JPWO2023171394A5 - - Google Patents
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- Publication number
- JPWO2023171394A5 JPWO2023171394A5 JP2024506054A JP2024506054A JPWO2023171394A5 JP WO2023171394 A5 JPWO2023171394 A5 JP WO2023171394A5 JP 2024506054 A JP2024506054 A JP 2024506054A JP 2024506054 A JP2024506054 A JP 2024506054A JP WO2023171394 A5 JPWO2023171394 A5 JP WO2023171394A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- electronic component
- layer covering
- ceramic body
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022037424 | 2022-03-10 | ||
| JP2022037424 | 2022-03-10 | ||
| PCT/JP2023/006550 WO2023171394A1 (ja) | 2022-03-10 | 2023-02-22 | 電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023171394A1 JPWO2023171394A1 (https=) | 2023-09-14 |
| JPWO2023171394A5 true JPWO2023171394A5 (https=) | 2024-07-17 |
| JP7619521B2 JP7619521B2 (ja) | 2025-01-22 |
Family
ID=87934971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024506054A Active JP7619521B2 (ja) | 2022-03-10 | 2023-02-22 | 電子部品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240428995A1 (https=) |
| JP (1) | JP7619521B2 (https=) |
| KR (1) | KR102930444B1 (https=) |
| CN (1) | CN118805231A (https=) |
| WO (1) | WO2023171394A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4957394B2 (ja) * | 2007-06-04 | 2012-06-20 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
| JP2012069912A (ja) | 2010-08-27 | 2012-04-05 | Tdk Corp | 電子部品の製造方法及び電子部品 |
| JP2015111655A (ja) * | 2013-10-29 | 2015-06-18 | 株式会社村田製作所 | セラミック電子部品 |
| JP6060945B2 (ja) | 2014-07-28 | 2017-01-18 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
| JP7131897B2 (ja) * | 2017-09-27 | 2022-09-06 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
| JP2019149410A (ja) * | 2018-02-26 | 2019-09-05 | 京セラ株式会社 | 電子部品 |
| JP7415801B2 (ja) * | 2020-05-29 | 2024-01-17 | 株式会社村田製作所 | 積層セラミックコンデンサ |
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2023
- 2023-02-22 KR KR1020247030450A patent/KR102930444B1/ko active Active
- 2023-02-22 WO PCT/JP2023/006550 patent/WO2023171394A1/ja not_active Ceased
- 2023-02-22 CN CN202380024390.3A patent/CN118805231A/zh active Pending
- 2023-02-22 JP JP2024506054A patent/JP7619521B2/ja active Active
-
2024
- 2024-09-09 US US18/828,159 patent/US20240428995A1/en active Pending