JPWO2024029149A5 - - Google Patents

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Publication number
JPWO2024029149A5
JPWO2024029149A5 JP2024538826A JP2024538826A JPWO2024029149A5 JP WO2024029149 A5 JPWO2024029149 A5 JP WO2024029149A5 JP 2024538826 A JP2024538826 A JP 2024538826A JP 2024538826 A JP2024538826 A JP 2024538826A JP WO2024029149 A5 JPWO2024029149 A5 JP WO2024029149A5
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JP
Japan
Prior art keywords
layer
disposed
plating
external electrode
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024538826A
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English (en)
Japanese (ja)
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JP7852721B2 (ja
JPWO2024029149A1 (https=
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Priority claimed from PCT/JP2023/017199 external-priority patent/WO2024029149A1/ja
Publication of JPWO2024029149A1 publication Critical patent/JPWO2024029149A1/ja
Publication of JPWO2024029149A5 publication Critical patent/JPWO2024029149A5/ja
Application granted granted Critical
Publication of JP7852721B2 publication Critical patent/JP7852721B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024538826A 2022-08-02 2023-05-02 積層セラミック電子部品及び積層セラミック電子部品の実装構造 Active JP7852721B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022123316 2022-08-02
JP2022123316 2022-08-02
PCT/JP2023/017199 WO2024029149A1 (ja) 2022-08-02 2023-05-02 積層セラミック電子部品及び積層セラミック電子部品の実装構造

Publications (3)

Publication Number Publication Date
JPWO2024029149A1 JPWO2024029149A1 (https=) 2024-02-08
JPWO2024029149A5 true JPWO2024029149A5 (https=) 2025-02-03
JP7852721B2 JP7852721B2 (ja) 2026-04-28

Family

ID=89849058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024538826A Active JP7852721B2 (ja) 2022-08-02 2023-05-02 積層セラミック電子部品及び積層セラミック電子部品の実装構造

Country Status (4)

Country Link
US (1) US20250157744A1 (https=)
JP (1) JP7852721B2 (https=)
CN (1) CN119604956A (https=)
WO (1) WO2024029149A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737753A (ja) * 1993-07-16 1995-02-07 Matsushita Electric Ind Co Ltd チップ型部品
JP4569784B2 (ja) 2007-12-26 2010-10-27 Ｔｄｋ株式会社 電子部品及びその製造方法
JP5853627B2 (ja) * 2011-11-21 2016-02-09 Tdk株式会社 電子部品
JP2019186412A (ja) * 2018-04-12 2019-10-24 太陽誘電株式会社 積層セラミックコンデンサ、プリント基板及び包装体
JP2020167236A (ja) * 2019-03-28 2020-10-08 株式会社村田製作所 ３端子型積層セラミックコンデンサおよび３端子型積層セラミックコンデンサの製造方法

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