JPWO2023228829A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023228829A5
JPWO2023228829A5 JP2024523069A JP2024523069A JPWO2023228829A5 JP WO2023228829 A5 JPWO2023228829 A5 JP WO2023228829A5 JP 2024523069 A JP2024523069 A JP 2024523069A JP 2024523069 A JP2024523069 A JP 2024523069A JP WO2023228829 A5 JPWO2023228829 A5 JP WO2023228829A5
Authority
JP
Japan
Prior art keywords
ceramic particles
conductor
laminated substrate
substrate according
intermetallic compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024523069A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023228829A1 (https=
JP7786572B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/018375 external-priority patent/WO2023228829A1/ja
Publication of JPWO2023228829A1 publication Critical patent/JPWO2023228829A1/ja
Publication of JPWO2023228829A5 publication Critical patent/JPWO2023228829A5/ja
Application granted granted Critical
Publication of JP7786572B2 publication Critical patent/JP7786572B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024523069A 2022-05-27 2023-05-17 積層基板 Active JP7786572B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022087191 2022-05-27
JP2022087191 2022-05-27
PCT/JP2023/018375 WO2023228829A1 (ja) 2022-05-27 2023-05-17 積層基板

Publications (3)

Publication Number Publication Date
JPWO2023228829A1 JPWO2023228829A1 (https=) 2023-11-30
JPWO2023228829A5 true JPWO2023228829A5 (https=) 2025-01-31
JP7786572B2 JP7786572B2 (ja) 2025-12-16

Family

ID=88919241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523069A Active JP7786572B2 (ja) 2022-05-27 2023-05-17 積層基板

Country Status (4)

Country Link
US (1) US20250089160A1 (https=)
JP (1) JP7786572B2 (https=)
CN (1) CN119156894A (https=)
WO (1) WO2023228829A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) * 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2009188218A (ja) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
JP4854705B2 (ja) * 2008-05-26 2012-01-18 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
JP5947018B2 (ja) * 2011-11-02 2016-07-06 日本特殊陶業株式会社 多層セラミック基板及びその製造方法
WO2017150611A1 (ja) * 2016-03-02 2017-09-08 株式会社村田製作所 モジュール部品、モジュール部品の製造方法、及び多層基板

Similar Documents

Publication Publication Date Title
TW201828792A (zh) 芯基板、多層配線基板、半導體封裝體、半導體模組、覆銅基板及芯基板的製造方法
JP2009027039A5 (https=)
EP3012872A3 (en) Solar cell
WO2003025955A1 (en) Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP2003086737A5 (https=)
MY123421A (en) Multi layer ceramic capacitor
WO2008133285A1 (ja) 膜付き基板、透明導電性膜付き基板および発光素子
JP2020202185A5 (https=)
CN101587872A (zh) 半导体装置、半导体装置安装方法和半导体装置安装结构
EP1581035A3 (en) Multilayer ceramic substrate and its production method
JP2009044154A5 (https=)
JPWO2023228829A5 (https=)
JPWO2024116557A5 (https=)
JP2006253289A5 (https=)
CN204151284U (zh) 导热胶带
US9466425B2 (en) Glass ceramic substrate and method for producing the same
JPWO2021193810A5 (https=)
CN207099547U (zh) 一种金属镀层聚酰亚胺复合薄膜
JPWO2021234875A5 (https=)
CN203057702U (zh) 多层陶瓷电路基板
CN2532661Y (zh) 供封装件固接于印刷电路板的弹性介质体
JPWO2022239717A5 (https=)
JPWO2023234023A5 (https=)
JPS62165350A (ja) 多層配線基板
JPWO2024029149A5 (https=)