JPWO2023228829A1 - - Google Patents

Info

Publication number
JPWO2023228829A1
JPWO2023228829A1 JP2024523069A JP2024523069A JPWO2023228829A1 JP WO2023228829 A1 JPWO2023228829 A1 JP WO2023228829A1 JP 2024523069 A JP2024523069 A JP 2024523069A JP 2024523069 A JP2024523069 A JP 2024523069A JP WO2023228829 A1 JPWO2023228829 A1 JP WO2023228829A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024523069A
Other languages
Japanese (ja)
Other versions
JPWO2023228829A5 (https=
JP7786572B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023228829A1 publication Critical patent/JPWO2023228829A1/ja
Publication of JPWO2023228829A5 publication Critical patent/JPWO2023228829A5/ja
Application granted granted Critical
Publication of JP7786572B2 publication Critical patent/JP7786572B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024523069A 2022-05-27 2023-05-17 積層基板 Active JP7786572B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022087191 2022-05-27
JP2022087191 2022-05-27
PCT/JP2023/018375 WO2023228829A1 (ja) 2022-05-27 2023-05-17 積層基板

Publications (3)

Publication Number Publication Date
JPWO2023228829A1 true JPWO2023228829A1 (https=) 2023-11-30
JPWO2023228829A5 JPWO2023228829A5 (https=) 2025-01-31
JP7786572B2 JP7786572B2 (ja) 2025-12-16

Family

ID=88919241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523069A Active JP7786572B2 (ja) 2022-05-27 2023-05-17 積層基板

Country Status (4)

Country Link
US (1) US20250089160A1 (https=)
JP (1) JP7786572B2 (https=)
CN (1) CN119156894A (https=)
WO (1) WO2023228829A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) * 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2008262916A (ja) * 2008-05-26 2008-10-30 Dowa Electronics Materials Co Ltd 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
JP2009188218A (ja) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
JP2013098421A (ja) * 2011-11-02 2013-05-20 Ngk Spark Plug Co Ltd 多層セラミック基板及びその製造方法
WO2017150611A1 (ja) * 2016-03-02 2017-09-08 株式会社村田製作所 モジュール部品、モジュール部品の製造方法、及び多層基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) * 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2009188218A (ja) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
JP2008262916A (ja) * 2008-05-26 2008-10-30 Dowa Electronics Materials Co Ltd 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
JP2013098421A (ja) * 2011-11-02 2013-05-20 Ngk Spark Plug Co Ltd 多層セラミック基板及びその製造方法
WO2017150611A1 (ja) * 2016-03-02 2017-09-08 株式会社村田製作所 モジュール部品、モジュール部品の製造方法、及び多層基板

Also Published As

Publication number Publication date
US20250089160A1 (en) 2025-03-13
WO2023228829A1 (ja) 2023-11-30
CN119156894A (zh) 2024-12-17
JP7786572B2 (ja) 2025-12-16

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