JPWO2023228829A5 - - Google Patents

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Publication number
JPWO2023228829A5
JPWO2023228829A5 JP2024523069A JP2024523069A JPWO2023228829A5 JP WO2023228829 A5 JPWO2023228829 A5 JP WO2023228829A5 JP 2024523069 A JP2024523069 A JP 2024523069A JP 2024523069 A JP2024523069 A JP 2024523069A JP WO2023228829 A5 JPWO2023228829 A5 JP WO2023228829A5
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JP
Japan
Prior art keywords
ceramic particles
conductor
laminated substrate
substrate according
intermetallic compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024523069A
Other languages
English (en)
Japanese (ja)
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JPWO2023228829A1 (https=
JP7786572B2 (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/018375 external-priority patent/WO2023228829A1/ja
Publication of JPWO2023228829A1 publication Critical patent/JPWO2023228829A1/ja
Publication of JPWO2023228829A5 publication Critical patent/JPWO2023228829A5/ja
Application granted granted Critical
Publication of JP7786572B2 publication Critical patent/JP7786572B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024523069A 2022-05-27 2023-05-17 積層基板 Active JP7786572B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022087191 2022-05-27
JP2022087191 2022-05-27
PCT/JP2023/018375 WO2023228829A1 (ja) 2022-05-27 2023-05-17 積層基板

Publications (3)

Publication Number Publication Date
JPWO2023228829A1 JPWO2023228829A1 (https=) 2023-11-30
JPWO2023228829A5 true JPWO2023228829A5 (https=) 2025-01-31
JP7786572B2 JP7786572B2 (ja) 2025-12-16

Family

ID=88919241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523069A Active JP7786572B2 (ja) 2022-05-27 2023-05-17 積層基板

Country Status (4)

Country Link
US (1) US20250089160A1 (https=)
JP (1) JP7786572B2 (https=)
CN (1) CN119156894A (https=)
WO (1) WO2023228829A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) * 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2009188218A (ja) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
JP4854705B2 (ja) * 2008-05-26 2012-01-18 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
JP5947018B2 (ja) * 2011-11-02 2016-07-06 日本特殊陶業株式会社 多層セラミック基板及びその製造方法
CN208753094U (zh) * 2016-03-02 2019-04-16 株式会社村田制作所 模块部件以及多层基板

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