JPWO2023189338A5 - - Google Patents

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Publication number
JPWO2023189338A5
JPWO2023189338A5 JP2024511625A JP2024511625A JPWO2023189338A5 JP WO2023189338 A5 JPWO2023189338 A5 JP WO2023189338A5 JP 2024511625 A JP2024511625 A JP 2024511625A JP 2024511625 A JP2024511625 A JP 2024511625A JP WO2023189338 A5 JPWO2023189338 A5 JP WO2023189338A5
Authority
JP
Japan
Prior art keywords
crystallites
wiring board
board according
layer
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511625A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189338A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008933 external-priority patent/WO2023189338A1/ja
Publication of JPWO2023189338A1 publication Critical patent/JPWO2023189338A1/ja
Publication of JPWO2023189338A5 publication Critical patent/JPWO2023189338A5/ja
Pending legal-status Critical Current

Links

JP2024511625A 2022-03-30 2023-03-08 Pending JPWO2023189338A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022057452 2022-03-30
PCT/JP2023/008933 WO2023189338A1 (ja) 2022-03-30 2023-03-08 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023189338A1 JPWO2023189338A1 (https=) 2023-10-05
JPWO2023189338A5 true JPWO2023189338A5 (https=) 2024-11-19

Family

ID=88200653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511625A Pending JPWO2023189338A1 (https=) 2022-03-30 2023-03-08

Country Status (5)

Country Link
US (1) US12598700B2 (https=)
EP (1) EP4503869A1 (https=)
JP (1) JPWO2023189338A1 (https=)
CN (1) CN118891962A (https=)
WO (1) WO2023189338A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025142611A1 (ja) * 2023-12-26 2025-07-03 京セラ株式会社 配線基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4535575B2 (ja) * 2000-07-31 2010-09-01 京セラ株式会社 窒化珪素質多層配線基板
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP4528502B2 (ja) * 2002-07-17 2010-08-18 日本特殊陶業株式会社 配線基板
JP4544838B2 (ja) * 2002-07-17 2010-09-15 日本特殊陶業株式会社 ビア導体用銅ペーストとそれを用いたセラミック配線基板
JP4781189B2 (ja) * 2006-07-27 2011-09-28 京セラ株式会社 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
JP6337909B2 (ja) * 2014-02-04 2018-06-06 株式会社村田製作所 電子部品モジュールの製造方法

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