JPWO2023234023A5 - - Google Patents
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- Publication number
- JPWO2023234023A5 JPWO2023234023A5 JP2024524323A JP2024524323A JPWO2023234023A5 JP WO2023234023 A5 JPWO2023234023 A5 JP WO2023234023A5 JP 2024524323 A JP2024524323 A JP 2024524323A JP 2024524323 A JP2024524323 A JP 2024524323A JP WO2023234023 A5 JPWO2023234023 A5 JP WO2023234023A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- main surface
- contact
- protective layer
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022089630 | 2022-06-01 | ||
| PCT/JP2023/018392 WO2023234023A1 (ja) | 2022-06-01 | 2023-05-17 | 積層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023234023A1 JPWO2023234023A1 (https=) | 2023-12-07 |
| JPWO2023234023A5 true JPWO2023234023A5 (https=) | 2025-01-31 |
Family
ID=89026526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024524323A Pending JPWO2023234023A1 (https=) | 2022-06-01 | 2023-05-17 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250087568A1 (https=) |
| JP (1) | JPWO2023234023A1 (https=) |
| CN (1) | CN119156895A (https=) |
| WO (1) | WO2023234023A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100096178A1 (en) * | 2008-10-17 | 2010-04-22 | Sumsung Electro-Mechanics Co., Ltd. | Non-shirinkage ceramic substrate and manufacturing method thereof |
| JP5593625B2 (ja) * | 2009-03-30 | 2014-09-24 | 株式会社村田製作所 | 多層配線基板の製造方法 |
| JP6105316B2 (ja) * | 2013-02-19 | 2017-03-29 | 京セラ株式会社 | 電子装置 |
| WO2017150611A1 (ja) * | 2016-03-02 | 2017-09-08 | 株式会社村田製作所 | モジュール部品、モジュール部品の製造方法、及び多層基板 |
| CN211321678U (zh) * | 2017-06-26 | 2020-08-21 | 株式会社村田制作所 | 多层布线基板 |
| US12245366B2 (en) * | 2019-10-30 | 2025-03-04 | Kyocera Corporation | Wiring board |
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2023
- 2023-05-17 CN CN202380038558.6A patent/CN119156895A/zh active Pending
- 2023-05-17 WO PCT/JP2023/018392 patent/WO2023234023A1/ja not_active Ceased
- 2023-05-17 JP JP2024524323A patent/JPWO2023234023A1/ja active Pending
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2024
- 2024-11-26 US US18/960,244 patent/US20250087568A1/en active Pending