JPWO2023054137A5 - - Google Patents
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- Publication number
- JPWO2023054137A5 JPWO2023054137A5 JP2023551394A JP2023551394A JPWO2023054137A5 JP WO2023054137 A5 JPWO2023054137 A5 JP WO2023054137A5 JP 2023551394 A JP2023551394 A JP 2023551394A JP 2023551394 A JP2023551394 A JP 2023551394A JP WO2023054137 A5 JPWO2023054137 A5 JP WO2023054137A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board according
- via conductor
- continuous phase
- crystallites
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159610 | 2021-09-29 | ||
| JP2021159610 | 2021-09-29 | ||
| PCT/JP2022/035265 WO2023054137A1 (ja) | 2021-09-29 | 2022-09-21 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054137A1 JPWO2023054137A1 (https=) | 2023-04-06 |
| JPWO2023054137A5 true JPWO2023054137A5 (https=) | 2024-05-30 |
| JP7678889B2 JP7678889B2 (ja) | 2025-05-16 |
Family
ID=85780678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551394A Active JP7678889B2 (ja) | 2021-09-29 | 2022-09-21 | 配線基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250142724A1 (https=) |
| EP (1) | EP4412410A4 (https=) |
| JP (1) | JP7678889B2 (https=) |
| CN (1) | CN118020391A (https=) |
| WO (1) | WO2023054137A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025068374A (ja) * | 2023-10-16 | 2025-04-28 | 京セラ株式会社 | 配線基板および半導体デバイス |
| WO2026005028A1 (ja) * | 2024-06-28 | 2026-01-02 | 京セラ株式会社 | 支持部材、静電チャック、ヒータおよびプラズマ処理装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4646468B2 (ja) * | 2001-09-25 | 2011-03-09 | 京セラ株式会社 | 貫通導体用組成物 |
| JP2003277852A (ja) | 2002-03-25 | 2003-10-02 | Kyocera Corp | 銅メタライズ組成物およびセラミック配線基板 |
| US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
| JP4807161B2 (ja) * | 2006-06-29 | 2011-11-02 | 株式会社村田製作所 | 積層型セラミック電子部品およびその製造方法 |
| JP4781189B2 (ja) * | 2006-07-27 | 2011-09-28 | 京セラ株式会社 | 配線基板 |
| KR100997989B1 (ko) * | 2008-08-28 | 2010-12-03 | 삼성전기주식회사 | 다층 세라믹 기판 |
| JP6369560B2 (ja) * | 2015-04-17 | 2018-08-08 | 株式会社村田製作所 | セラミック配線基板およびセラミック配線基板の製造方法 |
-
2022
- 2022-09-21 CN CN202280062909.2A patent/CN118020391A/zh active Pending
- 2022-09-21 EP EP22876004.7A patent/EP4412410A4/en active Pending
- 2022-09-21 US US18/689,496 patent/US20250142724A1/en active Pending
- 2022-09-21 WO PCT/JP2022/035265 patent/WO2023054137A1/ja not_active Ceased
- 2022-09-21 JP JP2023551394A patent/JP7678889B2/ja active Active
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