CN113272372B - 透明导电电路 - Google Patents

透明导电电路 Download PDF

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Publication number
CN113272372B
CN113272372B CN201980088054.9A CN201980088054A CN113272372B CN 113272372 B CN113272372 B CN 113272372B CN 201980088054 A CN201980088054 A CN 201980088054A CN 113272372 B CN113272372 B CN 113272372B
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China
Prior art keywords
layer
tcf
metal
metal mesh
cnt
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CN201980088054.9A
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English (en)
Chinese (zh)
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CN113272372A (zh
Inventor
R.P.赫罗克斯
T.A.特纳
D.J.亚瑟
S.P.亚瑟
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Canyon Advanced Materials Co ltd
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Canyon Advanced Materials Co ltd
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Priority to CN202311132868.2A priority Critical patent/CN117292872A/zh
Publication of CN113272372A publication Critical patent/CN113272372A/zh
Application granted granted Critical
Publication of CN113272372B publication Critical patent/CN113272372B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/40—Alkaline compositions for etching other metallic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN201980088054.9A 2018-11-13 2019-11-13 透明导电电路 Active CN113272372B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311132868.2A CN117292872A (zh) 2018-11-13 2019-11-13 透明导电电路

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862760376P 2018-11-13 2018-11-13
US62/760,376 2018-11-13
PCT/US2019/061231 WO2020102392A1 (en) 2018-11-13 2019-11-13 Transparent conductive circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202311132868.2A Division CN117292872A (zh) 2018-11-13 2019-11-13 透明导电电路

Publications (2)

Publication Number Publication Date
CN113272372A CN113272372A (zh) 2021-08-17
CN113272372B true CN113272372B (zh) 2023-09-22

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201980088054.9A Active CN113272372B (zh) 2018-11-13 2019-11-13 透明导电电路
CN202311132868.2A Pending CN117292872A (zh) 2018-11-13 2019-11-13 透明导电电路

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202311132868.2A Pending CN117292872A (zh) 2018-11-13 2019-11-13 透明导电电路

Country Status (7)

Country Link
US (3) US11943865B2 (https=)
EP (1) EP3880746B1 (https=)
JP (4) JP7568296B2 (https=)
KR (2) KR102746522B1 (https=)
CN (2) CN113272372B (https=)
ES (1) ES3042792T3 (https=)
WO (1) WO2020102392A1 (https=)

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KR20230087579A (ko) * 2020-10-13 2023-06-16 캐즘 어드밴스드 머티리얼스, 인크. 경화성 탄소 나노튜브 잉크 및 잉크를 사용하여 생성된 투명 전도성 필름
CN114698254B (zh) * 2020-12-31 2025-01-24 天材创新材料科技(厦门)有限公司 叠构结构及触控感应器
WO2023214994A2 (en) * 2021-10-25 2023-11-09 Chasm Advanced Materials, Inc. Transparent radio frequency antenna and emi shield
CN121285467A (zh) 2023-06-30 2026-01-06 法国圣戈班安全玻璃公司 包括可加热透明膜和用于p偏振辐射的反射层的复合嵌板

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JP2009152072A (ja) * 2007-12-20 2009-07-09 Fujifilm Corp 導電膜およびその製造方法
CN103325442A (zh) * 2013-06-27 2013-09-25 北京印刷学院 一种复合透明导电薄膜及其制备方法
CN105874889A (zh) * 2013-11-22 2016-08-17 C3奈米有限公司 以金属纳米线为基底的透明导电涂层
WO2018030712A1 (ko) * 2016-08-09 2018-02-15 하이엔드테크놀로지(주) 포토레지스트 음각패턴 및 표면개질을 이용한 금속메쉬 타입 투명 전도막 제조방법 및 이에 의해 제조되는 투명 전도막

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CN101189930A (zh) * 2005-06-20 2008-05-28 东丽株式会社 电磁波屏蔽板的制造方法、由该方法制造的电磁波屏蔽板及使用该电磁波屏蔽板的滤波器和显示器
JP2009152072A (ja) * 2007-12-20 2009-07-09 Fujifilm Corp 導電膜およびその製造方法
CN103325442A (zh) * 2013-06-27 2013-09-25 北京印刷学院 一种复合透明导电薄膜及其制备方法
CN105874889A (zh) * 2013-11-22 2016-08-17 C3奈米有限公司 以金属纳米线为基底的透明导电涂层
WO2018030712A1 (ko) * 2016-08-09 2018-02-15 하이엔드테크놀로지(주) 포토레지스트 음각패턴 및 표면개질을 이용한 금속메쉬 타입 투명 전도막 제조방법 및 이에 의해 제조되는 투명 전도막

Also Published As

Publication number Publication date
US20240276638A1 (en) 2024-08-15
EP3880746B1 (en) 2025-10-01
JP2025089334A (ja) 2025-06-12
EP3880746C0 (en) 2025-10-01
US11943865B2 (en) 2024-03-26
EP3880746A4 (en) 2022-09-14
JP7840069B2 (ja) 2026-04-03
US20220095452A1 (en) 2022-03-24
JP2024109649A (ja) 2024-08-14
JP7568296B2 (ja) 2024-10-16
KR20210105352A (ko) 2021-08-26
EP3880746A1 (en) 2021-09-22
KR102746522B1 (ko) 2024-12-24
JP2022522599A (ja) 2022-04-20
US20260059660A1 (en) 2026-02-26
ES3042792T3 (en) 2025-11-24
CN117292872A (zh) 2023-12-26
CN113272372A (zh) 2021-08-17
JP2024009982A (ja) 2024-01-23
JP7659243B2 (ja) 2025-04-09
KR20250002842A (ko) 2025-01-07
US12432853B2 (en) 2025-09-30
WO2020102392A1 (en) 2020-05-22

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