JPWO2023189338A5 - - Google Patents
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- Publication number
- JPWO2023189338A5 JPWO2023189338A5 JP2024511625A JP2024511625A JPWO2023189338A5 JP WO2023189338 A5 JPWO2023189338 A5 JP WO2023189338A5 JP 2024511625 A JP2024511625 A JP 2024511625A JP 2024511625 A JP2024511625 A JP 2024511625A JP WO2023189338 A5 JPWO2023189338 A5 JP WO2023189338A5
- Authority
- JP
- Japan
- Prior art keywords
- crystallites
- wiring board
- board according
- layer
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022057452 | 2022-03-30 | ||
| PCT/JP2023/008933 WO2023189338A1 (ja) | 2022-03-30 | 2023-03-08 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189338A1 JPWO2023189338A1 (https=) | 2023-10-05 |
| JPWO2023189338A5 true JPWO2023189338A5 (https=) | 2024-11-19 |
Family
ID=88200653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511625A Pending JPWO2023189338A1 (https=) | 2022-03-30 | 2023-03-08 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12598700B2 (https=) |
| EP (1) | EP4503869A1 (https=) |
| JP (1) | JPWO2023189338A1 (https=) |
| CN (1) | CN118891962A (https=) |
| WO (1) | WO2023189338A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025142611A1 (ja) * | 2023-12-26 | 2025-07-03 | 京セラ株式会社 | 配線基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4535575B2 (ja) * | 2000-07-31 | 2010-09-01 | 京セラ株式会社 | 窒化珪素質多層配線基板 |
| JP2003277852A (ja) | 2002-03-25 | 2003-10-02 | Kyocera Corp | 銅メタライズ組成物およびセラミック配線基板 |
| JP4544838B2 (ja) * | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | ビア導体用銅ペーストとそれを用いたセラミック配線基板 |
| JP4528502B2 (ja) * | 2002-07-17 | 2010-08-18 | 日本特殊陶業株式会社 | 配線基板 |
| JP4781189B2 (ja) * | 2006-07-27 | 2011-09-28 | 京セラ株式会社 | 配線基板 |
| JP2008159726A (ja) * | 2006-12-22 | 2008-07-10 | Kyocera Corp | 多層配線基板 |
| EP3104400B1 (en) * | 2014-02-04 | 2022-08-31 | Murata Manufacturing Co., Ltd. | Manufacturing method of electronic component module |
-
2023
- 2023-03-08 EP EP23779365.8A patent/EP4503869A1/en not_active Withdrawn
- 2023-03-08 WO PCT/JP2023/008933 patent/WO2023189338A1/ja not_active Ceased
- 2023-03-08 JP JP2024511625A patent/JPWO2023189338A1/ja active Pending
- 2023-03-08 CN CN202380028279.1A patent/CN118891962A/zh active Pending
- 2023-03-08 US US18/852,918 patent/US12598700B2/en active Active
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