JP7786572B2 - 積層基板 - Google Patents

積層基板

Info

Publication number
JP7786572B2
JP7786572B2 JP2024523069A JP2024523069A JP7786572B2 JP 7786572 B2 JP7786572 B2 JP 7786572B2 JP 2024523069 A JP2024523069 A JP 2024523069A JP 2024523069 A JP2024523069 A JP 2024523069A JP 7786572 B2 JP7786572 B2 JP 7786572B2
Authority
JP
Japan
Prior art keywords
conductor
intermetallic compound
ceramic particles
ceramic
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024523069A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023228829A5 (https=
JPWO2023228829A1 (https=
Inventor
智樹 山本
一生 山元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023228829A1 publication Critical patent/JPWO2023228829A1/ja
Publication of JPWO2023228829A5 publication Critical patent/JPWO2023228829A5/ja
Application granted granted Critical
Publication of JP7786572B2 publication Critical patent/JP7786572B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024523069A 2022-05-27 2023-05-17 積層基板 Active JP7786572B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022087191 2022-05-27
JP2022087191 2022-05-27
PCT/JP2023/018375 WO2023228829A1 (ja) 2022-05-27 2023-05-17 積層基板

Publications (3)

Publication Number Publication Date
JPWO2023228829A1 JPWO2023228829A1 (https=) 2023-11-30
JPWO2023228829A5 JPWO2023228829A5 (https=) 2025-01-31
JP7786572B2 true JP7786572B2 (ja) 2025-12-16

Family

ID=88919241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523069A Active JP7786572B2 (ja) 2022-05-27 2023-05-17 積層基板

Country Status (4)

Country Link
US (1) US20250089160A1 (https=)
JP (1) JP7786572B2 (https=)
CN (1) CN119156894A (https=)
WO (1) WO2023228829A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2008262916A (ja) 2008-05-26 2008-10-30 Dowa Electronics Materials Co Ltd 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
JP2009188218A (ja) 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
WO2017150611A1 (ja) 2016-03-02 2017-09-08 株式会社村田製作所 モジュール部品、モジュール部品の製造方法、及び多層基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947018B2 (ja) * 2011-11-02 2016-07-06 日本特殊陶業株式会社 多層セラミック基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251782A (ja) 2007-03-30 2008-10-16 Kyocera Corp セラミック配線基板およびその製造方法
JP2009188218A (ja) 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
JP2008262916A (ja) 2008-05-26 2008-10-30 Dowa Electronics Materials Co Ltd 導電ペースト用銀粉及びその銀粉を用いた導電ペースト
WO2017150611A1 (ja) 2016-03-02 2017-09-08 株式会社村田製作所 モジュール部品、モジュール部品の製造方法、及び多層基板

Also Published As

Publication number Publication date
JPWO2023228829A1 (https=) 2023-11-30
US20250089160A1 (en) 2025-03-13
WO2023228829A1 (ja) 2023-11-30
CN119156894A (zh) 2024-12-17

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