | コニカミノルタ株式会社 | 透明補助電極フィルム及び透明補助電極フィルムの製造方法と、透明導電性フィルム及び透明導電性フィルムの製造方法 |
| JP5329802B2 (ja) * | 2007-12-20 | 2013-10-30 | 富士フイルム株式会社 | 導電膜およびその製造方法 |
| JP2010174084A (ja) * | 2009-01-28 | 2010-08-12 | Panasonic Corp | カーボンナノチューブを含有するインク |
| JP2012526724A (ja) * | 2009-05-14 | 2012-11-01 | バテル・メモリアル・インスティテュート | カーボンナノチューブネットワークをコーティングする無溶剤方法及びポリマーをコーティングされたカーボンナノチューブネットワーク |
| US9401490B2 (en) * | 2010-10-29 | 2016-07-26 | Lintec Corporation | Transparent conductive film, electronic device, and method for manufacturing electronic device |
| US20140021400A1 (en) * | 2010-12-15 | 2014-01-23 | Sun Chemical Corporation | Printable etchant compositions for etching silver nanoware-based transparent, conductive film |
| JPWO2012093530A1 (ja) * | 2011-01-06 | 2014-06-09 | リンテック株式会社 | 透明導電性積層体および有機薄膜デバイス |
| JP6212050B2 (ja) * | 2011-12-22 | 2017-10-11 | スリーエム イノベイティブ プロパティズ カンパニー | 高い光透過を備えた導電性物品 |
| JP6289494B2 (ja) * | 2012-12-07 | 2018-03-07 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性物品 |
| CN103325442B (zh) * | 2013-06-27 | 2015-11-11 | 北京印刷学院 | 一种复合透明导电薄膜及其制备方法 |
| US9854670B2 (en) * | 2013-08-22 | 2017-12-26 | Showa Denko K.K. | Transparent electrode and method for producing same |
| US11274223B2 (en) * | 2013-11-22 | 2022-03-15 | C3 Nano, Inc. | Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches |
| JP6397353B2 (ja) * | 2014-02-28 | 2018-09-26 | 国立研究開発法人産業技術総合研究所 | 形状保持性を有するペースト状組成物、それを用いたカーボンナノチューブを含む膜体及び複合材料膜及び３次元構造物 |
| JP2016018713A (ja) | 2014-07-09 | 2016-02-01 | 株式会社クラレ | 導電膜 |
| JP2016062653A (ja) * | 2014-09-12 | 2016-04-25 | 出光興産株式会社 | 表面抵抗が改善された導電体及びその製造方法 |
| US9985344B2 (en) * | 2014-12-23 | 2018-05-29 | Te Connectivity Corporation | Electronic article and process of producing an electronic article |
| US20160212859A1 (en) * | 2015-01-21 | 2016-07-21 | Gil Bellaiche | Printing electronic circuitry |
| JP2016197554A (ja) * | 2015-04-03 | 2016-11-24 | パナソニックＩｐマネジメント株式会社 | 透明配線部材の製造方法及び透明配線部材 |
| EP3286768A4 (en) * | 2015-04-21 | 2019-01-02 | Chasm Technologies, Inc. | Transparent conductive film |
| KR101800656B1 (ko) * | 2016-08-09 | 2017-11-23 | 하이엔드테크놀로지(주) | 포토레지스트 음각패턴 및 표면개질을 이용한 금속메쉬 타입 투명 전도막 제조방법 및 이에 의해 제조되는 투명 전도막 |
| FI20175373A1 (en) * | 2017-04-25 | 2018-10-26 | Canatu Oy | A process for making a laminated film |
| WO2019172851A1 (en) * | 2018-03-08 | 2019-09-12 | Nanyang Technological University | Scalable electrically conductive nanowires bundle-ring-network for deformable transparent conductor |
-
2019
- 2019-11-13 JP JP2021538149A patent/JP7568296B2/ja active Active
- 2019-11-13 EP EP19883368.3A patent/EP3880746B1/en active Active
- 2019-11-13 US US17/424,935 patent/US11943865B2/en active Active
- 2019-11-13 CN CN201980088054.9A patent/CN113272372B/zh active Active
- 2019-11-13 KR KR1020217018212A patent/KR102746522B1/ko active Active
- 2019-11-13 WO PCT/US2019/061231 patent/WO2020102392A1/en not_active Ceased
- 2019-11-13 CN CN202311132868.2A patent/CN117292872A/zh active Pending
- 2019-11-13 ES ES19883368T patent/ES3042792T3/es active Active
- 2019-11-13 KR KR1020247042188A patent/KR20250002842A/ko active Pending
-
2023
- 2023-10-16 JP JP2023178478A patent/JP7659243B2/ja active Active
-
2024
- 2024-03-01 US US18/592,813 patent/US12432853B2/en active Active
- 2024-05-08 JP JP2024076144A patent/JP7840069B2/ja active Active
-
2025
- 2025-03-17 JP JP2025042501A patent/JP2025089334A/ja active Pending
- 2025-09-08 US US19/322,013 patent/US20260059660A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2024109649A5 (https=) | ||
| TWI689853B (zh) | 觸控面板及其製備方法 | |
| TWI594168B (zh) | 電容觸摸屏及其製備方法 | |
| US10236398B2 (en) | Method for manufacturing transparent electrode | |
| JP7659243B2 (ja) | 透明導電回路 | |
| CN111862886A (zh) | 驱动基板及其制作方法和显示装置 | |
| JP2010206062A5 (https=) | ||
| JPWO2022190825A5 (https=) | ||
| CN113728732A (zh) | 从两侧铣削具有两个导电层的柔性箔 | |
| TWI690834B (zh) | 觸控面板及觸控面板之生產方法 | |
| JPH0247869B2 (https=) | ||
| CN114096054B (zh) | 柔性线路板组件及其制作方法、显示装置 | |
| HK40105159A (zh) | 透明导电电路 | |
| JP4285751B2 (ja) | 配線基板、及びその製造方法 | |
| KR101718944B1 (ko) | 금속 메쉬 구조를 갖는 투명 전극 제조 방법 및 이를 이용하여 제조된 투명 전극 | |
| JP2022108459A5 (https=) | ||
| JPWO2021177375A5 (https=) | ||
| CN111857414A (zh) | 电容触控屏 | |
| TWI419033B (zh) | Method for manufacturing two - layer circuit board structure for capacitive touch panel | |
| TW202227947A (zh) | 疊構結構及觸控感應器 | |
| JPS58147097A (ja) | 多層配線板の製造方法 | |
| JPS5812308A (ja) | 厚膜抵抗回路基板の製造方法 | |
| JPS6086895A (ja) | 多層セラミツク基板 | |
| JPH043991A (ja) | 厚膜集積回路の配線導体の形成方法 | |
| TW200423156A (en) | Resistive material |