JPWO2023189109A5 - - Google Patents

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Publication number
JPWO2023189109A5
JPWO2023189109A5 JP2024511511A JP2024511511A JPWO2023189109A5 JP WO2023189109 A5 JPWO2023189109 A5 JP WO2023189109A5 JP 2024511511 A JP2024511511 A JP 2024511511A JP 2024511511 A JP2024511511 A JP 2024511511A JP WO2023189109 A5 JPWO2023189109 A5 JP WO2023189109A5
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JP
Japan
Prior art keywords
layer
insulating layer
electronic component
resistive
component according
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511511A
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English (en)
Japanese (ja)
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JPWO2023189109A1 (https=
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Priority claimed from PCT/JP2023/007288 external-priority patent/WO2023189109A1/ja
Publication of JPWO2023189109A1 publication Critical patent/JPWO2023189109A1/ja
Publication of JPWO2023189109A5 publication Critical patent/JPWO2023189109A5/ja
Pending legal-status Critical Current

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JP2024511511A 2022-03-28 2023-02-28 Pending JPWO2023189109A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022052630 2022-03-28
PCT/JP2023/007288 WO2023189109A1 (ja) 2022-03-28 2023-02-28 電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023189109A1 JPWO2023189109A1 (https=) 2023-10-05
JPWO2023189109A5 true JPWO2023189109A5 (https=) 2024-12-10

Family

ID=88200602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511511A Pending JPWO2023189109A1 (https=) 2022-03-28 2023-02-28

Country Status (3)

Country Link
US (1) US20250014992A1 (https=)
JP (1) JPWO2023189109A1 (https=)
WO (1) WO2023189109A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206435B2 (ja) * 1996-07-02 2001-09-10 株式会社デンソー 半導体装置およびその製造方法
JP3374680B2 (ja) * 1996-11-06 2003-02-10 株式会社デンソー 半導体装置の製造方法
JP7232679B2 (ja) * 2019-03-20 2023-03-03 ローム株式会社 電子部品

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