JPWO2023189338A1 - - Google Patents

Info

Publication number
JPWO2023189338A1
JPWO2023189338A1 JP2024511625A JP2024511625A JPWO2023189338A1 JP WO2023189338 A1 JPWO2023189338 A1 JP WO2023189338A1 JP 2024511625 A JP2024511625 A JP 2024511625A JP 2024511625 A JP2024511625 A JP 2024511625A JP WO2023189338 A1 JPWO2023189338 A1 JP WO2023189338A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511625A
Other languages
Japanese (ja)
Other versions
JPWO2023189338A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189338A1 publication Critical patent/JPWO2023189338A1/ja
Publication of JPWO2023189338A5 publication Critical patent/JPWO2023189338A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2024511625A 2022-03-30 2023-03-08 Pending JPWO2023189338A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022057452 2022-03-30
PCT/JP2023/008933 WO2023189338A1 (ja) 2022-03-30 2023-03-08 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023189338A1 true JPWO2023189338A1 (https=) 2023-10-05
JPWO2023189338A5 JPWO2023189338A5 (https=) 2024-11-19

Family

ID=88200653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511625A Pending JPWO2023189338A1 (https=) 2022-03-30 2023-03-08

Country Status (5)

Country Link
US (1) US12598700B2 (https=)
EP (1) EP4503869A1 (https=)
JP (1) JPWO2023189338A1 (https=)
CN (1) CN118891962A (https=)
WO (1) WO2023189338A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025142611A1 (ja) * 2023-12-26 2025-07-03 京セラ株式会社 配線基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043756A (ja) * 2000-07-31 2002-02-08 Kyocera Corp 窒化珪素質多層配線基板
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2008034551A (ja) * 2006-07-27 2008-02-14 Kyocera Corp 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
WO2015118982A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 電子部品モジュール、および電子部品モジュールの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP4544838B2 (ja) * 2002-07-17 2010-09-15 日本特殊陶業株式会社 ビア導体用銅ペーストとそれを用いたセラミック配線基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043756A (ja) * 2000-07-31 2002-02-08 Kyocera Corp 窒化珪素質多層配線基板
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2008034551A (ja) * 2006-07-27 2008-02-14 Kyocera Corp 配線基板
JP2008159726A (ja) * 2006-12-22 2008-07-10 Kyocera Corp 多層配線基板
WO2015118982A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 電子部品モジュール、および電子部品モジュールの製造方法

Also Published As

Publication number Publication date
CN118891962A (zh) 2024-11-01
US12598700B2 (en) 2026-04-07
WO2023189338A1 (ja) 2023-10-05
EP4503869A1 (en) 2025-02-05
US20250220813A1 (en) 2025-07-03

Similar Documents

Publication Publication Date Title
CL2025003369A1 (es) Inhibidores de egfr para el tratamiento de enfermedades
JPWO2023190450A1 (https=)
JPWO2023189338A1 (https=)
CL2026000150A1 (es) Inmunización activa para el tratamiento de la dermatitis atópica
CL2025003708S1 (es) Rampa para maniobras vehiculares.
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BY13176U (https=)
BY13170U (https=)
CN307047082S (https=)
CN307047783S (https=)
CN307045938S (https=)
CN307045763S (https=)
CN307047981S (https=)
CN307045280S (https=)
CN307045271S (https=)
CN307044788S (https=)
CN307044701S (https=)
CN307044396S (https=)
CN307044380S (https=)
CN307048143S (https=)
CN307049655S (https=)
CN307049833S (https=)
BY23963C1 (https=)
BY13165U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240911

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240911

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250701

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250827

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251029

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20251202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260302