JP2001244267A5 - - Google Patents
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- Publication number
- JP2001244267A5 JP2001244267A5 JP2000377279A JP2000377279A JP2001244267A5 JP 2001244267 A5 JP2001244267 A5 JP 2001244267A5 JP 2000377279 A JP2000377279 A JP 2000377279A JP 2000377279 A JP2000377279 A JP 2000377279A JP 2001244267 A5 JP2001244267 A5 JP 2001244267A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- wiring
- insulating film
- distance
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 43
- 239000000758 substrate Substances 0.000 claims 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000377279A JP4058234B2 (ja) | 1999-12-22 | 2000-12-12 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-364199 | 1999-12-22 | ||
| JP36419999 | 1999-12-22 | ||
| JP2000377279A JP4058234B2 (ja) | 1999-12-22 | 2000-12-12 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001244267A JP2001244267A (ja) | 2001-09-07 |
| JP2001244267A5 true JP2001244267A5 (https=) | 2004-11-25 |
| JP4058234B2 JP4058234B2 (ja) | 2008-03-05 |
Family
ID=26581550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000377279A Expired - Fee Related JP4058234B2 (ja) | 1999-12-22 | 2000-12-12 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4058234B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243538A (ja) * | 2002-02-12 | 2003-08-29 | Hitachi Ltd | 半導体集積回路装置 |
| JP2005072573A (ja) * | 2003-08-05 | 2005-03-17 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに半導体装置及びその作製方法 |
| JP5089850B2 (ja) * | 2003-11-25 | 2012-12-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4535845B2 (ja) | 2004-10-29 | 2010-09-01 | 富士通セミコンダクター株式会社 | 半導体装置 |
| US7936072B2 (en) * | 2007-11-12 | 2011-05-03 | Renesas Electronics Corporation | Semiconductor device having dual damascene structure |
| KR102312250B1 (ko) | 2014-06-16 | 2021-10-14 | 인텔 코포레이션 | 양측 상에 클록 게이팅된 전력 및 신호 라우팅을 아래에 가지는 금속 |
| JP6741933B2 (ja) * | 2015-10-02 | 2020-08-19 | ミツミ電機株式会社 | 光走査モジュール、光走査制御装置 |
-
2000
- 2000-12-12 JP JP2000377279A patent/JP4058234B2/ja not_active Expired - Fee Related
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